中文摘要............................................................................................................i Abstract............................................................................................................ii 誌謝..................................................................................................................iii 目錄..................................................................................................................iv 圖目錄.............................................................................................................vii 表目錄............................................................................................................xiii 第一章 序論.....................................................................................................1 1-1 前言.........................................................................................................1 1-2 文獻回顧.................................................................................................3 1-3 研究目的...............................................................................................12 第二章 微幫浦晶片之設計...........................................................................13 2-1無閥式微幫浦之工作原理及設計.........................................................13 2-2 CFDRC軟體介紹...................................................................................16 2-3 CFDRC軟體模擬...................................................................................18 2-3-1 Diffuser與Nozzle element皆為圓弧端入口之模擬.....................19 2-3-2 Diffuser與Nozzle element皆為銳利端入口之模擬.....................25 2-4 微線圈設計...........................................................................................31 2-4-1 ANSOFT軟體介紹..........................................................................31 2-4-2 ANSOFT模擬..................................................................................32 2-5 光罩設計...............................................................................................37 第三章 微幫浦晶片之製作...........................................................................41 3-1 製作流程...............................................................................................41 3-2 上片－微流道之製作…...……………………………………………42 3-2-1 SU-8母膜製程................................................................................42 3-2-2 微流道製程....................................................................................53 3-2-2-1聚二甲基系氧烷矽膠(Polydimethylsiloxane, PDMS)...........53 3-2-2-2 PDMS製程..............................................................................55 3-3 中片－振動薄膜元件之製作..............................................................59 3-3-1 薄膜製作........................................................................................59 3-3-2 感測元件之製作............................................................................60 3-4 下片－微迴線圈之製作......................................................................62 3-4-1 前製程-光阻製程..........................................................................64 3-4-2 後製程-電鍍製程..........................................................................68 第四章 微幫浦之控制與實證.......................................................................74 4-1 DS1104軟體簡介.................................................................................74 4-1-1軟體說明..........................................................................................74 4-1-2硬體說明..........................................................................................75 4-2 微幫浦之振幅量測...............................................................................75 4-3 微幫浦之控制流程...…………………………………………………77 4-4 控制器之參數設定.……………………………………..……………78 第五章 結論與未來展望...............................................................................87 5-1 結論.......................................................................................................87 5-2 未來展望...............................................................................................87 參考文獻.........................................................................................................89 附錄.................................................................................................................91 自述.................................................................................................................92 圖目錄 圖1-1 壓電式微幫浦.....................................................................................4 圖1-2 電磁式微幫浦.....................................................................................5 圖1-3 氣動式微幫浦.....................................................................................6 圖1-4 記憶合金式微幫浦製程.....................................................................7 圖1-5 記憶合金式微幫浦及實體圖.............................................................7 圖1-6 化學反應式微幫浦及其實體.………………………………………8 圖1-7 EHD式微幫浦及其製程....................................................................9 圖1-8 電滲式微幫浦...................................................................................10 圖2-1 擴散口/噴嘴之工作原理..................................................................14 圖2-2 擴散口角度與壓力損失係數關係圖...............................................15 圖2-3 擴散口尺寸設計圖...........................................................................15 圖2-4 CFDRC之分析流程.........................................................................17 圖2-5 擴散嘴入口幾何圖...........................................................................18 圖2-6 CFD-GEOM所建立之模型.............................................................19 圖2-7 Diffuser元件(圓弧)於CFD-ACE內所定義之邊界及初始條件…20 圖2-8 Diffuser之速度場.............................................................................20 圖2-9 Diffuser之流場.................................................................................21 圖2-10 Diffuser之壓力場...........................................................................21 圖2-11 Diffuser之壓力分佈.......................................................................22 圖2-12 Nozzle元件(圓弧)於CFD-ACE內所定義之邊界及初始條件....22 圖2-13 Nozzle之速度場.............................................................................23 圖2-14 Nozzle之流場.................................................................................23 圖2-15 Nozzle之壓力場.............................................................................24 圖2-16 Nozzle之壓力分佈.........................................................................24 圖2-17 Diffuser元件(銳利)於CFD-ACE內所定義之邊界及初始條件..25 圖2-18 Diffuser之速度場...........................................................................26 圖2-19 Diffuser之流場...............................................................................26 圖2-20 Diffuser之壓力場...........................................................................27 圖2-21 Diffuser之壓力分佈.......................................................................27 圖2-22 Nozzle元件(銳利)於CFD-ACE內所定義之邊界及初始條件....28 圖2-23 Nozzle之速度場.............................................................................28 圖2-24 Nozzle之流場.................................................................................29 圖2-25 Nozzle之壓力場.............................................................................29 圖2-26 Nozzle之壓力分佈.........................................................................30 圖2-27 ANSOFT分析流程圖.....................................................................32 圖2-28 ANSOFT幾何模型.........................................................................33 圖2-29 邊界條件設定.................................................................................34 圖2-30 計算容許誤差.................................................................................34 圖2-31 計算磁力大小.................................................................................35 圖2-32 磁通密度分佈圖.............................................................................35 圖2-33 磁力線密度分佈.............................................................................36 圖2-34 磁場強度分佈圖.............................................................................36 圖2-35 磁力線分佈.....................................................................................37 圖2-36 微迴線圈之光罩及實體圖.............................................................38 圖2-37 微流道之光罩及實體圖.................................................................39 圖2-38 整體光罩設計.................................................................................39 圖3-1 塗佈機轉速示意圖...........................................................................45 圖3-2 SU-8 50之軟烤曲線(預設厚度為50 μm).......................................45 圖3-3 曝光機制示意圖...............................................................................47 圖3-4 駐波效應...........................................................................................48 圖3-5 SU-8 50之PEB加熱曲線.................................................................48 圖3-6 儲液槽角落未顯影乾淨造成部分SU-8光阻殘留..........................49 圖3-7 微噴嘴結構未顯影乾淨造成部分SU-8光阻殘留...........................50 圖 3-8 母膜結構 (幫浦腔體及微噴嘴結構).............................................50 圖3-9 母膜結構(儲液槽及微噴嘴結構) ...................................................51 圖3-10 浸泡過久造成微噴嘴結構過分顯影.............................................51 圖3-11 浸泡過久造成儲液槽結構過分顯影.............................................52 圖3-12 PDMS之化學結構式.....................................................................54 圖3-13 PDMS脫模結構圖.........................................................................56 圖3-14 PDMS結構近照圖.........................................................................57 圖3-15 PDMS加熱時間與溫度之關係圖.................................................57 圖3-16 脫模失敗圖.....................................................................................58 圖3-17 上片之製程.....................................................................................59 圖3-18 感測元件圖.....................................................................................60 圖3-19 元件尺寸圖.....................................................................................61 圖3-20 中片之製程.....................................................................................62 圖3-21 國科會南區微奈米中心的電子束蒸鍍系統.................................63 圖3-22 KMPR之軟烤曲線(厚度約為30 μm)...........................................66 圖3-23 KMPR之曝後烤曲線(厚度約為30 μm).......................................66 圖3-24 KMPR微結構近照.........................................................................67 圖3-25 微線圈光阻圖形圖.........................................................................67 圖3-26 電鍍之後的線圈結構(銅)...............................................................68 圖3-27 線圈中心及Pad結構(銅)................................................................68 圖3-28 電鍍之後的線圈結構(鎳)...............................................................69 圖3-29 線圈中心及Pad結構(鎳)...............................................................69 圖3-30 蝕刻後之微線圈(鎳).......................................................................70 圖3-31 OM顯微鏡照..................................................................................70 圖3-32 下片之製程.....................................................................................71 圖3-33 微幫浦完成圖.................................................................................72 圖3-34 微幫浦實體完成圖.........................................................................72 圖4-1 Power PC 603e/ 250 MH控制板......................................................75 圖4-2 電流對薄膜振福大小之關係圖.......................................................76 圖4-3 微幫浦實務控制架構.......................................................................78 圖4-4 於Matlab內所設計之即時控制流程..............................................81 圖4-5 輸入訊號對峰對峰值大小之關係圖...............................................82 圖4-6 輸入訊號: 1×10-6伏特之正弦波......................................................83 圖4-7 輸入訊號: 2×10-6伏特之正弦波......................................................83 圖4-8 輸入訊號: 3×10-6伏特之正弦波......................................................84 圖4-9 輸入訊號: 4×10-6伏特之正弦波......................................................84 圖4-10 輸入訊號: 5×10-6伏特之正弦波....................................................85 圖4-11 輸入訊號: 6×10-6伏特之正弦波....................................................85 附錄圖1 擴散口噴嘴和 的關係圖..........................................................91 附錄圖2 擴散口穩定圖...............................................................................91 表目錄 表1-1 微流體元件產值預估表.....................................................................2 表1-2 各式微幫浦之驅動方式及功能根據...............................................11 表2-1 CFD-ACE 物理分析模組................................................................16 表2-2 入口端效能比較表...........................................................................31 表2-3 ANSOFT模擬幾何模型尺寸...........................................................33 表3-1 化學清洗液與清潔物.......................................................................43 表3-2 SU-8 50光阻塗佈分段轉速.............................................................44 表3-3 PDMS之優缺點列表........................................................................55 表3-4 KMPR光阻塗佈分段轉速...............................................................65 表4-1 電流對薄膜振福之關係.....................................................................76 表4-2 輸入訊號與峰對峰值大小關係.........................................................82