本研究考慮KrF 準分子雷射對傾斜面上的高分子材料(PMMA、
PI)的燒蝕加工，及利用該雷射製作高深寬比孔與V-型槽。本研究發
展斜面雷射燒蝕的理論預測模式。模式部分包含發色基的雷射光吸
收、材料的能量轉換與燒蝕。實驗部分包含量測穿透燒蝕煙柱的光子
通量、燒蝕深度與觀察材料的加工特性。經由實驗與模擬的結果比
較，可知此理論模式是恰當的。研究結果顯示傾斜角度增大時，燒蝕
率會變小，但能量密度增大時，刻除率隨之增大。另外，我們發展利
用成像面偏離聚焦平面的加工方法，觀察其對製作高深寬比孔與V-
型溝槽所產生的影響。當成像面偏離聚焦平面時，會造成雷射光分布
的改變。偏離聚焦面愈遠時，雷射光束愈大且能量密度愈小。因此，
微鑽孔時加工出來的孔徑會增大。在加工V-型溝槽部分，材料偏離
聚焦面約150-350 m µ 時，數百發的雷射便能製作出V-型溝槽。而溝槽的寬度隨偏離距離增大而增大。

In this work, the ablation of polymeric materials (PI and PMMA)
exposed to an oblique laser beam and the micro-machining of V-grooves
and high-aspect-ratio holes in polymetric materials using KrF excimer
laser radiation are considered. Modeling and measurement methods for
the oblique ablation of polymeric materials are developed. The
modeling includes the absorption of laser light by chromophores, energy
conversion and material ablation. The experiment includes the
measurement of the light intensity through the ablation plume and the
ablation depth and the observation of the machining properties of the
polymers. The simulation and the measurement results are compared to
examine the model. The comparison shows that the modeling is valid.
The ablation rate decreases with the increase of the incident angle, but
increase with the increase of the fluence. Next, we develop a
micro-machining method based on the defocus of the laser beam. The
effects of this method on the micro-drilling and the micro-machining of
V-grooves are investigated. The defocus of the laser beam changes the
local distribution of the light over the micro-machined surface. When
the degree of the defocus increases, the beam size increases and its
intensity decreases. Thus, the size of the opening of the hole increases.
When the distance between the focus plane and the polymer surface is in
the range 150~350 m µ , a few hundreds pulses can generate a V-groove.
The width of the groove increases with the increase of the distance.

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