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研究生: 尤育琳
Yu, Yu-Lin
論文名稱: 高導熱塑膠材料應用在高功率LED燈泡散熱模組之熱傳分析
Heat Transfer Analysis of High-Power LED Bulb Thermal Module Using High Thermal Conductivity Plastic
指導教授: 趙隆山
Chao, Long-Sun
學位類別: 碩士
Master
系所名稱: 工學院 - 工程科學系
Department of Engineering Science
論文出版年: 2014
畢業學年度: 102
語文別: 中文
論文頁數: 107
中文關鍵詞: 高功率LED燈泡導熱塑膠散熱器扣具壓力U型熱導管
外文關鍵詞: High-Power LED Bulb, Heat sink of high Thermal Conductivity Plastic, Buckle Pressure, U-shape Heat pipe
相關次數: 點閱:141下載:7
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  • LED散熱設計之最佳理想,是能使LED在安全操作溫度範圍下長時間點亮使用,而不影響發光特性及使用壽命,且也為了LED燈全面普及化,故在價格與外型上需更加親民。本論文針對市售LED金屬散熱器做改變,讓低成本與塑型度高的導熱塑膠材料成為高功率LED燈泡之散熱器所使用。
    本研究將利用不同基板與LED導熱塑膠散熱器做散熱實驗與模擬。為了讓實驗結果不受熱阻的影響,在進行高功率散熱實驗前,需先將LED高導熱塑膠散熱器與三組不同的基板(石墨、銅、鋁)作最佳扣具壓力的量測。第一步驟,將導熱塑膠散熱器搭配不同的材質基板(銅、鋁、石墨)做高功率10W的散熱實驗;第二步驟,將實驗取的量測溫度點與模擬軟體COMSOL做相互驗證並建立出正確模擬燈具熱傳遞情形的計算流程,最後以此計算流程與現今市售的高功率LED 燈泡燈殼外型作結合,預得出較佳的導熱塑膠散熱器之最佳LED燈泡。
    實驗結果顯示,針對導熱塑膠散熱器內加裝U型熱導管 ,其溫度有明顯下降約2~3℃間,這就表示讓熱導管加入,讓導熱塑膠散熱器是可以增加散熱之效能。

    Under the safe operating temperature range, the ideal design for the LED heat transfer is not to make the long time use of LED affect light-emitting intensity and service life. Besides, to get the LED popular, the price and the appearance need to be close to people’s need . In the thesis, it is to analyze the heat transfers in the heat sink of the LED bulb, which is made of the plastic material of low cost and good thermal conductivity. The analysis is also made on the metal heat sink of the commercial LED bulb, whose results are compared to those of the plastic ones. In the study, the experimental and numerical methods are used to analyze the heat dissipation of the heat sinks with different substrates.
    The first step is to make the heat transfer tests for the plastic sink with three different substrates of copper, aluminum and graphite, using 10W power applied to the heater placed under the substrate. The second step is to use the software COMSOL to analyze the temperature fields and estimate the convection heat transfer coefficients of the sinks by comparing the measured and calculated temperatures. The third step is to make the same analysis as stated in the last step to the commercial metal sinks. From the analyses stated above, the comparisons are made among the results of different combinations of heat sinks and substrates.

    摘要 i Abstract ii 致謝 vi 目錄 vii 表目錄 xi 圖目錄 xiii 符號說明 xviii 第一章 緒論 1 1-1 前言 1 1-2研究動機與目的 2 1-3文獻回顧 4 1-4研究方法 8 第二章 理論基礎 16 2-1 LED發光原理 16 2-2 LED晶片原理 18 2-3 散熱基板之作用與種類 20 2-3-1印刷電路板(Printed circuit board,PCB) 21 2-3-2金屬基印刷電路板(Metal Core PCB,MCPCB) 22 2-3-3 陶瓷基板(Ceramic Substrate) 23 2-4導熱塑膠之介紹 25 2-5 熱導管基本理論與工作原理 26 2-5-1 基本原理 26 2-5-2 工作原理 27 2-6 LED熱傳遞 28 2-6-1 熱傳導 28 2-6-2 熱對流 29 2-7熱阻與扣具壓力之關係 29 2-7-1 熱阻定義 29 2-7-2扣具壓力與接觸熱阻之關係 30 第三章 實驗方法與設備 41 3-1 實驗目的與方法 41 3-2實驗模組 43 3-2-1熱源塊 43 3-2-2散熱基板 43 3-2-3熱介面材料 44 3-2-4散熱鰭片 44 3-2-5熱導管 44 3-2-6電木 45 3-2-7熱電偶 45 3-3 實驗設備 45 3-3-1熱電偶點銲機 45 3-3-2手持式電子溫度計 46 3-3-3溫度擷取系統 46 3-3-4真空烘箱 47 3-3-5數位式推拉力計 47 3-3-6手動式升降載台 47 3-3-7電源供應器 48 3-3-8數位式電力計 48 第四章 數值模擬 62 4-1 設計流程 62 4-2 COMSOL軟體介紹 62 4-3 數值模型介紹 64 4-4 系統環境參數設定 65 4-4-1 統御域設定 65 4-4-2 邊界設定 66 4-4-3 網格設定 67 第五章 結果與討論 75 5-1高導熱塑膠散熱實驗前的條件設定 75 5-2散熱模組A與散熱模組B之比較 77 5-3散熱模組B與散熱模組C之比較 79 5-4散熱模組(實驗)與模擬之比較 80 5-4-1散熱模組B與模擬關係 81 5-4-2散熱模組C與模擬關係 82 5-5模擬改變高導熱散熱器外觀---增加鰭片數量 83 5-5-1新型導熱塑膠散熱器外型與散熱模組B(銅基板)以及市售高功率LED燈泡模擬之比較 84 第六章 結論 103 參考文獻 105

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