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研究生：	吳雨衡 Wu, Yu-Heng
論文名稱：	用有限元素法分析導線架幾何形狀對應力之影響 Finite Element Analysis of the Influence of Lead Frame Geometry on Stress
指導教授：	周榮華 Chou, Jung-Hua
學位類別：	碩士 Master
系所名稱：	工學院 - 工程科學系 Department of Engineering Science
論文出版年：	2017
畢業學年度：	105
語文別：	中文
論文頁數：	97
中文關鍵詞：	熱膨脹係數、導線架幾何、應力、田口實驗法、單一因子實驗法
外文關鍵詞：	CTE, lead frame geometry, stress, Taguchi Method, one-factor-at-a-time
相關次數：	點閱：126 下載：2
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構裝體因各材料間熱膨脹係數不同，導致構裝體隨溫度而有不同程度之變型量甚至產生翹曲，針對此製程可能發生應力問題進行研究，文獻回顧發現應力較大之地方與脫層位置相同，希望透過模擬找出降低應力之趨勢，做為日後導線架設計之依據。預期透過有限元素分析軟體ANSYS模擬封膠製程，高溫狀態下構裝體應力分佈的情況，搭配單一因子實驗設計法與田口實驗設計的L18因子直交表作為實驗的組合，依晶粒墊與地環線之高度差、Tie Bar轉折角度及IO個數作為因子，三因子三水準之配置，以改變導線架幾何複雜度形式達到應力望小的目標。田口實驗設計法分析之結果與單一因子實驗設計法分析結果一致，模擬中可發現影響應力大小的控制因子(排序)為:晶粒墊與地環線高度差、Tie Bar轉折角度、IO個數，當晶粒墊與地環線高度差小，Tie Bar轉折角度小，IO個數少的情況下會有較低之應力，本文分析改變導線架幾何後，應變變化之情形，希望藉由降低應力的結果，進而降低脫層的風險，可做為日後釘架設計之依據。

Due differences in coefficients of thermal expansion between different materials, delamination and warpage may occur in electronic packages because of thermal stresses. In this study we used finite element analysis to numerically analyze the thermal stress created during molding which may lead to delamination issues. In the numerical simulation, both the one-factor-at-a-time and L18 Taguchi method were adopted to investigate the sensitivity of the control factors of the Tie bar turning angle, the density of IO and the height difference of the pad and the ground ring.
The results of the simulation indicate that the importance of the control factors in descending order is the height difference of the pad and the ground ring, the Tie bar turning angle, and the I/O density. On the other hand, by reducing the width of the I/O pin and further increasing the I/O density, the effect of I/O density becomes important. In other words, the leadframe geometry can be used to adjust the thermal stress of the electronic package.

摘要…................................................................................................................Ι
Extended Abstract............................................................................................II
致謝.................................................................................................................VII
目錄................................................................................................................ VIII
表目錄.............................................................................................................XI
圖目錄..............................................................................................................XII
符號說明.........................................................................................................XIV第一章 緒論......................................................................................................1
   1-1 前言.......................................................................................................1
   1-2 研究動機與目的...................................................................................3
   1-3 文獻回顧...............................................................................................4
   1-4 論文架構...............................................................................................7
第二章 半導體封裝製程概述........................................................................14
   2-1 封裝製程概述.................................................................................15
   2-2 導線架概述.................................................................................19
   2-3 銀膠概述.....................................................................................20     
   2-4 環氧樹脂概述.................................................................................21 

第三章 理論基礎............................................................................................23
   3-1 有限元素法.........................................................................................24  
   3-2 田口實驗設計法................................................................................26
       3-2-1田口方法簡介...........................................................................26
       3-2-2因子種類...................................................................................27
       3-2-3直交表.......................................................................................27
       3-2-4訊號與雜訊比...........................................................................28
       3-2-5因子反應分析...........................................................................30
       3-2-6變異分析...................................................................................30
   3-3 應力應變方程式.................................................................................33
第四章 研究方法與步驟..........................................................................37
   4-1 ANSYS有限元素模擬軟體簡介............................................................38
       4-1-1 前處理......................................................................................40
       4-1-2 有限元素分析..........................................................................46
       4-1-2 後處理......................................................................................49
   4-2 單一因子實驗法.................................................................................51
   4-3 田口實驗法.........................................................................................55


第五章 結果討論與建議...............................................................................56
   5-1 單一因子結果.....................................................................................56
   5-2 田口結果.............................................................................................64
第六章 結論與建議...............................................................................83
   6-1結論......................................................................................................83
   6-2 建議.....................................................................................................84
參考文獻..........................................................................................................85
附錄..................................................................................................................89
                                    

[1] Gordon E. Moore, " Cramming more components onto integrated circuits, " Electronics Magazine, Vol38,No8, April, 1965.
[2] Asao Nishimura, Sueo Kawai, Gen Murakami, "Effect of Lead Frame Material on Plastic-Encapsulated IC Package Cracking Under Temperature Cycling, " IEEE Transactions On Components, Hybrids, And Manufacuring Technology, Vol. 12, No.4, December 1989.
[3] http://stam.org.tw/newsletter2a.php?SN=15&opp=download1,徐祥禎電子構裝結構分析，義守大學機械與自動化工程學系副教授
[4] L.T. Nguyen, K.L. Chen, P. Lee, "Leadframe designs for minimum molding-induced warpage, " Electronic Components and Technology Conference. Proceedings, 44th, 1994.
[5] C. Y. Kuo, L. H. Huang, Jian Wen Wu, Yu Heng Wu , L. S. Chao, J. H. Chou, " Reducing Delamination of QFN Packages by Changing the Lead frame Morphology, "Impact Conference, 2016.
[6] U. R. Evans and H. A. Miley, Nature 139, 238 ,1937.
[7] Chai Tai Clhong, Alan Leslie, Lim Thiam ELeng, "Investigation on the Effect of Copper Leaclframe Oxidation on Package Delamination, " Electronic Components and Technology Conference. Proceedings., 45th, 1995.
[8] B. H. Moon, H. Y. Yoo, K. Sawada, "Optimal oxidation control for enhancement of copper lead frame EMC adhesion in packaging process, " Electronic Components and Technology Conference, pp.1148 – 1153, 1998.
[9] E. Takano, T. Mino, K. Takahashi, K. Sawada, S.Y. Shimizu, H. Y. Yoo, "The Oxidation Control of Copper Lead frame Package for Prevention of Popcorn Cracking, "Electronic Components and Technology Conference, pp.78 – 83, 1997.
[10] 羅大惟，釘架氧化程度對引腳型封裝結構脫層之研究，國立成功大學工程科學系碩士班碩士論文，2015年7月
[11] Taylor and Francis, "Effect of the microstructure of copper oxide on the adhesion behavior of epoxy/copper leadframe joints", 02 Apr 2012.
[12] Sung Yi , Chee Yoon Yue , Jang-Hsing Hsieh , Liwha Fong & Syamal K. Lahiri, " Effects of oxidation and plasma cleaning on the adhesion strength of molding compounds to copper leadframes, " Journal of Adhesion Science and Technology, 13:7, 789-804, 2012.
[13] S. Timoshenko, "Analysis of Bi-Metal Thermostats, " J. Opt. Soc. Am.,Vol.11, pp.233-255, 1925.
[14] Suhir, E. , "Die Attachment Design and Its Influence on Thermal
Stress in the Die and the Attachment"37th Electronics Components Conference, IEEE/EIA, pp. 508–517, 1987.
[15]Steven Groothuis, Walter Schroen, and Masood Murtuza,"Computer Aided Stress Modeling for Optimizing Plastic Package Reliability", IEEE/IRPS Conference,PP.184-191, 1985.
[16] Oota,K. and Shigeno,K., “Development of Molding Compounds
for BGA” IEEE, pp78-85, 1995.
[17 ]Dexin Liang ,”Warpage study of glob of glob top cavity-up
EPBGA packages” Electronic Components and Technology
Conference, Proceeding., 46th, page(s); 694-701, 1996.
[18] John H. Lau, "Solder joint reliability: theory and applications, "Van Nostrand Reinhold , 1991.
[19] LeiL. Mercado, Hubert Wieser, and Torston Hauck, "Mold Delamination and Die Fracture Analysis of Mechatronic Packages", Electronic Components and Technology Conference, 2001.
[20] S. Stoeckl, H. Pape ” Design Study for Improved Solder Joint Reliability of VQFN Packages” IEEE, Conf on Thermal Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-System, EuroSimE, pp297-304 ,2005.
[21] S. Rzepka, M. A. Korhonen, E. Meusel, "The Effect of Underfill And Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints, " Transactions of the ASME, Journal of Electronic Packaging, Vol.120,December 1998.
[22] W.D. Driel, H.K.L. Bressers, H.J. Janssen, A. Bielen, X. Yan, P.M.P. Stevens, G.Q. Zhang, "A Study on the Effect of Mold Compound Moisture Related Properties and Leadframe Dimension on the Reliability of IC Packages Using An Integrated Mechanical Modeling Approach," IEEE Transactions on Components and Packaging Technologies, vol. 31, pt. 2, pp. 260-268, 2008.
[23] S.Abdullah, M.F.Abdullah, A.K.Ariffin, Z.A.Aziz and M.J. Ghazali, " Thermal-Mechanical Analysis of a QFNThermal-Mechanical Analysis of a QFN Stacked-Die Leadframe under Reflow ProcessStacked-Die Leadframe under Reflow Process, " American Journal of Applied Sciences, vol. 6, pp. 606-625, 2008
[24] Tong Yan Tee, Hun Shen Ng, Jean-Luc Diot, Giovanni Frezza, Roberto Tiziani, and Giancarlo Santospirito, "Comprehensive Design Analysis of QFN and PowerQFN Packages for Enhanced Board Level Solder Joint Reliability, "Electronic Components and Technology Conference, pp1329-1338, 2003
[25] M. Ying, S. G. Chow, R. Emighb, J. D. Punzalana, K. Ramakrishnab, "Design Considerations on Solder Joint Reliability of Dual Row Quad Flat No-lead Packages, "IEEE, Electronics Packaging Technology Conference, pp308-312, 2004.
[26] L. T. Nguyen, "Reactive Flow Simulation in Transfer Molding of IC package, " Electronic Components and Technology Conference, pp. 375-390, 1993
[27] 邱以泰，「半導體封裝體之爆米花現象電腦模擬」，工業材料，139 期，136-140 頁，1998。
[28] T.S. Tong, J.K. "A Study and Investigation on Processes Inducing Delamination in QFN Package Using Statistical Analysis, " International Electronic Manufacturing Technology, pp.381-389, 2006.
[29] 史金益，半導體晶片封裝導線架脫層之研究，國立成功大學工程科學系碩士班碩士論文，2004年7月
[30] "Plasma Clean introduction", ASEKH RD Lab, Aug 2002.
[31] NTB Store “Electronic Materials Handbook,” Vol.1, pp.1-1140 (ASM international, 1989.)
[32] "Lead Frame製程簡介", ASEMTL, May 2002.
[33]http://leadframe.sdi.com.tw/_chinese/01_semi_lead_frame/photo.swf?MainID=2 Lead frame With Silver 2016/12/27
[34] 劉心怡、洪雅慧、何宗漢、伍玉真、鄧希哲，「銀膠種類及厚度對構裝後晶片可靠度的影響」工程科技與教育學刊，第四期, 第546～559頁,2010.
[35] A. Tanaka, T. Asano, S. Oizumi, K. Niwa, T. Nishjoka, “Flow Analysis of Semiconductor Encapsulating Material,” Electronic Components and Technology Conference, pp. 134 – 140, 1994.
[36] "Epoxy 組成成份與基本特性簡介", ASEKH Technology Department, Mar 2003.
[37] 李輝煌，田口方法-品質設計的原理與實務，高立圖書有限公司，2012
[38] Sadd. Martin H., "Elasticity, 2nd Edition Theory, Applications, and Numerics, " Academic Press, USA, 2009.
[39] Ferdinand Beer, E. Russell Johnston, Jr., John DeWolf and David Mazurek "Mechanics of Materials 6th, " McGraw-Hill College, 2011
[40] 薛啟宏，IC封裝後熟化製程模擬之研究，國立成功大學機械系碩士班碩士論文，2008年7月
[41] 許育銘，引腳型塑膠封裝元件外露式晶片座脫層之研究，國立成功大學工程科學系碩士班碩士論文，2014年7月
[42] Huei - Huang Lee, Finite Element Simulations with ANSYS Workbench 15 Chuan Hwa Book, Ltd, 2014.

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