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研究生： 胡哲彰
Hu, Che-Chang
論文名稱： 聚合物之準分子雷射燒蝕與微鑽孔
Excimer Laser Ablation and Microdrilling of Polymers
指導教授： 吳志陽
Wu, Chih-Yang
學位類別： 碩士
Master
系所名稱： 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年： 2002
畢業學年度： 90
語文別： 中文
論文頁數： 85
中文關鍵詞： 高深寬比 、準分子雷射 、燒蝕率 、微機電
外文關鍵詞： MEMS, Excimer Laser, High-Aspect Ratio, Ablation Rate
相關次數： 點閱：97  下載：2 
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    • 　　本研究嚐試利用KrF準分子雷射(波長：248nm)對高分子材料(PMMA、PI)做燒蝕加工，發展一套能預測刻除率之理論模式，並做高深寬比加工的初步探討。
    　　實驗過程中，我們以KrF準分子雷射對高分子材料(PMMA)做不同能量密度與脈衝數目的燒蝕，並以表面形貌測定儀量測出該能量密度下對應之平均燒蝕率。
    　　理論預測模式是以實驗所量測之光子通量做為入射條件，代入發色基濃度之速率方程式及能量方程式，以求取材料內部之性質及溫度分佈，模式中設定當材料達到燒蝕溫度時即材料被刻除，並以此預測出準分子雷射對材料之刻除率。
    　　研究結果發現能量密度增大時，刻除率也增大，預測的刻除率與量測的平均刻除率相當一致。
    最後，我們嚐試利用準分子雷射加工機製作高深寬比的微結構。過程中發現，雷射光的能量密度大、雷射脈衝頻率高、材料的位置在雷射光的加工景深內皆有利於加工結構的形貌。

    　　In this work, we use KrF Excimer Laser (wavelength: 248nm) to ablate polymers(PMMA、PI), develop a model to predict the ablation rate , and try to micro-machine high-aspect-ratio channels.
    　　We use photomultiplier and oscilloscope to measure temporal distribution of the pulse energy of the excimer laser. Then, we combine the rate equation of the concentration of chromophores, the energy equation, the transfer of radiation in material and the plume attenuation effects to predict the ablation rate of PMMA by excimer laser. The predicted results are compared with the measurement results. The two results are in good agreement. The ablation rate increases with the increase of the fluence.
    　　Finally, we find that large fluence, high repetition rate, setting the material in the depth of field will improve the shape of microstructures.

    中文摘要……………………………………………………………I 英文摘要……………………………………………………………II 誌謝…………………………………………………………………III 目錄…………………………………………………………………IV 表目錄………………………………………………………………VI 圖目錄………………………………………………………………VII 符號說明……………………………………………………………X 第一章　緒論………………………………………………………1 第二章　實驗及量測………………………………………………5 　　2-1 準分子雷射微細加工機概述..…………………………5 　　2-2 雷射脈衝之量測…………………………………………6 　　2-3 能量及光子通量之轉換…………………………………7 　　2-4 刻除率之量測……………………………………………8 　　2-5 穿透率之量測……………………………………………9 第三章　預測模式與數值方法……………………………………10 　　3-1 預測模式…………………………………………………10 　　3-2 數值方法…………………………………………………20 第四章　準分子雷射之微鑽孔……………………………………24 　　4-1 加工材料…………………………………………………24 　　4-2 光罩之設計………………………………………………24 　　4-3 加工方法及截面影像擷取………………………………25 第五章　結果與討論………………………………………………28 　　5-1 表面形貌及刻除率量測之結果與討論…………………28 　　5-2 利用擷取光子通量預測刻除率之結果與討論…………29 　　5-3 製作高深寬結構之問題與討論…………………………33 第六章　結論與展望………………………………………………35 　　6-1 結論………………………………………………………35 　　6-2 展望………………………………………………………35 參考文獻……………………………………………………………37 自述…………………………………………………………………85

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