本論文描述應用於行動裝置內部之小型天線具有對鄰近電子元件如系統封裝(SiP)電磁相容特性。此天線容易被製作來自於單層金屬平面並且主要包含一個垂直倒L形接地牆之上層天線樣式如PIFA、平面天線和迴路天線。由於垂直行動裝置之系統接地之倒L形接地牆的存在天線週遭區域可能雜散電磁場被抑制住。在這個在於天線與鄰近電子元件如系統封裝(SiP)之間的可能之電磁場論點上期望越小越好，並且移除掉降低天線性能之效應。
在這個設計的例子中將會討論與決定討論天線使用在無線網路的頻率2.412~2.485GHz之行動裝置如安全數碼卡(SD card)模組。同時討論安全數碼卡模組使用於行動裝置如VOIP/SKYPE/GSM手機針對人體的手部效應與頭部電磁吸收效率的影響。
最後針對一般傳統球型陣列封裝(BGA)使用於增加散熱的散熱片、將它當作天線應用於系統封裝(SiP)也加以討論。

A novel antenna suitable to be applied in a mobile device as an internal antenna having an electromagnetic compatibility (EMC) property with nearby conducting elements like System in Package (SiP) is presented. The antenna is easily fabricated from a single metal plate and mainly comprises a top antenna pattern like PIFA, patch, and loop antenna with an inverted-L vertical ground wall. Due to the presence of the inverted-L ground wall, which is perpendicular to the system ground plane of the mobile device, the possible fringing EM fields in the surrounding region of the antenna are suppressed. In this case possible coupling between the antenna and the nearby conducting elements like System in Package (SiP) is expected to be small, and thus degrading effects on the performance of the antenna are eliminated.
A design example of the proposed antenna including PIFA, patch antenna and loop antenna for Wireless Local Area Network (WLAN) 2412~2485 MHz operation in mobile devices like SD card module demonstrated and discussed. At the same time, the effect of SAR would be discussed refer to a human head and hand influence refer to antenna performance for mobile devices using like GSM/VOIP/ SKYPE phone application.
Finally, the heat spread using traditional BGA for enhanced thermal treats as antenna applying in SiP (System in Package) also discussed.

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