本文使用13.56MHz射頻電漿，對球狀柵極陣列封裝體(BGA)基板作連線銲接前之清洗。首先以X射線能量散佈分析儀(Energy Dispersive X-ray Spectrometer,EDS)及歐傑電子能譜儀(Auger Electron Spectrometer, AES) ，分析銲墊表面污染程度，定義本研究進料品質之定性指標以作為電漿清洗時製程氣體選用之參考。
依工廠的經驗，經電漿清洗之球狀柵極陣列封裝體基板，防焊綠漆上的水滴接觸角在17度~33度可改善金線銲接強度，及增加防焊綠漆/封膠樹脂之黏著強度；本文取其中間值25度，作為田口實驗之望目特性，進行最佳化清洗步驟。本文再以金線拉引及球部抗切測試之評估結果，佐證電漿清洗對金線銲接之影響。因污染物是隨機分佈在封裝體各銲墊上，造成各處之銲接強度有差異性，本文以統計比較法對銲接強度之測試數據分析後發現，電漿處理過的球狀柵極陣列封裝體，其防焊綠漆上的水滴接觸角在25度時，金墊表面金含量由85.9%提昇至96.6%，以金線拉引測試，其破壞模式沒有第二接合點的手指脫現象，同時強度值在統計上可提高約16.4%及減少變異量，但對鋁墊而言，其鋁含量由43.8%提昇至47%，對球部抗切測試，其破壞模式仍繼續保持在金球與鋁墊界面之ball shear，對強度值提昇在統計上不明顯。

Abstract
This paper is research in the strength Improvement of golden wire bonding in BGA by the13.56 MHz RF plasma cleaning. First, EDX and AES are used to identify the surface contamination condition of wire bond pad. Define the material quality as this experiment qualitative index and decide the process gas selectively of plasma clean parameters.
According to the factory’s experience, when the water contact angle on the solder mask surface is 17~33 degree can improve the bondability of golden wire bonding, and enhance the adhesion strength of solder mask/molding compound. The optimized plasma cleaning process parameters are obtained by surface contact angle measurements. This experimentation regards the average value 25 degree as nominal –the-best characteristics of Taguchi experiments. In addition to the comparison of ball shear and wire pull tests are performed to evaluate the effects of plasma cleaning .Due the contamination is random distribute on the bond pads surface cause the bonding strength come into being variation.
The experiment results also demonstrate that the optimized plasma cleaning process would enhance gold content percentage is from 85.9% raised to 96.6% of second bond pad surface .The failure mode is not at the finger lift situation due to wire pull test, moreover the wire pull strength advance 16.4% and reduce the variation according to statistics analysis. However the aluminum content percentage is from 43.8% raised to 47% of first bond pad surface .The failure mode still at the ball shear due to ball shear test. The strength enhance is not obvious of ball shear test according to statistics analysis.

1. 謝嘉民，“低介電常數材料FLARE™2.0熱穩定性及基本特性之研究”，中文半導體技術雜誌，4~5月號，第51-56頁，2000年。
2. Harman, G. G., Wire Bonding in Microelectronics Materials, Processes, Reliability and Yield, McGraw-Hill, pp.67-199, 1997.
3. Lee, C. et al., ”Plasma Cleaning of Plastic Ball Grid Array Package”, Microelectronics Reliability 39, pp.97-105, 1999.
4. Schneuwly, A. et al., ”Influence of Surface Contamination on Metal/Metal Bond Contact Quality ”, Journal of Electronic Materials, Vol.27, No.8, pp.990-997, 1998.
5. Fairfield, C., ”Optimization of Ion and Electron Properties in IC Packaging Applications”, Technical Report, March Instruments, 2000.
6. Wood, L., Fairfield, C., and Wang, K., ”Plasma Cleaning of Chip Scale Packages for Improvement of Wire Bond Strength”, International Symposium on Electronic Materials and Packaging, pp.406-408, 2000.
7. Nowful, J. M., Lok, S. C., and Lee, S. -W., ”Effect of Plasma Cleaning on the Reliability of Wire Bonding”, International Symposium on Electronic Materials and Packaging, pp.39-43, 2001.
8. Yang, L., Bernstein, J. B., and Leong, K. C., ”Effect of the Plasma Cleaning Process on Plastic Ball Grid Array Package Assembly Reliability “, IEEE Transaction on Electronics Packaging Manufacturing, Vol.25, No.2, pp.91-99, 2002.
9. 孫清華編譯，半導體製造裝置用語辭典，全華科技圖書有限公司， 1999。
10. 莊達人，VLSI 製造技術，第550~551頁，高立圖書有限公司，1995。
11. 邱顯光、洪啟超、林鴻志，”半導體電漿蝕刻設備介紹”，電子月刊，第四卷，第九期，第99~106頁，1998。
12. Shul, R. J., ”Comparison of Dry Etch Techniques for GaN” , Electronics Letters,Vol.32, No.15, pp.1408~1409,1996.
13. 洪昭南，“電漿反應器”，化工技術，第三卷，第三期，第124~135頁，1995。
14. Woodward, R. P., “FTÅ200 Measurement Capabilities”, Technical Information First Ten Ångstroms Corp., 2000.
15. “李輝煌，田口方法品質設計的原理與實務，高立圖書有限公司， 2000。
16. Lipson, C., and Sheth, N. J., Statistical Design and Analysis of Engineering Experiments, McGraw-Hill,1973.
17. Lau,J.H., Chip on board technologies for multichip modules, Van Nostrand Reinhold, pp.127,1994.
18. 賴耿陽，產品壽命管測技術，復漢出版社，第50-52頁，1987。
19. Kapur, K. C., and Lamberson, L. R., Reliability in Engineering Design, John Wiley & Son,pp.293,1977.
20. Rao, S. S., Reliability-Based Design, McGraw-Hill, pp.74,1992.