Bi添加於Sn形成共晶組織的Sn-58Bi，熔點溫度為139 oC，屬於低熔點的銲錫合金，不易成長錫鬚，其機械性質、潤濕性，抗腐蝕性及抗氧化性均優於Sn-Zn-Ag銲錫合金。本論文於Sn-9Zn-1.5Ag添加不同含量之Bi以形成Sn-9Zn-1.5Ag-xBi (x= 0.5, 1.0, 2.0, 3.0 mass %)四元無鉛銲錫合金，探討Bi之添加對此系列合金之機械及電化學性質與電性之影響。
研究中使用示差掃描熱卡計以量測不同合金成分之固、液相線溫度、熔區範圍與材料熔解熱。使用X-光繞射儀分析銲錫中的生成相及晶粒大小等。無鉛銲錫合金之接合強度以拉力試驗機進行量測，利用掃描式電子顯微鏡觀察試片拉力試驗斷面與表面形貌，並以能量散佈儀分析其元素分佈及化學組成。穿透式電子顯微鏡則用以觀察金屬間化合物的微觀型態，並利用電子繞射分析其結構。
DSC結果顯示，Sn-9Zn-1.5Ag-xBi (x=0.5, 1.0, 2.0, 3.0 mass%)無鉛銲錫合金的固相線溫度(Tonset)分別為195.9、194.5、193.4與190.4 oC，而液相線溫度(Tend)分別為217.6、217.3、216.8與215.9 oC。熔解熱分別為 131.5、149.6、158.9與173.9 J/g，顯示Sn-9Zn-1.5Ag-0.5Bi無鉛銲錫合金的熔解熱最低。Sn-9Zn-1.5Ag-0.5Bi銲錫合金為一近共晶之組成。添加不同成份Bi於Sn-9Zn-1.5Ag銲錫合金後，除固相線溫度會隨Bi含量的提升而逐漸降低外，熔區範圍亦隨Bi之添加量而變化。加入Bi後銲錫會偏離共晶組成，出現第二吸熱峰。Sn-9Zn-1.5Ag-xBi (x=0.5, 1.0, 2.0, 3.0 mass%)無鉛銲錫合金的熱膨脹係數依序分別為44.3、39.4、34.8與18.9 × 10-6/K，熱傳導係數依序分別為140.411、137.02、125.391、110.892與108.36 (W/m×K)。
改變時效處理時間影響研究之結果顯示，Sn-9Zn-1.5Ag-xBi銲錫合金之微結構主要由Sn與Ag3Sn化合物所組成。於添加Bi後，並無其他相生成於銲錫基地中，經過不同時間的時效處理後仍無相變化。另一方面，銲錫的晶粒大小隨時效處理時間的提高而有逐漸成長的趨勢。Sn-9Zn-1.5Ag-xBi銲錫合金的接合強度隨時效處理時間的增加而降低，但隨Bi含量的增加而提升。經拉力試驗後之試片表面觀察，顯示Sn-9Zn-1.5Ag-xBi銲錫合金與介金屬化合物之介面為破裂路徑。由TEM分析可知，經過時效處理後，Bi有散佈強化的效果，且Bi有明顯成長聚集現象。
Sn-9Zn-1.5Ag/Cu在3.5 wt% NaCl水溶液經腐蝕極化測試後的腐蝕阻抗、腐蝕電流密度、腐蝕電壓分別為6.74 × 103 Ωcm2，2.65 × 10-6 A/cm2與 -1.21V。而Sn-9Zn-1.5Ag-1Bi/Cu在3.5 wt% NaCl水溶液經腐蝕極化測試後的腐蝕阻抗、腐蝕電流密度、腐蝕電壓分別為7.54 × 103 Ωcm2，2.46 × 10-6A/cm2與-1.18V，腐蝕產物為ZnO，ZnCl2和SnCl2。顯示添加1 mass% Bi於Sn-9Zn-1.5Ag無鉛銲錫合金可提升抗腐蝕性。此外，3.5 wt% NaCl水溶液中的氯離子會腐蝕銲錫合金與Cu基材表面而產生小孔洞。
環境溫度50 oC 時，Sn-9Zn-1.5Ag-3Bi的導電率為 8.9 × 104 (Ω-cm)-1最高，隨著溫度的上升，導電率隨之下降。在150 oC下，Sn-9Zn-1.5Ag的導電率最低為3.7 × 104 (Ω-cm)-1。

Sn-58Bi solder alloy has a lower melted point 139 oC, better wetting effect and mechanic properties and corrosion resistant than Sn-Zn-Ag solder alloy. In order to establish the data base for a new lead-free solder alloy, the influence of aging treatment on mechanical, electric and electrochemical properties of Sn-9Zn-1.5Ag-xBi (x =0.5, 1.0, 2.0, 3.0 mass%) lead-free solder alloys have been investigated in present study by using different experimental methods.
The differential scanning calorimeter (DSC) determines the temperatures of solidus and liquidus, melting range and fusion heat of Sn-9Zn-1.5Ag-xBi solder alloys and the X-ray diffraction for the phase formation and crystallite size. The adhesion strength was analyzed by using a pull off tester machine. The adhesion morphology and chemical composition were observed by scanning electron microscope (SEM), a transmission electron microscope (TEM) with energy dispersive spectrometer (EDS).
The DSC results show the solidus temperature of Sn-9Zn-1.5Ag-xBi (x=0.5, 1.0, 2.0, 3.0 mass%) are 195.9, 194.5, 193.4 and 190.4 oC. In addition, liquidus temperature is 217.6, 217.3, 216.8 and 215.9 oC. The fusion heat are 131.5, 149.6, 158.9 and 173.9J/g. The chemical composition of Sn-9Zn-1.5Ag-0.5Bi solder alloy is a near-eutectic composition. The solidus temperature decreases with increasing Bi addition for Sn-9Zn-1.5Ag-xBi solder alloys. The composition of solder alloy deviates from eutectic composition after Bi added. The second endothermic peaks appear with Bi addition of Sn-9Zn-1.5Ag-xBi solder alloys. The conduction of thermal expansion are 140.411, 137.02, 125.391, 110.892 and 108.36 (W/m×K). The experimental results for various aging times show that the microstructures of Sn-9Zn-1.5Ag-xBi solder alloys are composed of Sn and Ag3Sn. No precipitation of Bi with IMCs was observed in the solder matrix for various Bi addition amounts and aging time. The grain size of solder alloy increases gradually with increasing aging time, but decreases as Bi content increases.
After electrochemical test of Sn-9Zn-1.5Ag solder alloy with Cu substrate in 3.5 wt% NaCl solution, corrosion resistance, corrosion current density, and corrosion voltage are 6.74 × 103 Ωcm2, 2.65 × 10-6 A/cm2 and -1.21V, respectively. On the other hand, the Sn-9Zn-1.5Ag-1Bi solder alloy with Cu substrate in 3.5 wt% NaCl solution, corrosion resistance, corrosion current density, and corrosion voltage are 7.54 × 103 Ωcm2, 2.46 × 10-6 A/cm2, -1.18V. The corrosion products are ZnO, ZnCl2 and SnCl2. In addition, pits formed from Cl- ions are attracting solder alloy with Cu substrate in 3.5 wt% NaCl solution.
The electric conduction is 8.9 × 104 (Ω-cm)-1 for Sn-9Zn-1.5Ag-3Bi at 50 oC, and 3.7 × 104 (Ω-cm)-1 for Sn-9Zn-1.5Ag at 150 oC.

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