本研究提出一種新穎製作銅導線於玻璃基板上的技術，不同於常見減法製程，目標在結合厚膜鋁膏印刷技術與伽凡尼氧化還原化學置換反應，實現環保、製程更加簡單快速的的金屬線路於玻璃基板上。此技術利用厚膜鋁膏的低成本、高氧化電位和多孔性結構作為置換層膜，透過在玻璃基板上塗上鋁膏。賈凡尼效應下，將還原電位比鋁高的金屬（如銅、鎳）置換 出來，並將置換出的銅層作為銅晶種層進行電鍍。這一創新方式有效解決了傳統減法製程過程中的金屬廢液體，並結合電鍍技術製作高品質銅導線。
製作銅導線的過程分為三個階段。首先，利用厚膜網版印刷鋁膏的加法製程，在模具上印刷出想要的鋁線路，接著在第二階段，通過無電鍍化學置換法，將鋁導電膏置換成金屬銅膜，避免使用有害物質，達到更高的環保標準，最後，利用厚膜鋁導電膏的多孔性結構，通過電鍍方式，將修補內部多孔結構，使結構更加緊密，提高銅導線的品質和附著力，同時降低製造成本。
在實驗過程中，厚膜鋁漿的多孔性結構會導致鋁粉形成多孔陰極，使銅離子向內滲透，形成向下填孔電鍍的機制。本研究還在厚膜鋁漿中參雜硫酸銅粉末，提供額外 的銅離子，結果表明此方法可以促進向下電鍍，並改善電性。 透過OM、SEM 微結構和數據分析，本研究探討了不同置換條件和電鍍條件下，銅線路與基板附著力之間關係，以及電鍍層的結構和厚度變化，揭示多孔陰極 結構對電鍍過程的影響機制，提出改進方法，提高電鍍質量和薄膜附著力。研究結果將為 未來在印刷在玻璃基板上應用電化學銅導線製作提供重要的理論和實驗支持，並有助於優化工藝參數，拓展該技術在其他電子材料和元件製作中的應用潛力。

This study addresses the growing need for environmentally friendly, low-cost, and high-performance interconnect fabrication for next-generation 3D/2.5D packaging. The objective is to develop a process for highly conductive copper films on rigid glass substrates, which offer low dielectric constant, low loss, and high planarity but suffer from poor adhesion.
A novel additive approach is proposed, combining aluminum conductive paste screen printing, aluminum–copper galvanic displacement, and electroplating. The aluminum layer, with its high oxidation potential and porous structure, enables selective copper deposition without costly reducing agents or vacuum equipment. Electroplating further repairs voids, enhances density, and improves adhesion.
Tests on glass substrates confirmed a continuous copper layer with excellent adhesion; tape peel showed no delamination, and pull-off strength reached 17.865 kg/cm². The method produced stable, uniform copper films for high-frequency applications while maximizing material use and avoiding copper-containing wastewater.
The results confirm the feasibility of this low-temperature, scalable, and cost-effective process, making it a promising solution for future heterogeneous integration technologies.

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