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研究生： 黃文嶸
Huang, Wen-Rong
論文名稱： 表面處理對牙科複合樹脂與鈦金屬間鍵結行為研究
Effect of Surface Treatment on Bonding behavior between Dental Composite Resin and Titanium
指導教授： 朱建平
Ju, Chien-Ping
陳瑾惠
Chern Lin, Jiin-Huey
學位類別： 碩士
Master
系所名稱： 工學院 - 材料科學及工程學系
Department of Materials Science and Engineering
論文出版年： 2020
畢業學年度： 108
語文別： 中文
論文頁數： 75
中文關鍵詞： 牙科複合樹脂 、純鈦 、Ti-7.5Mo 、剪切鍵結強度 、ISO 10477 、SR Nexco
外文關鍵詞： dental composite resin, pure titanium, Ti-7.5Mo, shear bond strength test, ISO 10477, SR Nexco
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    • 本研究主題關注於牙科複合樹脂SR Nexco和商業純鈦(Grade 2)、Ti-7.5Mo合金之間的鍵結行為。本次實驗的試片製備和剪切鍵結強度試驗方法依ISO 10477規範要求進行。本實驗先將純鈦和Ti-7.5Mo用砂紙研磨到1000號，再進行表面處理，並搭配不同的Opaquer光聚合條件，希望藉此找到最佳鍵結強度的參數，有經過表面處理後的試片鍵結強度有所提升，Opaquer光聚合條件會對鍵結強度產生影響。最後進行ISO 10477所要求的冷熱循環水浴測試。進行冷熱循環水浴測試後所有參數的試片其鍵結強度皆降低，有經過表面處理的試片鍵結強度依然高於未處理的對照組。冷熱循環水浴測試後鍵結強度下降是因為牙科複合樹脂和純鈦、Ti-7.5Mo的熱膨脹係數存在著巨大的差異。

    This thesis is about bonding behavior between dental composite resin (SR NexcoⓇ) and Titanium(commercially pure titanium-Grade 2&Ti-7.5Mo alloy). All specimens preparing process and shear bond test method followed by ISO 10477 specification. In this experiment, pure titanium and Ti-7.5Mo were mechanically polished with successive grades sandpapers down to 1000 grit, and then the surface treatment was carried out, and matched with different Opaquer curring conditions, hoping to find the best bonding strength parameters. The bonding strength of the specimens after surface treatment has been improved, and then Opaquer curring conditions will affect the bonding strength. Finally, specimens performed thermocycling test required by ISO 10477. The result of thermocycling test shows degradation in bonding strength, and the bonding strength of the specimens with the surface treatment was still higher than the untreated specimens.The degradation in bonding strength is due to the huge difference in the thermal expansion coefficient between dental composite resin and titanium.

    總目錄 第一章 緒論 11 1-1.前言 11 1-2.研究目的 12 第二章 文獻回顧 13 2-1.牙科材料分類 13 2-2. 金屬-鈦與鈦合金 13 2-3 陶瓷 16 2-4.牙科複合樹脂 17 2-5.牙科複合樹脂與金屬鍵結 24 2-6.複合樹脂接著劑 25 2-7.表面處理 33 第三章 實驗方法 34 3-1.實驗流程 34 3-2.實驗藥品 41 3-3實驗儀器 42 3-4試片製備 35 3-5.實驗結果評估 39 第四章 結果與討論 45 4-1. 表面處理後試片外觀 45 4-2 SEM表面形貌觀測 48 4-3. 表面處理後純鈦和SR Nexco複合樹脂的鍵結強度 53 4-4 純鈦和Ti-7.5Mo塗佈SR Nexco複合樹脂的鍵結強度比較 67 第五章 結論 71 第六章 參考文獻 72 表目錄 表2-2-1. 純鈦的物理性質 15 表2-2-2 ASTM純鈦分類 15 表2-5-1. 人工燒瓷牙冠和複合樹脂的比較 25 表3-2-1. SR Nexco各項藥劑之成分 41 表3-4-1. Lumamat 100的 四種程式控制之詳細內容 38 表4-3-1.不同條件下Shear bond strength測試結果 54 表4-3-2. A溶液電化學中不同處理時間下剪切鍵結強度測試結果 56 表4-3-3. B溶液電化學中不同處理時間下剪切鍵結強度測試結果 57 表4-3-4浸泡1M C溶液不同時間下剪切鍵結強度測試結果 59 表4-3-5浸泡3M C溶液不同時間下剪切鍵結強度測試結果 60 表4-3-6浸泡5M C溶液不同時間下剪切鍵結強度測試結果 61 表4-3-7.不同Opaquer光聚合條件下剪切鍵結強度測試結果 63 表4-3-8. 冷熱水浴循環前後剪切鍵結強度測試結果 65 表4-4-1. 純鈦和Ti-7.5Mo剪切鍵結強度測試結果 67 表4-4-2. 冷熱循環後純鈦和Ti-7.5Mo剪切鍵結強度測試結果 69 圖片目錄 圖2-4-1. γ-methacryloxypropyl trimethoxysilane矽烷偶合劑之分子結構式 18 圖2-4-2.Bis-GMA分子結構式 19 圖2-4-3. TEGDMA分子結構式 19 圖2-4-4. UDMA之分子結構式 20 圖2-6-1. VBATDT分子結構圖 27 圖2-6-2. VBATDT的互變異構體，分別為二硫酮（dithione）、硫酮-硫氫（thione-thiol）、二硫氫（dithiol） 28 圖2-6-3. MTU-6分子結構圖 29 圖2-6-4. MDDT分子結構圖 29 圖2-6-5. MEPS分子結構圖 29 圖2-6-6. 10-MDP單體分子結構圖 31 圖2-6-7. SR Link作用示意圖 32 圖3-1-1. 實驗流程圖 34 圖3-4-1. 電化學裝置示意圖 36 圖3-2-2. 浸泡化學溶液示意圖 37 圖3-3-1. ISO 10477規範中量測shear bond strength之夾具示意圖 40 圖3-3-2. 三種破裂模式之示意圖 40 圖3-5-1 研磨拋光機 42 圖3-5-2 離心鑄造機(Selec TICAST SUPER®R) 42 圖3-5-3 線性直流電源供應器 42 圖 3-5-5 bre.Lux PowerUnit光聚合機 43 圖 3-5-6 Lumamat 100 光聚合機 43 圖3-5-7. RCB-412冷熱循環處理水浴槽 44 圖 3-5-8 熱燈絲式SEM(JEOL JSM-6510) 44 圖 3-5-9場發射SEM(HITACHI SU8000) 44 圖4-1-1. 純鈦和Ti-7.5Mo經過噴砂處理後的外觀 45 圖4-1-2. 純鈦試片經過A溶液電化學處理後的外觀 45 圖4-1-3. Ti-7.5Mo試片經過A溶液電化學處理後的外觀 46 圖4-1-5. Ti-7.5Mo試片經過B溶液電化學處理後的外觀 47 圖4-1-6. 純鈦和Ti-7.5Mo浸泡X M C溶液後的外觀 47 圖4-2-1. 純鈦經過A溶液電化學處理TA3 min和TA2 min (5000倍和10000倍) 48 圖4-2-2. 純鈦經過A溶液電化學處理TA3 min和TA2 min(80000倍) 48 圖4-2-3. 純鈦經過B溶液電化學處理TB3 min和TB2 min (5000倍和10000倍) 49 圖4-2-4. 純鈦經過B溶液電化學處理TB3 min和TB2 min (80000倍) 50 圖4-2-5. 純鈦浸泡X M C溶液TC2 min和TC3 min(5000倍和10000倍) 50 圖4-2-6. 純鈦浸泡X M C溶液TC2 min和TC3min(80000倍) 51 圖4-2-7. Ti-7.5Mo經過B溶液電化學處理TB3分鐘(5000倍和10000倍) 51 圖4-2-8. Ti-7.5Mo浸泡X M C溶液TC2 min (5000倍和10000倍) 52 圖4-2-9. 純鈦經過噴砂處理後(5000倍和10000倍) 52 圖4-2-10. Ti-7.5Mo經過噴砂處理後(5000倍和10000倍) 53 圖4-3-1.不同表面處理下剪切鍵結強度測試結果 54 圖4-3-2. A溶液電化學中不同處理時間下剪切鍵結強度測試結果 56 圖4-3-3. B溶液電化學中不同處理時間下剪切鍵結強度測試結果 57 圖4-3-4浸泡X M C溶液不同時間下剪切鍵結強度測試結果 59 圖4-3-5浸泡Y M C溶液不同時間下剪切鍵結強度測試結果 60 圖4-3-6浸泡Z M C溶液不同時間下剪切鍵結強度測試結果 61 圖4-3-7.不同Opaquer光聚合條件下剪切鍵結強度測試結果 63 圖4-3-8.冷熱水浴循環前後剪切鍵結強度測試結果 65 圖4-4-1. 純鈦和Ti-7.5Mo剪切鍵結強度測試結果 67 圖4-4-2. 冷熱循環後純鈦和Ti-7.5Mo剪切鍵結強度測試結果 69

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