在IC封裝製程中，封膠材料 (EMC；Epoxy Molding Compound)在熟化成型過程中會與其他異質材料如模具表面、基板 (Substrate)以及導線架 (Leadframe)之間產生黏著的現象，稱為黏著效應 (Adhesion Effects)。過大的黏著效應會造成IC成品在脫模過程中毀損，導致封膠失敗，以及降低產品品質、可靠度等結果。但對於 基板或導線架而言，黏著效應越大，所能達到的可靠度就越高。本論文希望能夠準確的得知黏模力大小，進而找出方法來改善產品的品質。
本研究將利用本實驗室所發展完成的黏著強度量測技術與黏模力檢測設備，並使用不同的模具設計來減少溢料，以求能確實量測在封裝過程中所產生的正向黏著力及剪向黏著力，並改善量測設備穩定性。
測試後發現在合模狀態時上模需輕壓中板模，且試片不會受到任何負載，模具修改後實驗數據的標準偏差有降低的情形

During the encapsulation process of IC packages, epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion effects occur in the interface between mold surface, substrate, leadframe and EMC. An excessive adhesion force may damage an IC product during ejection and cause the package to fail and decrease the product quality and reliability. But adhesive effects are good for leadframe and substrate, because the larger adhesion force is the better reliability product can have. So this research was aimed to measure the exact values and find out the methodology to improve the quality of the products.
This research used a semi-automatic EMC adhesion force test instrument that had been developed and fabricated before. Different mold designs were used to decrease the EMC overflow in order to measure the exact normal adhesion force, and to improve the stability of test instrument.
After the test, when the newly designed mold was closed, the Top Tool would slightly touch Middle Plate Tool. The standard deviation of experiment data was found to decrease after mold modification.

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