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研究生: 王品嫺
Wang, Pin-Xian
論文名稱: 微奈米銅粉合成及分散之研究
A study on the preparation and dispersion of micro/nano copper particles
指導教授: 雷大同
Lei, Da-Tong
學位類別: 碩士
Master
系所名稱: 工學院 - 資源工程學系
Department of Resources Engineering
論文出版年: 2011
畢業學年度: 99
語文別: 中文
論文頁數: 96
中文關鍵詞: 微奈米銅粉分散明膠阿拉伯膠
外文關鍵詞: micro/nano copper particles, dispersed, gelatin, gum arabic
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  • 微奈米銅粉擁有許多特性如表面活性高、良好的導電及導熱性能、低熔點、非常低的電阻值等,與貴金屬導體相比價格低廉,因此在許多方面極具發展潛力與應用價值,而這些特性都是由於微奈米銅粉的尺寸非常小,使其具有極大的表面積而導致。
    本研究以硫酸銅為前驅鹽、次亞磷酸鈉為還原劑,利用化學還原法合成分散性佳、粒徑均一之微奈米銅粉。以Bloom number 300明膠(G1)、Bloom number 75-100明膠(G2)及阿拉伯膠為分散劑,所得銅粉以XRD、BET、SEM及TEM進行分析。分散劑分子量越高所得之銅粉一次粒子及二次粒子越大,其添加量也越多;以連續定量方式加入反應槽進行還原,由於溶液中Cu2+濃度變化較小,可改進銅粉粒徑之均一性。使用明膠(G2)時銅粉有最小一次粒子(20 nm)與二次粒子(100 nm);添加阿拉伯膠可得均一性及分散性最佳之銅粉,其一次粒子及二次粒子粒徑分別為40 nm與250 nm。

    Micro/nano copper particles show a wide variety of unique properties, such as high surface activity, high electrical and thermal conductivity, relatively low melting temperature. Its price is much cheaper than precious metals. Thus they have significant potential for many applications. Such unique properties arise from their small sizes which correspond to their high surface area.
    Well dispersed and narrow-sized micro/nano copper particles were prepared using chemical reduction method with CuSO4 as the precursor, NaH2PO2 as the reducing agent, and bloom number 300 gelatin(G1), bloom number 75-100 gelatin(G2) and gum arabic as the dispersants. Characterization of copper particles was performed by XRD, BET, SEM and TEM. For high molecular weight dispersants, the sizes of the primary particles and secondary particles and the dosage of dispersant also increase. When CuSO4 solution was added dropwisely, the size distribution of copper particles was narrowed, which probably is due to small Cu2+ concentration change. The sample of smallest primary particle(20 nm) and secondary particle(100 nm) was obtained when gelatin(G2) was used as dispersant. The best result of well dispersed and narrow-sized copper particles were obtained by using gum arabic as dispersant, the size of primary particle and secondary particle was 40 nm and 250 nm respectively.

    摘要 I Abstract III 誌謝 IV 目錄 V 表目錄 VIII 圖目錄 IX 第1章 緒論 1 1.1研究動機 1 1.2 研究目的 2 第2章 理論基礎與前人研究 3 2.1金屬粉末之製備方法 3 2.2 銅粒子之製備方法 7 2.2.1化學還原法 7 2.2.2其他方法 10 2.3化學還原反應(Chemical reduction reaction) 12 2.3.1化學還原反應機制 12 2.3.2溶液中顆粒之生成機制 14 2.4 顆粒間之作用力 17 2.4.1凡得瓦爾力(van der Waals Forces) 19 2.4.2靜電排斥力(Electrostatic Forces) 19 2.4.3空間排斥力(Steric Forces) 21 2.4.4靜電空間作用力(Electrosteric Forces) 23 2.5分散劑(Dispersants) 25 2.5.1無機鹽類(Inorganic acid salts) 25 2.5.2界面活性劑(Surfactants) 26 2.5.3低中分子量之聚合物(Low to medium molecular weight polymers) 28 第3章 實驗 31 3.1材料藥品 31 3.2設備 31 3.3實驗步驟 32 3.4性質分析 34 3.3.1 X光繞射分析(X-ray Diffraction, XRD) 34 3.3.2 掃描式電子顯微鏡影像分析(Scanning Electron Microscopy, SEM) 34 3.3.3 穿透式電子顯微鏡(Transmission electron microscope, HR-TEM) 34 3.3.4 比表面積測定(BET) 35 3.3.5紅外線光譜分析儀(Fourier Transform InfraRed spectrometer , FT-IR) 35 第4章 結果與討論 36 4.1分散劑添加量對銅粉性質之影響 37 4.1.1無分散劑 38 4.1.2分散劑明膠300 (G1) 41 4.1.3分散劑明膠75/100(G2) 47 4.1.4分散劑阿拉伯膠(A) 53 4.1.5分散劑添加量與銅粉粒徑之關係 59 4.2連續法製備之銅粉 62 4.2.1無分散劑 62 4.2.2分散劑明膠75/100(G2) 65 4.2.3分散劑阿拉伯膠(A) 71 4.2.4前驅鹽添加方式及濃度之影響 78 4.3明膠對銅粉之分散機制 80 4.4阿拉伯膠對銅粉之分散機制 82 第5章 結論 84 參考文獻 86 附錄A SEM粒徑分佈 94

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