| 研究生: |
許樂仁 Hsu, Lo-Jen |
|---|---|
| 論文名稱: |
304不銹鋼含硫量對孔蝕影響之研究 Effect of Sulfur Content on Pitting Corrosion of 304 Stainless Steel |
| 指導教授: |
蔡文達
Tsai, Wen-Ta 孫亦文 Sun, I-Wen |
| 學位類別: |
碩士 Master |
| 系所名稱: |
理學院 - 化學系碩士在職專班 Department of Chemistry (on the job class) |
| 論文出版年: | 2003 |
| 畢業學年度: | 91 |
| 語文別: | 中文 |
| 論文頁數: | 82 |
| 中文關鍵詞: | 腐蝕電位 、孔蝕起使電位 、過鈍化電位 、孔蝕保護電位 、臨界電流密度 、鈍化電流密度 |
| 外文關鍵詞: | Enp, Ecorr, Etr, Epp, Ic, Ip |
| 相關次數: | 點閱:136 下載:2 |
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本研究主要是以電化學量測方法、探討硫酸、硝酸、鹽酸及氯化鈉離子溶液對奧斯田鐵不銹鋼(含硫量0.001%、0.002%、0.005%、0.010%)中之孔蝕性質的影響。並以OM、SEM、EDS觀察分析孔蝕深度、孔蝕型態和元素成份。
由實驗結果顯示在硫酸、硝酸水溶液中,並無發現孔蝕現象,鹽酸及氯化鈉水溶液中有孔蝕產生。
在硫酸、硝酸水溶液中,陽極鈍態區電流密度隨不銹鋼中硫含量之增加而提高。
在鹽酸水溶液中, 鈍態區電流密度亦隨不銹鋼中硫含量之增加而提高且鈍態區之範圍隨之縮小。在此水溶液中,於極化曲線量測後304不銹鋼表面有孔蝕生成。
在氯化鈉水溶液中經極化曲線量測後304不銹鋼表面皆有孔蝕發生而孔蝕起始電位與304不銹鋼之硫含量沒有明顯關係,此乃因本研究之304不銹鋼中之介在物密度很高有關。
Effects of sulfuric acid, nitric acid, hydrochloride acid and sodium chloride ions on pitting corrosion of SUS 304 stainless samples(contain 0.001%, 0.002%, 0.005%, 0.010% sulfur) were investigated by electrochemical and surface analytical techniques such as potentiodynamic polarization curves. Examination of the surface corrosion morphology and analysis of the chemical composition, deep in pits.
The results show that no pit was observed in sulfuric acid and nitric acid but in hydrochloride acid and sodium chloride solutions, a pit in the specimen was observed.
In sulfuric acid and nitric acid anodic passive area of current density is increased as stainless steel sulfur content increasing.
In hydrochloride acid passive area of current density is also risen as stainless steel sulfur content increasing, but the range of passive area will be decreased. In the solution after the polarization, we can find the pitting corrosion on the surface of the 304 stainless steel.
At the sodium chloride solution , 304 stainless steel surface showed pitting corrosion when measure the polarization cure. Pitting initiated potential is no relationship with the 304 stainless steel contains sulfur because in the research the 304 stainless steel contain very high inclusion.
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