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研究生: 洪有政
Hung, Yu-Cheng
論文名稱: 多孔矽基板上成長矽/矽鍺及矽/矽鍺碳異質接面紅外線光感測元件之研究
Studies of Si/SiGe and Si/SiGeC Heterojunctions on Porous Silicon Substrates for Infrared Light Detecting Applications
指導教授: 方炎坤
Fang, Yean-Kuen
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 微電子工程研究所
Institute of Microelectronics
論文出版年: 2009
畢業學年度: 97
語文別: 中文
論文頁數: 99
中文關鍵詞: 多孔矽矽鍺光感測元件紅外線矽鍺碳
外文關鍵詞: porous silicon, SiGe, detector, infrared, SiGeC
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  • 本論文描述於N(100)矽基板上調變不同蝕刻參數形成不同孔隙率的多孔矽基板。利用多孔矽結構增加光線吸收面積與偏移吸收峰值,來發展高性能紅外線光感測元件。其中多孔矽層是以電化學陽極化蝕刻法(Electrochemical Anodization Method)製作而成。然後於其上再以快速升溫化學氣相沉積系統(RTCVD)成長矽鍺及矽鍺碳薄膜。並利用FE-SEM、AFM觀察量測薄膜表面狀態,使用FTIR、Raman spectra、XRD等儀器分析薄膜的結晶品質。
    利用矽/矽鍺/多孔矽及矽/矽鍺碳/多孔矽結構製作的紅外線光感測元件其主要吸收層在矽鍺、矽鍺碳及多孔矽層,吾人量測元件在未照光與照光下的I-V特性、光暗電流比等。當矽/矽鍺/多孔矽元件之孔隙率為55%時,在-12V偏壓下,以波長700nm、5mW之雷射光照射下得到最大光暗電流比為2.13×105;同樣條件下,矽/矽鍺碳/多孔矽元件的最大光/暗電流比為1.75×106是矽/矽鍺/多孔矽元件的8.23倍。相較已發表的成長於單晶矽基板上的非晶矽鍺紅外線感測元件,光電流有著近10倍的提升[38],也就是說成長於多孔矽基板上的矽/矽鍺碳/多孔矽元件,具有較佳的光感測特性與靈敏度,因此也更適合應用於紅外線光感測。

    In this thesis, we used various etching conditions to prepare porous-Si (PS) layers on N-type (100) silicon substrate. The layer with a porous structure can increase photo-absorbing area, and shift the peak of absorbing wavelength, thus improving the flexibility for designing a high performance photo-detecting device. The PS layers were formed on silicon substrates using an electrochemical anodization etching method. To develop Si/SiGe/PS and Si/SiGeC/PS infrared detecting devices, the SiGe、SiGeC films were deposited on the top of the PS layer by a RTCVD system firstly. Then the physical and electrical characteristics of the films were investigated by FE-SEM, AFM, FTIR, Raman spectrum, XRD, and to optimize the depositing parameters.
    We measured I-V characteristics and calculated the photo to dark current ratio of the devices with and without the illumination of an infrared light (IR) source with λ=700nm. The Si/SiGe/PS device with porosity 55%, at -12V bias, and under 5mW laser diode illuminated, the maximum photo to dark current ratio is 2.13×105. In contrast, under the same conditions, its counterpart the Si/SiGeC/PS device with porosity 55% has the maximum photo to dark current ratio of 1.75×106, which is 8.23 times higher than that the Si/SiGe/PS device. It is worthy to note, the photo current increases nearly 10 times, which is better than that reported amorphous silicon germanium infrared sensors on crystalline silicon substrates[38], thus evidencing the developed Si/SiGeC/PS device has better potential for IR detecting applications.

    中文摘要 I 英文摘要 II 目錄 IV 圖表目錄 VI 第一章 前言 1 第二章 成長系統與量測儀器介紹 4 2-1 矽基板之清洗 (Wafer Clean) 4 2-2 快速升溫化學氣相沈積系統 (RTCVD) 5 2-3 真空蒸著系統 (Thermal Vacuum Evaporation System) 6 2-4 量測儀器 7 2-4-1 場發射掃瞄式電子顯微鏡 (Field Emission Scanning Electron Microscope, FESEM) 7 2-4-2 原子力顯微鏡 (AFM) 8 2-4-3 傅立葉光譜儀 (FTIR) 8 2-4-4 拉曼光譜儀 (Raman) 9 2-4-5 X光繞射儀 (X-ray Diffractometer, XRD) 9 2-4-6 膜厚量測儀 (α-Step) 10 第三章 多孔矽的機制及製備方法 11 3-1 多孔矽之簡介及形成機制 11 3-2 多孔矽之量子模型 12 3-3 多孔矽之蝕刻參數 13 3-4 多孔矽之蝕刻設備 15 3-5 多孔矽之製備 17 第四章 多孔矽基板上成長矽鍺、矽鍺碳薄膜之特性研究 19 4-1 相關背景介紹 19 4-2 矽鍺、矽鍺碳薄膜之成長 20 4-3 矽鍺、矽鍺碳薄膜SEM分析 21 4-4 矽鍺、矽鍺碳薄膜AFM分析 22 4-5 矽鍺、矽鍺碳薄膜EDS成分分析 23 4-6 矽鍺、矽鍺碳薄膜FTIR分析 23 4-7 矽鍺、矽鍺碳薄膜Raman分析 23 4-8 矽鍺、矽鍺碳薄膜XRD分析 24 第五章 多孔矽基板上成長矽/矽鍺及矽/矽鍺碳異質接面紅外線 光感測元件 26 5-1 元件工作原理 26 5-2 元件構造與製作流程 28 5-3 儀器分析之原理 30 5-3-1 HP4145 30 5-4 元件特性分析 30 第六章 結論與未來展望 34 參考文獻 36 附表 41 附圖 44 誌謝 98 自述 99

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