本研究探討鋅錫系合金高溫無鉛銲錫的開發及其相關性質，探討 Zn-25Sn-xGa-yAl (x＝0、0.1、0.3 和 0.5，y=0、0.15 和 0.45) 等合金的顯微結構、熱性質、硬度、氧化行為以及潤濕行為。
顯微結構分析結果顯示，鎵元素與鋁元素的添加都會造成錫鋅共晶組織中針棒狀富鋅相減少的現象。熱分析結果顯示，添加鎵與鋁元素的鋅錫鎵鋁四元合金其固相線與液相線溫度均低於 Zn-25Sn。硬度分析結果顯示，鎵與鋁的添加會提升合金的硬度。高溫氧化測試結果顯示，在氧化初期，四元合金中鎵含量與鋁含量的增加都會提高合金的氧化速率；在氧化後期，四元合金中鎵含量的增加會提高合金的氧化速率，而鋁含量的增加可以降低合金的氧化速率。本研究以潤濕天平探討鋅錫鎵鋁四元合金的潤濕性，研究結果顯示此四元合金的潤濕性優於Zn-25Sn與傳統95Pb-5Sn合金；增加鎵含量可以提升銲錫的潤濕性，而增加鋁含量會降低銲錫的潤濕性。鋅錫鎵鋁四元合金與銅基板間的潤濕行為在界面生成介金屬化合物，所生成的界面介金屬化合物為(Cu,Al)5Zn8與(Cu,Al)Zn5。

The microstructure, thermal properties, hardness, oxidation behaviors and wetting properties of lead free Zn-25Sn-xGa-yAl (x＝0, 0.1, 0.3, and 0.5; y=0, 0.15, and 0.45) solders were investigated.
The results show that the addition of Ga and Al elements reduced the needle-like Zinc-rich phase of the eutectic Sn-Zn structure. The thermal analysis shows that the solidus and liquidus temperatures of Zn-Sn-Ga-Al are lower than that of Zn-25Sn. The addition of Ga and Al increases the micro-hardness of Zn-25Sn. The oxidation test indicates the addition of Ga and Al increases the oxidation rate in the reaction control stage. Afterwards, the oxidation rates decrease and increase in the diffusion control stage for the addition of Al and Ga, respectively. In this study, the wettability of Zn-Sn-Ga-Al was investigated with wetting balance method and was found to be better than that of Zn-25Sn and traditional 95Pb-5Sn solders. The addition of Ga enhances the wettability while Al degrades the wettability. The wetting behavior was found to be accompanied by the formation of interfacial intermetallic compound. The intermetallic compounds formed between Cu substrate and Zn-Sn-Ga-Al solder were (Cu,Al)5Zn8 and (Cu,Al)Zn5.

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