為了進ㄧ步提升酚醛樹脂的熱性質，本研究同時將奈米黏土蒙脫土(Montmorillonite)與硼導入酚醛樹脂中，以in-situ聚合法來製備蒙脫土/硼酚醛樹脂奈米復合材料，期望可以達到現今耐燒蝕高功能性酚醛樹脂的需求。實驗室之前研究發現[1]，含有苯環的改質劑，因與酚醛樹脂有相似結構，可以提高酚醛樹脂與奈米黏土間的相容性，進而提高材料的熱性質。本研究選用三種含有Benzyl-的改質劑，分別為Benzyldimethylhezadecylammonium chloride (MH)、Benzyldimethylphenylammonium chloride (MP)，以及Benzyltriethylammonium chloride (BE)。複合材料命名方式以改質劑名稱-蒙脫土含量來表示，舉例來說，MH-10%是用MH改質蒙脫土來製備的酚醛樹脂複合材料，百分比是指改質蒙脫土含量是酚重量百分比的10 %；MH-B10%則是MH系列含硼的複合材料，改質蒙脫土含量是酚重量百分比的10 %，B是取硼(Boron)的意思。經由XRD的分析與TEM的觀察，含硼的複合材料MH-B10%、MP-B10%和BE-B10%，蒙脫土的矽酸鹽層均可以達到一定的分散，均勻分散在複合材料裡面。以TGA測量在氮氣下10 %熱裂解溫度(Decomposition temperature, Td)都在520 oC以上。其中最好的是MP系列，Td都在560 oC左右，Residual weight也都在70 %以上。

In order to further upgrade thermal stability of the phenolic resins, we combine boron and clay with phenolic resins to prepare nanocomposites. Clay (Montmorillonite)/boron-containing phenolic resin nanocomposites have been successfully prepared using in-situ polymerization of resol-type phenolic resins. Clay such as montmorillonite was modified by benzyldimethylhexadecylammonium chloride (MH), benzyldimethyphenylammonium chloride (MP), and benzyltriethylammonium chloride (BE). X-ray diffraction measurements and transmission electron microscope (TEM) observations showed that clay platelets were partially exfoliated after complete curing of phenolic resins. The cured nanocomposites were named as modifier-MMT contents and boron-containing nanocomposites named as modifier-B-MMT contents (B means boron), for example, MH-10% or MH-B10%. Thermogravimetric analysis showed that thermal decomposition temperature (Td) of cured boron-containing nanocomposites are more than non-boron ones. For example, the raise in decomposition temperature of MP-B10% (from 523 to 568 oC) is about 45 oC, respectively, whereas the enhancement in char yields is 9.6% (from 63.4% to 73.0%).

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