為了以共平面方式製作探針基座線路，在本文中，我們利用傳輸線的三大基本結構：微條傳輸線、嵌入式微帶線、以及對稱式帶狀線作為探討，以聚亞醯胺(polyimide)及矽作為介電材料，在良好的傳輸特性前提下，找出最小的規格及適用的結構。結果中我們得知，在同等傳輸效果下，在嵌入式微帶線結構中可以將傳輸線寬度下降至12μm，以各線間距30μm， 在50mm×50mm的探針基座而言，任一邊可以容納1190個探針線路外接點，另外對多條平行傳輸線而言，訊號以對稱方式輸入可以將減小串音問題，因此若是採用U行傳輸線結構也可達到同等效果，並可將線間距縮小至20μm以下，若是加上微條傳輸線及嵌入式微帶線組合成的雙層傳輸結構，更可以增加傳輸線數目。在本文主要針對矽基板及polyimide介電材料作為討論，對於其他介電材料亦可以用同樣方式進行探討，依所要求的規格，傳輸線類型，並估此介電材料適用性，根據這些基本概念，可以設計出達到設計要求的探針線路基座。

In order to manufacture traces on the probe head, we compared the three kinds of traces, microstrip line, embedded line and symmetry stripline to find the minimum trace standards on polyimide and Silicon substrate. In this way, we know the width of embedded line can be decrease to 12μm. If line space is 30μm as for the probe substrate in 50mm×50mm, each side can have 1190 probe circuit pads. For the parallel traces, we can use U-type traces to decrease the crosstalk. Using microstrip lines and embedded lines in double-deck structure can increase more traces. In this experiment, we use polyimide to complete the probe head. In the future, we can also use other dielectric materials to achieve the goal.

[1] D. K.Cheng,“Field and Wave Electromagnetics”, Addison Wesley Publishing Company, pp.438-451,1989.
[2]袁杰編著,“高頻電路分析與設計(二)” 全威圖書股份有限公司,pp.84~98,民國86年10月。
[3] F. Gardiol, “Microstrip Circuits, ”John Wiley & Sons Ltd,pp.231,1994
[4] S. H. Hall,G. W.Hall,and J. A.Mccall, “High-Speed
Digital System Design-A Handbook of Interconnect Theory and Design Practices”,John Willy & Sons,pp.95~101,2000.
[5] H. W.Johnson, “High-Speed Design-A Handbook of Black Magic,
”New Jersey,Prential-Hall,pp.85~92,1993.
[6] H.A.Weller, “Transmission-line properties of parallel wide strips by a conformal mapping approximation, ”IEEE Trans. On Microwave Theory and Techniques,Vol.MTT-12,pp.280-289,May 1964.
[7] H.A.Weller, “Transmission-line properties of parallel wide strips by a conformal mapping approximation,”IEEE Trans. On Microwave Theory and Techniques,Vol.MTT-13,pp.172-185,May 1965.
[8] 張盛富、戴明鳳，“無線通信之射頻被動電路設計”，全華科技，pp. 3-17，1998。
[9] Mehran, Reza, “Computer-aided desian of microstrip filters considering dispersion, loss and discontinuity effects, ” IEEE, Trans., MTT-27, NO.3, pp.239-245, Mar.1979
[10] J. F.Whitaker, Theodore B. Norris, G.Mourou, and Thomas Y. Hsiang,
“Pulse Dispersion and shaping Microstrip Lines,”IEEE Trans. On Microwave Theory and Techniques, Vol.MTT-35, pp.41-47,Jan.1987
[11] M.K. Chen and Y.J. Huang, “Analysis and Measurement of Interconnection Electromagnetic Interference in High-Speed PCB, ”2001 Taiwan EMC Conference, Taipei, Taiwan, pp.276-280,2001.
[12]A. J. Rainal, “Reflections from Bends in a Printed Conductor, ”IEEE
Trans. Comp., Hybirds, Manuf., Technol.,Vol13,No.2,pp407-413,Jun.1990
[13]R. A. Pucel, D.J. Masse, and C. P. Hartwing, “Losses in Microstrip, ” IEEE Trans. On Microwave Theory and Techniques, Vol. MTT-16, pp.342-350, Jun. 1968.
[14]Sol Rosenstark, “Transmission Lines in computer engineering,” McGraw-Hill,pp. 152-163.1994.
[15]J.M. Jong, V.K. Tripathi, “Time-Domain Characterization of Interconnect Discontinuities in High-Speed Circuit, ” IEEE Transaction on CPMT, Vol. 15, No.4, pp.497-504,Aug. 1992
[16]F. Romeo, M.Santomauro, “Time Domain Simulation of n Coupled Transmission Lines, ” IEEE Transactions on Microwave Theory and Techniques, Vol. 35, No.2, Feb.1987.
[17]B. C. Wadell, “Transmission Line Design Handbook, ” Artech House, 1991.
[18]E. J. Denlinger, “Losses of Microstrip Lines,”IEEE Trans. On Microwave Theory and Techniques, Vol MTT-28, No.6, pp.513-522, Jun.1980.
[19] D. K.Cheng,“Field and Wave Electromagnetics”, Addison Wesley Publishing Company, pp.427-484,1989.
[20]L.A. Hayden, V.K. Tripathi, “Characterization and Modeling of Multiple line interconnections from TDR measurements”, IEEE Transactions on Microwave Theory and Techniques, Vol. 42, pp.1737-1743, Sep.1994.