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研究生: 簡嘉懋
Jian, Jia-Mau
論文名稱: 虛擬量測系統架構與應用
System Framework and Applications of Virtual Metrology
指導教授: 鄭芳田
Cheng, Fan-Tien
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 製造工程研究所
Institute of Manufacturing Engineering
論文出版年: 2007
畢業學年度: 95
語文別: 中文
論文頁數: 82
中文關鍵詞: 整體相似度指標信心指標通用型虛擬量測架構雙階段流程演算法
外文關鍵詞: Generic Virtual Metrology (GVM) Framework, Dual-Phase Algorithm, Global Similarity Index (GSI), Reliance Index (RI)
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  • 虛擬量測(Virtual Metrology, VM)為利用生產機台的製程參數並採用預測模型來預測產品品質,即在無實際量測之情況下進行製程品質監控。本論文以雙階段VM架構為基礎,此架構具有製程與量測資料前處理、雙階段推估演算流程、信心指標評估和相似度指標模組,雙階段VM架構可套用於所有VM之應用。其一最重要的應用為先進製程控制方法中的逐片控制方法(Workpiece-to-Workpiece, W2W),應用VM即時預測的能力獲取每一片之量測值。因此,為了能使VM架構更容易實作與發展,故本論文提出一通用型虛擬量測架構(Generic Virtual Metrology Framework, GVM Framework),該架構以可抽換式模組之設計精神,降低模組與架構之間相依性,使GVM系統擁有高度之適應性,很容易地將所實作出不同VM的功能模組應用於GVM架構上,且易於與W2W APC架構整合。

    Virtual metrology (VM) is a technology to predict metrology variables using information about the process state for every workpiece. An advanced dual-phase VM scheme possessing the properties of data preprocessing, dual-phase conjecturing, reliance-level evaluating, and similarity-level appraising was proposed by our research group. This dual-phase VM scheme is applicable for all the typical VM applications. Among those applications, workpiece-to-workpiece (W2W) advanced process control (APC) is the most critical. For easy implementation and deployment, a generic-virtual-metrology (GVM) framework shall be designed. The purpose of this thesis is to develop the GVM framework. The Pluggable Designs of GVM Framework could reduce the dependencies between module and framework, and make the GVM Framework to have higher adaptability. By applying this GVM framework, different VM functional modules can be easily implemented and applied for various kinds of VM applications, especially for W2W APC.

    第一章 緒論 1 1.1 研究背景 1 1.2 研究動機與目的 4 1.3 論文架構 5 第二章 文獻探討與理論基礎 6 2.1 相關文獻探討 6 2.1.1 VM之相關架構 6 2.2 相關理論基礎 8 2.2.1 統一塑模語言 8 第三章 系統需求分析 12 3.1 系統架構發展流程 12 3.2 VM領域知識收集 15 3.3 VM自動化層級需求分析 26 3.3.1 Level 1系統功能需求分析 29 3.3.2 Level 2系統功能需求分析 30 3.3.3 Level 3系統功能需求分析 31 第四章 物件導向分析與設計 32 4.1 GVM物件導向分析(OOA)之使用案例圖 32 4.2 GVM Use Cases敘述與物件導向分析(OOA)之Sequence Diagrams 34 4.2.1 Use Case 1: Configure System 34 4.2.2 Use Case 2: Acquire Data 35 4.2.3 Use Case 3: Execute VM Model 39 4.2.4 Use Case 4: Generate VM Report 42 4.2.5 Use Case 5: Warn of Accuracy Degradation 43 4.2.6 Use Case 6: Access Local DB 43 4.3 GVM物件導向分析(OOA)之類別圖 45 4.4 GVM物件導向設計(OOD)之類別圖 47 4.5 GVM之可抽換式設計 48 第五章 VM架構設計 52 5.1 PVM架構設計 52 5.2 GVM架構設計 53 5.3 AVM架構設計 60 5.3.1 自動化VM建模流程 61 5.4 PVM、GVM、AVM架構評估 66 第六章 GVM系統之實作與應用 68 6.1 開發環境 68 6.2 系統實作 69 6.2.1 GVM Server使用者介面 69 6.2.2 GVM Client使用者介面 73 6.2.3 虛擬搬運工件容器 75 第七章 結論 77 7.1 研究成果與論文總結 77 7.2 未來研究方向 78 參考文獻 80

    [1] 2003 International Technology Roadmap for Semiconductors (ITRS), December 2003. http://public.itrs.net/
    [2] Y.-C. Chang and F.-T. Cheng, “Application Development of Virtual Metrology in Semiconductor Industry, in Pro. of the 31st Annual Conference of the IEEE Industrial Electronics (IECON 2005), Raleigh, North Carolina, USA, pp. 124-129, November 2005.
    [3] P.-H. Chen, S. Wu, J.-S. Lin, F. Ko, H. Lo, J. Wang, C.-H. Yu, and M.-S. Liang,, “Virtual Metrology: a Solution for Wafer to Wafer Advanced Process Control,” in Proc. 2005 IEEE International Symposium on Semiconductor Manufacturing, San Jose, CA ,USA, pp.155-157, Sept. 2005.
    [4] Y.-C. Su, M.-H. Hung, F.-T. Cheng, and Y.-T. Chen, “A Processing Quality Prognostics Scheme for Plasma Sputtering in TFT-LCD Manufacturing,” IEEE Transactions on Semiconductor Manufacturing, vol. 19, no. 2, pp. 183-194, May 2006.
    [5] Y.-C. Su, F.-T. Cheng, M.-H. Hung, and H.-C. Huang, “Intelligent Prognostics System Design and Implementation,” IEEE Transactions on Semiconductor Manufacturing, vol. 19, no. 2, pp. 195-207, May 2006.
    [6] Y.-J. Chang, Y. Kang, C.-L. Hsu, C.-T. Chang, and T. Y. Chan, “Virtual Metrology Technique for Semiconductor Manufacturing,” in Proc. 2006 International Joint Conference on Neural Networks (IJCNN’06), pp. 5289-5293, July 2006.
    [7] M.-H. Hung, T.-H. Lin, F.-T. Cheng, and R.-C. Lin, “A Novel Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing,” IEEE/ASME Transactions on Mechatronics, vol. 12, no. 3, pp. 308-316, June 2007.
    [8] F.-T. Cheng, H.-C. Huang, and C.-A. Kao, “Developing a Dual-Phase Virtual Metrology Scheme,” to appear in IEEE Transactions on Semiconductor Manufacturing, November 2007.
    [9] SEMI, “SEMI E133-0306 Provisional Specification for Automated Process Control Systems Interface, ” Semiconductor Equipment and Materials International, April 2005.
    [10] International SEMATECH, “Computer Integrated Manufacturing (CIM) Framework Specification Version 2.0,” January 31, 1998
    [11] SEMI E133-0306, Provisional Specification for Automated Process Control Systems Interface, U.S.A., 2004.
    [12] J. Moyne, E. del Castillo, and A.M. Hurwitz, Run-to-Run Control in Semiconductor Manufacturing. CRC Press, 2001.
    [13] F.-T. Cheng, C.-F. Chang, and S.-L. Wu, “Development of Holonic Manufacturing Execution Systems,” Journal of Intelligent Manufacturing, vol. 15, no. 2, pp. 253-267, April 2004.
    [14] D. Parsons, A. Rashid, A. Speck, and A. Telea, “A “Framework” for Object Oriented Frameworks Design,” Proceedings of the Technology of Object-Oriented Languages and Systems, p.141, June 07-10, 1999.
    [15] G. Booch, J. Rumbaugh, I. Jacobson, The Unified Modeling Language User Guide, ADDISON-WESLEY, April 2000.
    [16] J. L. Elman, “Finding Structure in Time,” Cognitive Science, vol. 14, pp.179-211, 1990.
    [17] Y.-T. Huang, F.-T. Cheng, and Y.-T. Chen, “Importance of Data Quality in Virtual Metrology,” in Proc. of The 32th Annual Conference of the IEEE Industrial Electronics Society (IECON 2006), Paris, France, pp. 3727-3732, November 2006.
    [18] F.-T. Cheng, Y.-T. Chen, Y.-C. Su, and D.-L. Zeng, “Method for Evaluating Reliance Level of a Virtual Metrology System,” in Proc. 2007 IEEE International Conference on Robotics and Automation, Roma, Italy, pp.1590-1596, April 2007.
    [19] IBM WebSphere MQ, IBM Corporation [Online]. Available: http://www.ibm.com/
    [20] Microsoft Message Queuing, Microsoft Corporation [Online]. Available: http://www.microsoft.com/
    [21] M. E. Fayad and D. C. Schmidt, “Object-oriented application frameworks,” Communications of the ACM, vol. 40, No. 10, 1997, pp. 32-38.
    [22] D. F. D'Souza , and A. C. Wills, Objects, Components, and Frameworks with UML: The Catalysis(SM) Approach, Addson-Wesley Professional, 1998.
    [23] D. Kaye, Loosely Coupled: The Missing Pieces of Web Services, Rds Associates, August 2003.
    [24] Hao He, What Is Service-Oriented Architecture, September, 2003 [Online]. Available: http://webservices.xml.com/pub/a/ws/2003/09/30/soa.html
    [25] E. Gamma, R. Helm, R. Johnson, J. Vlissides, Design Patterns: Elements of Reusable Object-Oriented Software, Addson-Wesley Professional, 1995.
    [26] E. Freeman, E. Freeman, B. Bates, K. Sierra, Head First Design Patterns, O'Reilly Media, 2004.
    [27] A. Shalloway, J. Trott, Design Patterns Explained: A New Perspective on Object-Oriented Design, Addison-Wesley Professional, 2001
    [28] Borland C++ Builder 6.0, Borland Corporation. [Online]. Available: http://www.borland.com/
    [29] MySQL, MySQL AB [Online]. Available: http://www.mysql.com/
    [30] Automated Material Handling Systems, Asyst Technologies, Inc. [Online]. http://www.asyst.com/products/fsol/amhs/amhs.asp
    [31] W.-M. Wu, Research and Implementation of Virtual-Metrology Precision Enhancement, Master Thesis, Institute of Manufacturing Engineering, National Cheng Kung University, 2006.
    [32] R.-C. Lin, Generic Virtual Metrology Scheme and System, Master Thesis, Institute of Manufacturing Engineering, National Cheng Kung University, 2006.
    [33] 張育誠, FORB2B-IBM MQ SERIES系統管理BD, 資策會, 2000。

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