| 研究生: |
邱成偉 Chiu, Chen-Wei |
|---|---|
| 論文名稱: |
1-丁基-1-甲基吡咯二氰胺親水性室溫離子液體中電沈積磷化鈷化合物及其電化學研究 Electrochemical study and electrodeposition of CoP in hydrophilic room temperature ionic liquid 1-Butyl-1-methylpyrrolidinium dicyanamide |
| 指導教授: |
孫亦文
Sun, I-Wen |
| 學位類別: |
碩士 Master |
| 系所名稱: |
理學院 - 化學系 Department of Chemistry |
| 論文出版年: | 2016 |
| 畢業學年度: | 104 |
| 語文別: | 中文 |
| 論文頁數: | 100 |
| 中文關鍵詞: | 離子液體 、電沉積 、鈷 、磷化鈷合金 、水電解 |
| 外文關鍵詞: | Ionic liquid, Electrodeposition, Cobalt, Cobalt Phosphide, water splitting |
| 相關次數: | 點閱:83 下載:0 |
| 分享至: |
| 查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
本研究探討在BMP-DCA(N-methyl-N-methylpyrrolidinium dicyanamide)之Co(Ⅱ)與Co(Ⅱ)/P混和溶液中的電化學行為,以GC、Pt電極並且在不同溫度及不同掃描速率下討論Co(Ⅱ)與Co(Ⅱ)/P混和溶液在離子液體中電化學行為。並以銅為基材在不同電位下沉積Co及CoP化合物,並且使用電子顯微鏡(SEM)及元素分析(EDS)觀察鍍層表面型態以及組成。最後以電沉積所的之CoP化合物在鹼性溶液中進行水的電解,結果顯示在含有29%的CoP合金對於氧氣生成反應(OER)具較良好的催化效果,而含有19%與29%的CoP對於HER比較有明顯的催化。
In this study, the electrochemical behavior of Co(II) and the mixtures of Co(II) -hypophosphite (H2PO2-) were investigated on platinum (Pt), glassy carbon (GC) electrodes by using various electrochemical techniques in N-butyl-N-methylpyrrolidinium dicyanamide room temperature ionic liquid[1] (BMP-DCA RTIL).
Co(II) species were introduced into BMP-DCA by the addition of CoSO4·7H2O or anodic dissolution of Co metal. In the Co(II) containing solutions, NaH2PO2 was introduced as the source of P and various mixtures of Co(II) and H2PO2- were prepared.
Electrodeposition of Co metal and CoP compounds were achieved by potentiostatic electrolysis and the effect of the applied potentials on the compositions of CoP was carefully studied.
The surface morphology and composition of all the electrodeposited samples were characterized using scanning electron microscope (SEM) and energy dispersive spectrometry (EDS), respectively.
The electrocatalytic activity of the CoP compounds toward the oxygen reduction reaction (ORR) was studied.
[1]D. R.MacFarlane, S. A.Forsyth, J.Golding, G. B.Deacon, Green Chem. 2002, 4 , 444-448.
[2]J.S.Wilkes, Green Chem. 2002,4,73-80
[3]M. Krolikowska, M. Zawadzki and M. Krolikowski, J Chem Thermodyn, 2014, 70, 127-137.
[4]J. L. Manson, C. R. Kmety, Q. Z. Huang, J. W. Lynn, G. M. Bendele, S. Pagola, P. W. Stephens, L. M. Liable-Sands, A. L. Rheingold, A. J. Epstein and J. S. Miller, Chemistry of Materials, 1998, 10, 2552-2560.
[5]H. Y. Huang and P. Y. Chen, Electrochimica Acta, 2011, 56, 2336-2343.
[6]P. Jensen, S. R. Batten, G. D. Fallon, D. C. R. Hockless, B. Moubaraki, K. S. Murray and R. Robson, Journal of Solid State Chemistry, 1999, 145,387-393.
[7]D. X. Zhuang, M. J. Deng, P. Y. Chen and I. W. Sun, Journal of the Electrochemical Society, 2008, 155, 575-579.
[8]H. Y. Huang and P. Y. Chen, Electrochimica Acta, 2011, 56, 2336-2343.
[9]A. I. de Sa, S. Eugenio, S. Quaresma, C. M. Rangel and R. Vilar, Thin Solid Films, 2011, 519, 6278-6283.
[10]A. I. de Sa, S. Eugenio, S. Quaresma, C. M. Rangel and R. Vilar, Surf Coat Tech, 2013, 232, 645-651.
[11]T. I. Leong, Y. T. Hsieh and I. W. Sun, Electrochimica Acta, 2011, 56, 3941-3946.
[12]M.-J. Deng, I. Sun, P.-Y. Chen, J.-K. Chang and W.-T. Tsai, Electrochimica Acta, 2008, 53, 5812-5818.
[13]T. I. Leong, I. W. Sun, M. J. Deng, C. M. Wu and P. Y. Chen, Journal of the Electrochemical Society, 2008, 155, 55-60.
[14]M. Wu, N. R. Brooks, S. Schaltin, K. Binnemans and J. Fransaer, Physical chemistry chemical physics, 2013, 15, 4955-4964.
[15]M. Steichen, R. Djemour, L. Gütay, J. Guillot, S. Siebentritt and P. J. Dale, The Journal of Physical Chemistry C, 2013, 117, 4383-4393.
[16]M.-J.Deng, P.-C.Lin, J.-K.Chang, J.-M. Chen and K-T.Lu, Electrochimica Acta, 2011, 56, 6071-6077.
[17]M.-J. Deng, P.-Y. Chen, T.-I. Leong, I. W. Sun, J.-K. Chang and W.-T. Tsai, Electrochemistry Communications, 2008, 10, 213-216.
[18]B. C. M. Martindale, S. E. W. Jones and R. G. Compton, Physical Chemistry Chemical Physics, 2010, 12, 1827-1833.
[19]H. Yi-Ting and I. W. Sun, Electrochemistry Communications, 2011, 13, 1510-1513.
[20]D. S. Lashmore and J. F. Weinroth, Plat. Surf. Finish., 1982,69,72-76.
[21]B. P. Daly and F. J. Barry, International Materials Reviews, 2003, 48, 326-338
[22]I. Paseka, Electrochim. Acta, 1995,40,1633-1640.
[23]R. K. Shervedani and A. Lasia, J.Electrochem. Soc.,1997,4, 511-519.
[24]Z. Xing, Q. Liu, A. M. Asiri, X. P. Sun, Adv. Mater. 2014, 26, 5702–5707.
[25]J. M. McEnaney, J. Chance Crompton, J. F. Callejas, E. J. Popczun, C. G. Read, N. S. Lewis, R. E. Schaak, Chem. Commun. 2014, 50,
11026–11028;
[26]Z. Xing, Q. Liu, A. M. Asiri, X. P. Sun, ACSCatal. 2015, 5, 145–149.
[27]E. J. Popczun, C. G. Read, C. W. Roske, N. S. Lewis, R. E. Schaak, Angew. Chem. Int. Ed. 2014, 53,5427–5430
[28]F. H. Saadi, A. I. Carim, E. Verlage, J. C. Hemminger, N. S. Lewis, M. P. Soriaga, J. Phys. Chem. C ,2014, 118, 29294–29300
[29]Z. Pu, Q. Liu, P. Jiang, A. M. Asiri, A. Y. Obaid, X. P. Sun, Chem. Mater. 2014, 26, 4326–4329.
[30]E. J. Popczun, J. R. McKone, C. G. Read, A. J. Biacchi, A. M. Wiltrout, N. S. Lewis, R. E. Schaak, J. Am. Chem. Soc. 2013, 135, 9267–9270.
[31]Y. Xu, R. Wu, J. Zhang, Y. Shi, B. Zhang, Chem. Commun. 2013, 49, 6656–6658;
[32]P. Jiang, Q. Liu, Y. Liang, J. Q. Tian, A. M. Asiri, X. P. Sun, Angew. Chem. Int. Ed. 2014, 53, 12855–12859; Angew. Chem. 2014, 126,13069–13073.
[33]J. Q. Tian, Q. Liu, N. Cheng, A. M. Asiri, X. P. Sun, Angew. Chem. Int. Ed. 2014, 53, 9577–9581; Angew. Chem. 2014, 126, 9731–9735.
[34]M. Ratzker, D. S. Lashmore and K. W. Pratt, Plating and Surface Finishing,1986,76, 74-82.
[35]R. L. Zeller, III and U. Landau, J. Electrochem. Soc., 1992,139, 3464-3469.
[36]G. McMahon and U. Erb, J. Materials Science Letters, 1989,8, 865-868.
[37]E. Toth-Kadar, I. Bakonyi, A. Solyom, J. Hering and G. Konczos, Surface and Coating Technology,1987,31, pp31-43.
[38]R. Rajnarayan and M. N. Mungole, Surface Technology, 1985, 24, 233-239.
[39]I. Ogno, H. Ohfuruton and S. Haruyama,日本金屬學會誌,1986,50, 1075-1080.
[40]J. Crousier, Z. Hanane and J-P. Crousier, Tin Solid Films, 1994,248, 51-56.
[41]M. M. V. Parente, O. R. Mattos, S. L. Diaz, P. Lima Neto and F. J. Fabbi Miranda, J. Applied Electrochemistry, 2001,31, 677-683.
[42]T. Morikawa, T. Nakade, M. Yokoi, Y. Fukumoto and C. Iwakura, Electrochimica Acta,1997,42, 115-118
[43]A. Brenner, Electrodeposition,of Alloys Vol. II, Academic Press,New York, 1963, 457.
[44]K. Masui, T. Nomura, S. Kwon and D. Chang, Surface and Coating Technology, 1992,43,195-199.
[45]T. Morikawa, M. Yokoi, S. Shiroma, S. Eguchi and E. Kousai,
Surface and Coating Technology, 1992,43, 353-354.
[46]M. Ratzker, D. S. Lashmore and K. W. Pratt, Plating and Surface Finishing, 1986,76,74-82.
[47]R. L. Zeller, III and U. Landau, J. Electrochem. Soc.,1992,139,3464-3469.
[48]J. Crousier, Z. Hanane and J-P. Crousier, Tin Solid Films,1994, 248, 51-56.
[49]T. M. Harris and Q. D. Dang,J. Electrochem. Soc., 1993,140, 81-83.
[50]N. Jiang, B You, M. Sheng, Y. Sun,Angew. Chem. Int. Ed. 2015, 54,
6251-6254
[51]H. Yang, Y. Zhang, F. Hu, Q. Wang, Nano Lett. ,2015, 15, 7616-7620
[52]J. Tian, Q Liu, A.M. Asiri, X. Sun, J. Am. Chem. Soc. 2014, 136, 7587-7590
[53]J Chang, Y Xiao, M Xiao, J Ge, C Liu, W Xing,ACS Catal. 2015, 5, 6874-6878
[54]Y. Feng, X.Y. Yu, U. Paik,Chem. Commun., 2016, 52, 1633-1636
[55]K.C. Fernandes, L.M. D. Silva, J.F.C. Boodts, L. A. D. Faria, Electrochim.Acta, 2006,51,2809-2818
[56]F. H. B. Lima , J. Zhang , M. H. Shao , K. Sasaki , M. B. Vukmirovic ,‡ E. A. Ticianelli , R. R. Adzic , J. Phys. Chem. C, 2007, 111 , 404–410
[57]A.J.B.amd L.R.Faulkner, Electrochemical Method:Fundamentals and Applications(2nd ed),2001
[58]Y. You, C. Gu, X. Wang, J. Tu, Journal of The Electrochemical Society, 2012,159,642-648
校內:2018-08-01公開