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研究生：	歐旭峯 Ou, Hsu-Fong
論文名稱：	微小元件流體自我組裝技術之研究 The Research of Small Devices Binding by Fluidic Self-Assembly Techniques
指導教授：	周榮華 Chou, Jung-Hua
學位類別：	碩士 Master
系所名稱：	工學院 - 工程科學系碩士在職專班 Department of Engineering Science (on the job class)
論文出版年：	2006
畢業學年度：	94
語文別：	中文
論文頁數：	98
中文關鍵詞：	自我組裝單分子層、流體自我組裝、組裝基版、接觸角、親水性、疏水性
外文關鍵詞：	Fluidic self assembly, contact angle, Hydrophilic, Hydrophobic, Substrate, SAMS
相關次數：	點閱：219 下載：2
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隨著元件微小化的趨勢，傳統pick and place 組裝方式已無法持續降低組裝成本，因此如何增加組裝效益及降低成本，便是發展流體自我組裝技術的最大動力。本研究以 1mm´1mm正方的矽晶片高溫氧化使其表面形成SiO2後，嘗試以銅或電鍍錫材質的substrate，以實驗方法找出具較佳黏附力的Self-Assembly Monolayer ( SAM)。再設計並製作自我組裝實驗之循環設備，將表面塗佈SAM 的小型元件及substrate進行流體組裝實驗；利用最終的binding rate 的結果，探討不同組裝pattern、組裝元件數量及循環組裝次數與binding rate的關係，再加以進行提升binding rate 的改善。
由實驗結果發現；Dodecanethiol 對於SiO2 與銅材質的substrate 具有較佳的黏附力；挑選Dodecanethiol 為SAM 時，投入組裝之小型元件數量及循環組裝次大略與binding rate 成正相關。但實驗設備的流場狀況、組裝pattern形狀、實驗設備材質皆會影響binding rate。
最後本研究著重提升binding rate分為兩大部分執行：一、嘗試不同塗佈SAM 的方法，將substrate 及小型元件乾燥後再塗佈SAM，由contact angle 的變化證明可延長表面疏水特性。二、改善組裝渠道內流場分布；減少solid boundary對流場的影響，由實驗結果發現不同組裝pattern，均勻流場對整體binding rate 具有30 % 左右的提升；而在binding rate 改善實驗中也得到：最佳投入元件數量及循環組裝時間有助於最短時間內達到最佳binding rate的結論。

Abstract
Recently, more and more optical or semiconductor devices are getting smaller by new generation production process. How to reduce packing cost will be an important issue for smaller devices. Conventional “pick & place” assembly methods will get the bottleneck to reduce the assembly cost. At that time, “pick and place “will not get used to assemble a large number of parts which scale is from micrometer to nanometer.
To accomplish efficient assembly of a very large number of small components and self- assembly methods will offer different ways to solve these problems. In business field, “Alien Tech company” using Fluidic Self-Assembly methods develop RFID packing technology.
This research, we will attempt to find out factors of FSA which effects binding rate. First we refer some related papers and choose 4 kinds of SAMs to coat the surface of silicon dioxide and substrate to compare the binding force. Then we designed and made the equipment to perform the FSA binding trial。
In the experiment condition, we use the 1mm×1mm SiO2 blocks as small devices and copper and electroplated Sn material as substrate. Tried to observe and find out important factors, which affect the binding rate mostly. Finally we modified coating SAMs methods and improve the trial steps to raise the binding rate.
The results show that how is important to choose suitable SAM、devices and substrate. And correct coating SAM methods and fluidic flowing field will be other important factors to affect FSA binding rate.
Keywords: Fluidic self assembly、SAMS、Substrate、Hydrophobic、Hydrophilic、contact angle

中文摘要                                                   Ⅰ
英文摘要                                                   Ⅲ
誌謝                                                       Ⅳ
目錄                                                       Ⅴ
表目錄                                                     X 
圖目錄                                                     XI 
第一章 序論
1-1. 前言                                               1
1-2. 研究動機與目的                                    
  1-2-1. 經濟量產上的瓶頸                               2
  1-2-2. 除重力外對微小元件的影響                       2
  1-2-3. 流體自我組裝技術的優點                         3
1-3.文獻回顧                                            4
  1-3-1. 利用幾何互補性自組裝的方法                     5
  1-3-2. 自組裝單分子層 (SAM) 的研究                    6
  1-3-3. 微小元件運載方式之研究                         7
  1-3-4. 自組裝技術的運用                               8
第二章 FSA理論分析                                      17
2-1. 接觸角的定義                                       17
2-2. 元件表面塗佈SAM 前的清潔技術                       19
2-3. 元件表面改質                                       19
2-4. 可能影響自我組裝因素的探討                         21
2-5. 本文研究FSA之實驗簡述                              22
第三章	實驗設備、目的與步驟                           30
3-1. 循環組裝實驗設備  
  3-1-1.丙烯醇類壓克力實驗循環水槽乙座                  30
  3-1-2.FSA 實驗條件設計                                31
  3-2-1. Substrate                                      31
  3-2-2. 微小元件1mm*1mm SiO2                           31
  3-2-3. SAM                                            31
  3-2-4. Reynolds number 的計算                         32
3-3.實驗目的:                                           32
  3-3-1.實驗一目的                                      32
  3-3-2 .實驗二目的                                     32
  3-3-3. 實驗三目的                                     33
  3-3-4. 實驗四目的                                     34
3-4.實驗步驟                                            34
  3-4-1.微小元件取樣方法                                34
  3-4-2.實驗一步驟                                      34
  3-4-3.實驗二步驟                                      35
  3-4-4.實驗三步驟                                      36
    3-4-4-1. Substrate 塗佈SAM 方式的比較               36
    3-4-4-2. 改善實驗設備之整流效果                     37
  3-4-5.實驗四步驟                                      37
第四章 實驗結果與討論
4-1. Substrate與微小元件塗佈不同SAM pre-binding狀況     44
  4-1-1.Pre-bindinig 實驗結果                           44
4-2. 不同SAM pattern 與表面binding rate的關係           45
  4-2-1. SAM pattern 為 cross pattern                   45
  4-2-2. SAM pattern 為 horizontal pattern              47
  4-2-3. SAM pattern 為 vertical pattern                49
  4-2-4. SAM pattern 為 45度 shape pattern              50
4-3. Binding rate 良率改善實驗                          52
  4-3-1. SAM 塗佈方式改善                               51
  4-3-2.改善 binding rate 實驗                          54
  4-3-3. 實驗結果分析                                   54
    4-3-3-1.SAM pattern 為 horizontal pattern           54
    4-3-3-2.SAM pattern 為 vertical pattern             55
    4-3-3-3. SAM pattern 為45 度 pattern                56
4-4.驗證模擬實驗                                        57
第五章	結論與未來研究建議                             80
5-1.影響實驗binding rate 的因素                         80
  5-1-1.整流效應對微小元件載送的影響                    80
  5-1-2. 微小元件的疏水特性                             80
  5-1-3. SAM於載體中被稀釋，binding 有時效性限制        81
  5-1-4.微小元件、substrate及驗設備材質的選定           81
  5-1-5.經濟元件數量及循環組裝次數                      82
5-2. 未來研究建議                                       83
  5-2-1. 微小元件、substrate、SAM及工作載體相容性的研究 83
  5-2-2. 實驗設備的改善                                 83
  5-2-3. SAM 濃度及塗佈方法研究                         83
  5-2-4. 微小元件定向binding 的問題                     84
參考文獻                                                85
附錄                                                    94
自述                                                    98


                                    

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