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研究生: 柯文彬
Ke, Wen-Bin
論文名稱: 鍍鈀銅打線之鈀分佈
The Pd distribution of the Pd-plated Cu wire bond
指導教授: 呂國彰
Lu, Kuo-Chang
學位類別: 碩士
Master
系所名稱: 工學院 - 材料科學及工程學系
Department of Materials Science and Engineering
論文出版年: 2011
畢業學年度: 99
語文別: 中文
論文頁數: 52
中文關鍵詞: 銅打線鈀分佈
外文關鍵詞: Copper Wire bonding, Pd distribution
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  • 本研究利用X 光波長散佈分析儀(WDS)對鍍鈀銅線結球及接合球的橫截面進行鈀的元素分佈分析探討;研究結果顯示,鍍鈀銅線經過EFO 製程後形成結球,而原本鍍在銅線表面的鈀會溶進結球內部,在結球的球肩附近聚集,隨後結球被施以超音波接合,過程中鈀在接合球內部流動,待接合球完全凝固後,鈀則在接合球的兩半球上呈現漩渦狀的分佈。
    本研究藉由觀察鈀從結球內部到接合球內部的分佈變化,推論液體銅在接合球內部的流向為漩渦狀。因為鈀在接合球內部不均勻的分佈,導致接合球內部的機械性質有所差異,在經由奈米壓痕量測的結果顯示出在富鈀區的硬度比純銅區大。

    We investigated the distribution of Pd within the free-air balls (FAB) and wire bonds of the Pd-plated Cu wires by wavelength-dispersive x-ray spectroscopy mapping. After the formation of the Cu-Pd FAB, Pd was asymmetrically distributed within the FAB. The motion of the asymmetrical Pd then followed the semi-solid Cu flow during ultrasonic bonding and the Pd distribution within the ball bond formed two whirlpools of different Pd concentrations. Based on the Pd pattern obtained, the behavior of Cu flow has been further investigated and we propose whirlpool flow patterns in the interior of the ball bond. Additionally, hardness measurements by nanoindentation testing show that the Cu ball bond is harder in the regions where Pd exists.

    中文摘要 …………………………………………………………………I Abstract…………………………………………………………………..II 致謝……………………………………………………………………..III 總目錄…………………………………………………………………..IV 圖目錄…………………………………………………………………..VI 第一章 前言 1 第二章 文獻回顧 3 2.1 打線製程 3 2.2 打線材料 4 2.3 鍍層材料對結球形狀的影響 5 2.4 鈀在結球和接合球的分佈 6 2.4.1 放電結球影響鈀在結球內的分佈 6 2.4.2 熱音波接合影響鈀在接合球內的分佈 7 第三章 實驗方法與步驟 16 3.1 實驗材料 16 3.2 放電結球與熱音波接合 16 3.3 實驗試片製備 17 3.3.1 製作結球橫截面試片 17 3.3.2 製作接合球橫截面試片 18 3.4 微觀組織觀察 18 3.5 元素分佈分析 19 3.6 硬度量測 20 第四章 實驗結果與討論 28 4.1 顯微結構觀察 28 4.1.1 鈀在銅結球的分佈 28 4.1.2 鈀在接合銅球的分佈 29 4.1.3 綜合討論 30 4.2 奈米壓痕硬度測試 33 4.3 FIB顯微結構觀察 33 4.3.1 結球經FIB處理後的微區表面形貌 33 4.3.2 接合球經FIB處理後的微區表面形貌 34 4.3.3 綜合討論 35 第五章 結論與未來展望 48 5.1 結論 48 5.2 未來展望 49 參考文獻 50

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