微製程技術在目前的科技發展中扮演著重要的地位，在三維微結構的設計製作過程中，適當的運用電腦輔助設計將可大幅度減少重新設計與試做的過程，並建構虛擬原型的開發與迅速地評估設計變更的效果及產品的製造與效率，得以加速實體成品的開發時間。在目前的微機電製程中，主要是利用半導體製程的方式來製作，但其加工形狀受到較大的限制，不易製作出三維微結構；而近來發展出許多新興的微製程技術，如電子束微影等，其可直接製作出精度高且任意曲面之三維微結構。但由於必須考量其本身的製程特性，在獲得一產品前常需經過多次的試做，其將影響產品開發的時間且提高成本。所以，若要製作出更精細複雜之結構並減少試做的過程，則必須藉由電腦輔助設計來加速元件的製作。除此之外，隨著積體電路線寬不斷縮小，晶圓表面高低起伏對微影聚焦能力的影響很大，使得晶圓平坦化的要求不斷提升。由於化學機械研磨涉及化學蝕刻與機械研磨相互的複雜過程，必須考慮各研磨參數與條件之影響。因此，藉由電腦輔助設計並整合多領域之分析，將有助於CMP製程技術之發展。在本論文中，依模擬分析的方法介紹三種在微製程與半導體製程常用之製程模擬法，分別為幾何模擬法、細胞自動機法以及迴旋積分法等，並介紹其模擬方法之特性與應用。並依據各模擬方法之特性，將其應用在不同的製程技術上，分別建立合理之模擬方法與流程，以發展幾何模擬之微製程模擬模組、迴旋積分法之EBL製程模擬模組以及細胞自動機法之CMP製程模擬模組與CMP研磨墊修整製程模擬模組等，並針對各製程技術之製程參數進行探討與應用，以提供實際製程上之參考。

Computer aided design (CAD) is a key issue for the development of all engineering products to reduce the cost and to accelerate product updating. Recently, with the advances in microelectromechanical (MEMS) and semiconductor fabrications, new CADs are needed for optimizing the fabrication performances. Therefore, this dissertation aims to develop process emulators for MEMS and semiconductor fabrication processing using various modeling techniques. Three process emulators are developed in this dissertation. First, a MEMS fabrication emulator based on solid modeling. Second, a process emulator for electron-beam based 3D structure fabrication by using digital convolution method. Finally, a chemical-mechanical polishing (CMP) CAD and a pad dressing module for predicting material removing rate based on cellular automata (CA) method. For MEMS fabrication, its 2D extruded nature of the MEMS fabrication process makes it extremely suitable to be represented by using an automatic solid modeling flow. The correlation between individual fabrication process and their corresponding solid modeling procedure is established and a rational process emulation flow is proposed and a fabrication process emulator, called the NCKU Z-Fabricator is developed for emulating both MEMS and semiconductor interconnection process. For the E-beam based 3D fabrication, this work utilizes the proximity effect of E-beam lithography and uses experimental data to form the kernel function to predict the influence of key process parameters on the final structure geometry. That is, this emulator calculates the dosage of electron beam accumulation and the relationship between the dosage of electron beam and the height of photoresist under an OpenGL environment to generate 3D visualizations. By the tool, it is possible to provide guidelines for optimizing EBL performance and reducing fabrication cost. Finally, for the CMP and dresser CADs, by utilizing CA method, this emulator integrates kinematics, stress analysis, and fluid mechanics under an OpenGL environment to generate 3D visualizations for predict the material removal rate, pressure distribution, as well as the polishing uniformity of wafers and the recovery area ratio (RAR) of pads. By the developed utilities, it is possible to provide guidelines for enhancing CMP performance. In addition, the methodology used to develop these emulators could also be further applied in related novel fabrication routes such as excimer laser ablations and electroforming.

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