本論文旨在應用分離式霍普金森桿（split Hopkinson pressure bar, SHPB）實驗架構，來探討多種銲錫材料在高應變率下的材料行為。本論文中所研究之銲錫材料，涵蓋了傳統封裝產業中所使用之錫鉛合金Sn63Pb37、Sn10Pb90，以及因應國際上環保意識的需求所產生之無鉛銲錫合金SAC105、SAC305，以及SAC405。實驗中之各種材料在動態實驗中承受了應變率範圍400 ~ 3,000 s-1的條件，並在高應變率下的動態應力-應變曲線中顯現出了三階段的變形：彈性-應變硬化-飽和應力。除了高應變率材料特性外，本研究也嘗試量測銲錫材料在擬靜態壓縮實驗中之低應變率特性，並與高應變率下之實驗結果作比較，以探討應變速率對於各種銲錫材料在機械性質上產生的影響。此外，本研究也初步探討了試片製程中冷卻速率對於無鉛銲錫SAC305之高應變率機械性質的影響，並藉由光學顯微鏡的觀察來評估SAC305材料微觀性質的差異對於動態特性造成的改變。結果顯示較快的冷卻速率能夠提升材料在動態應力-應變曲線中的流應力值。總體而言，實驗結果經由巨觀的合金成分以及微觀的結構組成，分析與比較其間的差異性，藉以評估其對銲錫材料動態特性之影響，期許能建構出完整的銲錫材料資料庫，以利工程師在錫球接點可靠度上之分析及預測。

The main goal of this thesis is to study the high-strain-rate bulk properties of several kinds of solder materials with the use of SHPB (split Hopkinson pressure bar) apparatus. The solder materials in current study include traditional lead-tin solders Sn63Pb37, Sn10Pb90, and lead-free solders SAC105, SAC305, and SAC405 which become an inevitable tendency due to the awareness of environmental protection. Specimens were tested at strain rates range from 400 ~ 3,000 s-1 during high strain rate tests. The tested samples experienced a deformed process with three steps: elasticity, strain hardening, and saturation stress. Besides, we try to measure the quasi-static properties of solder materials and compare the results with high strain rate tests in order to discuss the strain-rate effect on the solder materials studied. Moreover, the cooling-rate effect of SAC305 at high strain rates was primarily discussed with SHPB tests and OM observations. The results showed that faster cooling rate could enhance the flow stress on stress-strain curves. Overall, we concluded the results from the compositions of different solder materials and microstructure observation. With the establishment of the database for solder materials, the solder joint reliability can be estimated efficiently and precisely.

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