| 研究生: |
楊志豪 Yang, Chih-hao |
|---|---|
| 論文名稱: |
雙靶射頻磁控濺鍍系統製備氧化銦錫薄膜摻雜錫,鈦及鉻之性質研究 Investigation on Properties of Tin, Titanium and Chromium-Doped Indium-Tin-Oxide Film by Dual Targets RF Magnetron Sputtering System |
| 指導教授: |
李世欽
Lee, Shih-Chin |
| 學位類別: |
博士 Doctor |
| 系所名稱: |
工學院 - 材料科學及工程學系 Department of Materials Science and Engineering |
| 論文出版年: | 2008 |
| 畢業學年度: | 96 |
| 語文別: | 中文 |
| 論文頁數: | 189 |
| 中文關鍵詞: | 透明導電膜 、氧化銦錫 、濺鍍 、摻雜 、退火 、光電性質 |
| 外文關鍵詞: | Transparent conducting oxide (TCO) films, Indium-tin-oxide (ITO), Opto-electronic properties, Post-annealing, doping, Sputtering |
| 相關次數: | 點閱:73 下載:10 |
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本研究的主要目的在討論氧化銦錫及氧化銦錫分別摻雜錫、鈦及鉻。鍍層是利用雙靶磁控濺鍍系統沉積在玻璃基板來討論金屬靶材功率變化及退火對鍍膜性質的影響。實驗的結果顯示添加鈦及鉻後沉積速率會降低,這是因為他們的不同濺鍍速率。氧化銦錫鍍層之載子濃度會隨著摻雜錫、鈦及鉻靶材功率的提高而增加,然而卻造成了載子遷移率的降低。當錫靶的濺鍍功率7.5 W時,可以達到最大的載子遷移率32.1 cm2 /V-s及最低的電阻率6.92 ×10-4 Ω-cm。鈦靶材功率5 W時,可以觀察有最大的載子遷移率31 cm2 /V-s但是卻是最低的載子濃度2.42×1020 cm-3及電阻率 6.64×10-4 Ω.cm。但是在摻雜鉻的氧化銦錫鍍層,也可以觀察到當鉻靶材功率在15 W時,具有最大的載子遷移率27.3 cm2/V-s,然而它確有最低的載子濃度2.47×1020 cm-3 及電阻率 7.32×10-4 Ω-cm。TEM的影像觀察與選區繞射分析,ITIO鍍層的繞射圖形中,可以觀察到鍍層並非全然為非晶質,其中包含了輕微的結晶相與非晶質基地經SEM及AFM表面形態觀察得知,ITO及ITO摻雜金屬後使得表面之白色叢聚物減少,因為表面能的改變及陰電性使得In2O3分解,叢聚物生成減少,而添加此三種金屬後能使表面粗糙度均下降,而在最佳電性時鍍層的表面粗糙度Rrms值均在1nm以下。在這個實驗中,所有的摻雜金屬的氧化銦錫鍍層在可見光波長(300~800 nm)的光穿透率都可以達到約90%。我們選擇沉積最佳電性參數的試片再進行退火處理。在退火之後。所有的鍍層呈現往最低能量的優選方向成長,其主要的結晶面都為(222)。當退火溫度達450 ℃時,氧化銦錫摻雜錫鍍層有最低的電阻率2.67 ×10-4 Ω-cm,載子濃度為3.53 ×1020 cm-3。在相同的溫度下,摻雜鈦及鉻的氧化銦錫鍍層,擁有最高載子濃度分別為3.92×1020 cm-3及3.96×1020 cm-3, 同時也有最低的電阻率分別為4.28×10-4 Ω.cm 及3.03×10-4 Ω.cm。所有鍍層在波長為550 nm的光傳透率都可以達到約90%。光學能隙隨著退火溫度的提高而增加。摻雜錫、鈦及鉻的氧化銦錫鍍層在450 ℃的光學能隙分別為 3.96 eV,3.97 eV及 3.97 eV。
The main purpose of this study is to investigate the opto-electronic properties of indium-tin-oxide (ITO) and ITO doped with metals such as tin, titanium and chromium, respectively. The films were deposited on glass substrates by dual-target RF magnetron sputtering system under various RF power output and post-annealing at different temperatures were studied. Experimental results show that films deposition rate decrease when Ti and Cr were doped. The reason is because their sputtering yield is different. The carrier concentration of the ITO films increased with increase in target power of tin, titanium and chromium, however, the mobility of the carrier decreases. When the sputtering power of tin target is 7.5W, there is maximum carrier mobility of 32.1 cm2 /V-s, and lowest resistivity of 6.92 ×10-4 Ω-cm. The sputtering power of the titanium target is at 5W, the maximum carrier mobility of 31 cm2 /V-s can be obtained. It has the minimum carrier concentration, 2.42×1020 cm-3, and the lowest resistivity, 6.64×10-4 Ω.cm. But in ITO:Cr films, we can also observe that when the sputtering power of chromium target is at 15 W, the maximum carrier mobility, 27.3 cm2/V-s, however, it has the minimum carrier concentration, 2.47×1020 cm-3 and the lowest resistivity, 7.32×10-4 Ω-cm. As SEM and AFM images of ITO and ITO doped with metals films show that an decrease in clusters with metal doped because the surface energy was reduced and resolved In2O3 particals by dapent electronegative, and was found to have the smoother than pure ITO films at the optium electrical properties, Rrms<1 nm in as deposited film. The transmittance of all these metals doped ITO films at 300~800 nm wavelength region in this experiment can reach up to ~ 90 %. After post-annealing, all films extend from the prefer orientation with minimum energy to grow and the major crystallization plane of the ITO films is the (222) plane. In the diffraction pattern analyzed these films show a not fully amorphous and comprised slight crystalline or amorphous-like matrix. The results indicate out the domestic component of matrix is comprised of In and O atoms. The In2O3 clusters appear in the white spot resulted from Sn evaporation during sputtering process. The In2O3 and ITO particles are separated from amorphous InOx matrix to form crystalline during sputtering process by energy induced. At the annealing temperature is 250℃, it can be observed the matrix is crystallized and grain size are 200~400 nm. While the annealing temperature increases to 450℃, the grain size is enlarged. It is obvious that the microstructure change from amorphous to crystalline strongly depended on annealing temperature at the range of 150~250 ℃ in this research. ITO crystalline surrounded the matrix but the concentration of Sn is not in proportion that resulted from the concentration of Sn, Ti and Cr irregular distribution owing to the particles of In2O3 and ITO solutes in matrix and grain growth in annealing process. Therefore, the concentration of Sn on each grain is not in proposition after grain growing. While the annealing temperature increased, the thermal energy provided the high driving force to enhance grain growth. The grain size is larger while the annealing temperature increases and it is no amorphous region found at 450℃.
When the annealing temperature is at 450 ℃, the carrier concentration of the ITO:Sn films is 3.53 ×1020 cm-3, while the lowest resistivity is 2.67 ×10-4 Ω-cm. At the same temperature, the maximal carrier concentration of ITO:Ti films and ITO:Cr is 3.92×1020 cm-3 and 3.96×1020 cm-3, respectively, and the lowest resistivity is 4.28×10-4 Ω.cm and 3.03×10-4 Ω.cm , respectively. The optical transmittance of all films at 550nm wavelength reaches up to ~90%. The optical energy band gap increased with the increase of the post-annealing temperature. The maximum optical energy band gap of Sn, Ti and Cr doped at 450℃ are 3.96 eV, 3.97 eV and 3.97 eV, respectively.
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