本研究首先探討以錫膏網印方式製作的銲錫隆點(Solder Bump)，經過不同可靠度測試環境條件的試驗後，所發生的界面反應和其剪力強度變化，並進一步了解其破壞機制；並將銲錫隆點以覆晶接合的方法，配合晶片和基板所設計的線路以量測電性變化，探討經不同環境條件試驗後銲錫接點的阻抗變化與材料反應行為的關係。

觀察銲錫隆點界面反應可知，以Ni-P/Au作為銲錫隆點底層金屬會生成Ni3Sn4，經時效熱處理後，銲錫和Ni3Sn4間會生成(AuXNi1-X)Sn4化合物，時效溫度越高其生成量越多，進而會抑制Ni3Sn4化合物的成長。從剪力測試的實驗結果得知，初始重流(reflow)完成的銲錫隆點其剪力強度約為50g，且剪力測試後之破斷面皆位於鉛錫合金中，經過多次重流、高溫時效和恆溫恆濕試驗後，銲錫隆點剪力強度會隨重流次數和熱處理時間增加而降低，且下降幅度最大是經多次重流試驗，其次是高溫時效試驗，最小為恆溫恆濕試驗，所有試驗的破斷位置都位於鉛錫合金，表示其剪力強度下降並不受到介金屬化合物的影響，可見經可靠度試驗後銲錫界面間的結合強度仍優於鉛錫合金。

覆晶接合試片經不同環境條件試驗後，從多次重流、高溫時效試驗發現，銲錫接點阻抗會隨著介金屬化合物成長而增加，此外銲錫接點在高溫時效環境下其阻抗值還會受高溫氧化和缺陷減少等因素影響。另外經恆溫恆濕和熱循環試驗後，可以發現在這兩種環境試驗下容易使得銲錫接點阻抗大幅上升，而導致其大幅上升的主因並不是介金屬化合物成長。經恆溫恆濕試驗之結果，推測其可能因素為濕氣造成部份線路腐蝕短路以及銲錫氧化，使得平均阻抗增加；熱循環試驗則由於材料間熱膨脹係數不同，產生熱應力導致裂縫生成，除了減少銲錫接點接觸面積，最終還可能造成整個銲錫接點斷路。

The objective of this research was to investigate the mechanical and electrical properties of solder bumps produced with solder paste by printing. The shear strength of solder bumps and the interfacial reaction behavior between solder and UBM was investigated after reliability tests. Besides, it was also to measure the electrical resistance of flip chip bonded solder joints and to investigate the correlation between the change of the electrical resistance and the reaction behavior of the materials after different environmental tests.

The interfacial investigation of solder bump indicated that Ni3Sn4 was formed. It was also observed that the (AuXNi1-X)Sn4 was formed between the Ni3Sn4 layer and solder after aging. A raise in aging temperature enhances the growth of (AuXNi1-X)Sn4 and inhibits the growth of Ni3Sn4. The average shear strength of solder bumps after reflow was about 50g, and the fracture occurred at the solder. It was also found that the shear strength of solder bumps was decreased with reflow times and aging time. But the fracture still occurred at the solder after reliability tests. The experimental results revealed that the lowering in shear strength was not induced by intermetallic compounds. The intermetallics exhibit a good adhesion between solder and UBM after reliability tests.

The electrical test results showed that the increase of electrical resistance of solder joints after the multiple reflow test and high temperature storage test was ascribed to the growth of intermetallic compounds. In addition, the oxidation of solder and elimination of defects also affect the electrical resistance of the annealed solder joints. Furthermore, it was found that the electrical resistance of the solder joints greatly increases after the humidity-temperature test and thermal cycling test. The humidity-temperature test affect the electrical resistance of solder joints through the circuit corrosion and oxidation of solder. The thermal cycling test resulted in the formation of crack which caused the solder joint failure.

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