在IC封裝的1st level中，金線的偏移是個常見的問題，因為除了會直接影響到產品的壽命之外，亦會對產品品質有重大影響。金線偏移問在封裝的尺寸變小時會更突顯出來，如何將其偏移量控制在可以接受的範圍之下使產品的品質提昇便是個重要的課題。

　　在本文中，使用3D的模流分析軟體MoldFlow來模擬當環氧樹酯充填入模穴中時的膠體流動情形，模擬後再量得金線上的速度和黏度。經換算之後可以將流速和黏度轉為受力，再利用有限元素分析軟體來分析金線受力偏移的情形。

　　最後對一些加工參數相對於不同的金線尺寸、半徑和材料來進行模擬，並使用田口方法分析，找出最佳的製程參數。

　In the 1st level in IC package, wire sweep is a common problem. It will not only affect the life of a product but also the quality. Wire sweep becomes more serious as the package size decrease. So it’s an important　task to the vale of sweep under an acceptable range.

　In the paper, we use 3D software “MoldFlow” to simulate the injection process, and then get the data on the nodes of the gold wires, finally answer the drag forces. By using ANSYS, we impose the forces on the wires and the value of wire sweep will be shown.

　To the end, we use Taguchi Method to analysis different wire profile under different processing condition, and get the best design.

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[15] ANSYS5.5教育版Help Menu

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