光伏導帶與矽基板間各界面的組織特性是影響光伏模組使用效率的原因之一，本研究希望透過材料的選擇以及製程方式，使光伏模組能維持優異特性，研究主要探討模組在熱電環境下之界面組織及電性。實驗中將化鍍鋅及電鍍銅後的鋁帶 (Cu•Zn/Al)浸鍍上In及In-50Sn銲料，接著回銲於矽基板上的銀膠製成In/Cu•Zn/Al及In-50Sn/Cu•Zn/Al模組，並調查模組界面微觀組織及電阻於通電試驗前後之改變。實驗結果顯示In/Cu•Zn/Al及In-50Sn/Cu•Zn/Al模組在經過通電試驗後電阻皆有上升趨勢，主要原因為銲料與銀膠界面的AgIn2層增厚。其中In-50Sn/Cu•Zn/Al模組的AgIn2增厚較不顯著，原因為銲料內In含量的減少及堆積在AgIn2上的Sn層阻礙Ag及In的擴散，使得AgIn2成長趨緩，而具有較佳的穩定性。
由於光伏模組中界面介金屬化合物 (Intermetallic compound, IMC)的增厚會導致電阻上升。本研究進一步導入In-50Sn合金帶取代傳統浸鍍型光伏導帶使製程工序與界面組織單純化。實驗結果顯示，In-50Sn模組在通電72小時及144小時後，界面組織及電阻值均沒有明顯變化。另外，為了模擬陽光照射溫度對模組之影響，本研究進行100℃熱時效測試。測試前後In-50Sn模組界面組織及電阻值均具優異穩定性，在電及熱的環境下，In-50Sn模組較In-50Sn/Cu•Zn/Al模組更具優異電性可靠度。最後，利用NaCl浸泡實驗來模擬環境因子對模組之影響，結果顯示In-50Sn合金帶並未被侵蝕，即使減量銀膠，其接合強度仍符合應用標準。
In-50Sn合金帶光伏模組在電及熱的影響下均具有優良的界面特性，不僅耐腐蝕，且對銀膠層厚度不敏感，實具有應用性，但若考慮成本及導帶本身強度，In-50Sn/Cu•Zn/Al模組也能提供太陽能產業應用評估。

The interfacial microstructure in (PV) module will affect the efficiency of solar cell. To maintain the stability of PV modules during lifetime, materials and process are selected to obtain great electrical properties. In this study, the microstructure and electrical stability under thermal and electrical circumstance are investigated.
The plated aluminum ribbons (Cu•Zn/Al) were dipped in two solders: In and In-50Sn and were reflowed on Ag paste to form In/Cu•Zn/Al and In-50Sn/Cu•Zn/Al modules. The results showed that the resistance of both modules increased because the thickness of AgIn2 layer between solder and Ag paste increased. However, the growth of AgIn2 layer in In-50Sn/Cu•Zn/Al module is not obvious, because the In content in the solder were reduced and the Sn layer on AgIn2 interface slow down the diffusion of Ag and In. So, the growth rate of AgIn2 is slower resulting in better stability.
Thickening of the intermetallic compounds (IMCs) in PV modules will lead to increment of resistance. So, the In-50Sn alloy ribbon was applied in place of dipped PV ribbon to simplify the interfacial microstructure. The results showed that after bias aging for 72hr and 144hr, microstructure and resistance remained the same. To simulate the influence of temperature, a 100°C thermal aging test was carried out. There is no significant change in microstructure and resistance after the test. Then NaCl immersion test was conducted to simulate the environmental factors, the In-50Sn ribbon was not eroded. At last, the thickness of Ag was reduced, however the bonding strength was still in accordance with the standard.
In brief, In-50Sn module has excellent stability under thermal, electrical, corrosive condition and is insensitive to thickness of silver paste. But considering the cost and the strength of PV ribbon, In-50Sn/Cu•Zn/Al module also has great property and stability.

[1] S. Wiese, R. Meier, F. Kraemer, and J. O. Bagdahn, "Constitutive behaviour of copper ribbons used in solar cell assembly processes," presented at the EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, 2009.
[2] K. J. Puttlitz and K. A. Stalter, Handbook of lead-free solder technology for microelectronic assemblies. CRC Press, 2004.
[3] Y. Tian, Q. M. Zhang, and Z. Q. Li, "Electrical transport properties of Ag3Sn compound," Solid State Communications, vol. 151, no. 20, 1496-1499, 2011.
[4] 林文宇，浸鍍與電鍍 Sn 之 Al 銲帶應用於光伏模組界面組織特性與通電機制研究。國立成功大學材料科學及工程學系碩士論文，民國106年。
[5] J. Ma, K. Man, T. O. Ting, N. Zhang, S. U. Guan, and P. W. H. Wong, "Approximate single-diode photovoltaic model for efficient IV characteristics estimation," The Scientific World Journal, vol. 2013, 1-7, 2013.
[6] C. W. Lin, F. Y. Hung, T. S. Lui, and D. J. Huang, "Study on characteristics of interfacial microstructure and electrical current mechanism in Sn-xZn/Al photovoltaic modules," Solar Energy, vol. 170, 840-848, 2018.
[7] K. J. Chen, F. Y. Hung, T. S. Lui, and W. Y. Lin, "Effects of Static Heat and Dynamic Current on Al/Zn∙Cu/Sn Solder/Ag Interfaces of Sn Photovoltaic Al-Ribbon Modules," Materials, vol. 11, no. 9, 1642, 2018.
[8] S. Wiese, F. Kraemer, N. Betzl, and D. Wald, "Interconnection technologies for photovoltaic modules-analysis of technological and mechanical problems," in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems Bordeaux, France, 1-6, 2010.
[9] S. Nieland, M. Baehr, A. Boettger, A. Ostmann, and H. Reichl, "Advantages of microelectronic packaging for low temperature lead free soldering of thin solar cells," in 22th European Photovoltaic Solar Energy Conference, Milan, Italy, 2007.
[10] H. Ma and J. C. Suhling, "A review of mechanical properties of lead-free solders for electronic packaging," Journal of Materials Science, vol. 44, no. 5, 1141-1158, 2009.
[11] P. T. Vianco and D. R. Frear, "Issues in the replacement of lead-bearing solders," The Journal of The Minerals, Metals & Materials Society, vol. 45, no. 7, 14-19, 1993.
[12] A. Z. Miric and A. Grusd, "Lead-free alloys," Soldering & Surface Mount Technology, vol. 10, no. 1, 19-25, 1998.
[13] B. Trumble, "Get the lead out![lead free solder]," IEEE Spectrum, vol. 35, no. 5, 55-60, 1998.
[14] J. Hwang, Implementing lead-free electronics. McGraw-Hill, 2004.
[15] R. Lathrop and K. Pfluke, "Novel: approaches to benchmarking solar cell tabbing solderability," in Proceedings 26th European International Conference on Photovoltaic Solar Energy Hamburg, Germany, Hamburg, Germany, 2011.
[16] C. M. Chen and S. W. Chen, "Electric current effects on Sn/Ag interfacial reactions," Journal of Electronic Materials, vol. 28, no. 7, 902-906, 1999.
[17] K. Suganuma, "Advances in lead-free electronics soldering," Current Opinion in Solid State and Materials Science, vol. 5, no. 1, 55-64, 2001.
[18] F. Y. Hung, H. M. Lin, P. S. Chen, T. S. Lui, and L. H. Chen, "A study of the thin film on the surface of Sn-3.5 Ag/Sn-3.5 Ag-2.0 Cu lead-free alloy," Journal of Alloys Compounds, vol. 415, no. 1-2, 85-92, 2006.
[19] T. H. Chuang, Y. T. Huang, and L. C. Tsao, "AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging," Journal of Electronic Materials, vol. 30, no. 8, 945-950, 2001.
[20] D. R. Frear, S. N. Burchett, H. S. Morgan, and J. H. Lau, Mechanics of solder alloy interconnects. Springer Science & Business Media, 1994.
[21] K. J. Chen, F. Y. Hung, T. S. Lui, L. H. Chen, D. W. Qiu, and T. L. Chou, "Microstructure and electrical mechanism of Sn-xAg-Cu PV-ribbon for solar cells," Microelectronic Engineering, vol. 116, 33-39, 2014.
[22] K. S. Bae and S. J. Kim, "Microstructure and adhesion properties of Sn–0.7 Cu/Cu solder joints," Journal of Materials Research, vol. 17, no. 4, 743-746, 2002.
[23] K. J. Chen, F. Y. Hung, T. S. Lui, L. H. Chen, and Y. W. Chen, "A study of green Sn-xZn photovoltaic ribbons for solar cell application," Solar Energy Materials and Solar Cells, vol. 143, 561-566, 2015.
[24] M. T. Jahn and A. R. Saavedra, "Fatigue and tensile properties of a newly developed tin-copper alloy," Journal of Materials Science Letters, vol. 11, no. 23, 1596-1598, 1992.
[25] J. W. Yoon and S. B. Jung, "Interfacial reactions between Sn–0.4 Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction," Journal of Alloys and Compounds, vol. 396, no. 1-2, 122-127, 2005.
[26] M. G. Cho, S. K. Kang, D. Y. Shih, and H. M. Lee, "Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging," Journal of Electronic Materials, vol. 36, no. 11, 1501-1509, 2007.
[27] G. Humpston and D. M. Jacobson, "Indium solders," Advanced Materials & Process, vol. 163, 45-47, 2005.
[28] P. Loiseau, P. Henry, P. Jallon, and M. Legroux, "Encéphalopathies myocloniques iatrogènes aux sels de bismuth," Journal of the Neurological Sciences, vol. 27, no. 2, 133-143, 1976.
[29] D. G. Kim and S. B. Jung, "Interfacial reactions and growth kinetics for intermetallic compound layer between In-48Sn solder and bare Cu substrate," Journal of Alloys and Compounds, vol. 386, no. 1-2, 151-156, 2005.
[30] T. B. Massalski, "Binary Alloy Phase Diagrams 2nd edn ": ASM International, 1990.
[31] H. J. Kim et al., "Effects of Cu/AI intermetallic compound (IMC) on copper wire and aluminum pad bondability," IEEE Transactions on Components and Packaging Technologies vol. 26, no. 2, 367-374, 2003.
[32] 許琳， Sn-Cu 及 Sn-Cu-Zn 光伏銅帶之模組界面組織特性與通電機制研究。 國立成功大學材料科學及工程學系碩士論文，民國105年。
[33] 莊琮貿， Sn-xNi 和 SAC105 合金應用於光伏模組之界面微觀組織特性及通電機制研究。 國立成功大學材料科學及工程學系碩士論文，民國103年。
[34] 陳郁雯， Sn-Zn 無鉛銲錫光伏銅帶之界面微觀組織特徵及剝離力研究。 國立成功大學材料科學及工程學系碩士論文 ，民國102年。
[35] F. Haddadi, D. Strong, and P. B. Prangnell, "Effect of zinc coatings on joint properties and interfacial reactions in aluminum to steel ultrasonic spot welding," The Journal of The Minerals, Metals & Materials Society, vol. 64, no. 3, 407-413, 2012.
[36] D. Ma, W. D. Wang, and S. K. Lahiri, "Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow," Journal of Applied Physics, vol. 91, no. 5, 3312-3317, 2002.
[37] "Alloy Phase Diagrams," in ASM Metals Handbook, vol. 3, 1992.
[38] L. H. Su, Y. W. Yen, C. C. Lin, and S. W. Chen, "Interfacial reactions in molten Sn/Cu and molten In/Cu couples," Metallurgical and Materials Transactions B, vol. 28, no. 5, 927-934, 1997.
[39] D. G. Kim, C. Y. Lee, and S. B. Jung, "Interfacial reactions and intermetallic compound growth between indium and copper," Journal of Materials Science: Materials in Electronics, vol. 15, no. 2, 95-98, 2004.
[40] X. J. Liu et al., "Experimental determination and thermodynamic calculation of the phase equilibria and surface tension in the Sn-Ag-In system," Journal of Electronic Materials, vol. 31, no. 11, 1139-1151, 2002.
[41] C. Y. Liu, C. Chen, C. N. Liao, and K. N. Tu, "Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes," Applied Physics Letters, vol. 75, no. 1, 58-60, 1999.
[42] J. R. Black, "Electromigration failure modes in aluminum metallization for semiconductor devices," Proceedings of the IEEE, vol. 57, no. 9, 1587-1594, 1969.
[43] J. R. Black, "Electromigration—A brief survey and some recent results," IEEE Transactions on Electron Devices, vol. 16, no. 4, 338-347, 1969.
[44] H. Ye, C. Basaran, D. C. Hopkins, D. Frear, and J. K. Lin, "Damage mechanics of microelectronics solder joints under high current densities," in 2004 Proceedings. 54th Electronic Components and Technology Conference, Las Vegas, USA, 2004.
[45] J. W. Nah, J. O. Suh, and K. N. Tu, "Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature," Journal of Applied Physics, vol. 98, no. 1, 013715, 2005.
[46] K. Suganuma, T. Murata, H. Noguchi, and Y. Toyoda, "Heat resistance of Sn-9Zn solder/Cu interface with or without coating," Journal of Materials Research, vol. 15, no. 4, 884-891, 2000.
[47] N. G. Dhere and N. R. Raravikar, "Adhesional shear strength and surface analysis of a PV module deployed in harsh coastal climate," Solar Energy Materials and Solar Cells, vol. 67, no. 1-4, 363-367, 2001.
[48] J. H. Kim, J. Park, D. Kim, and N. Park, "Study on mitigation method of solder corrosion for crystalline silicon photovoltaic modules," International Journal of Photoenergy, vol. 2014, 2014.
[49] H. H. Hsieh, F. M. Lin, F. Y. Yeh, and M. H. Lin, "The effects of temperature and solders on the wettability between ribbon and solar cell," vol. 93, no. 6-7, 864-868, 2009.
[50] 吳冠穎， 鍍銦錫光伏銅導帶模組微觀組織特性與通電機制研究。 國立成功大學材料科學及工程學系碩士論文，民國107年。
[51] C. Lejuste, F. Hodaj, and L. Petit, "Solid state interaction between a Sn–Ag-Cu-In solder alloy and Cu substrate," Intermetallics, vol. 36, 102-108, 2013.
[52] J. í. Sopoušek, M. Palcut, E. Hodúlová, and J. Janovec, "Thermal analysis of the Sn-Ag-Cu-In solder alloy," Journal of electronic materials, vol. 39, no. 3, 312-317, 2010.