本研究以奈米級二氧化矽作為填充劑添加入Diglycidyl ether of bisphenol A (DGEBA)環氧樹脂，探討環氧樹脂/二氧化矽混成奈米複合材做為光電封裝材料之可行性研究。研究中考量 Epoxy/SiO2混成材之加工黏度和混成材料固化後之透光性、抗濕性、熱機械性質、耐熱性等性質。二氧化矽粉體的來源為市售及自行以微乳化法合成，並對粉體表面以矽氧烷偶合劑進行改質，使填充劑與環氧樹脂有良好的界面接著強度，以發揮填充劑最佳的功效。實驗中改變不同添加含量，探討二氧化矽微粒添加量與奈米複合材性質的關係。此奈米複合材在不影響光學特性下，將其應用在高透光性光電元件之封裝，降低封裝材之水氣和氣體之滲透率、提昇材料之熱穩定性、降低材料之熱膨脹係數以減少熱應力和提昇其機械性質等特性。利用微乳化法製備二氧化矽微粒時，高轉速攪拌下所製得粉體粒徑較低轉速下略小且反應速率亦較為快。複合材之透光性以小粒徑填充劑透光性質較佳，且經過Aminopropyltrimethoxysilane偶合劑改質過之粉體，與環氧數脂界面接著強度較好，透光性佳且亦降低材料之熱膨脹係數；但是Aminopropyltrimethoxysilane末端是胺基，屬於叫親水性基團，在吸濕性質表現顯著較差。耐熱性方面，以較大粒徑二氧化矽微粒或高含量二氧化矽填充劑中提升效果最為顯著。

　In this study, the nano-silica particles as a filler were added to Diglycidyl ether of bisphenol A (DGEBA) in order to form the opto-electronic molding compound. Its characteristics such as viscosity, optical properties, humidity resistance, coefficient of thermal expansion (CTE) and thermal mechanical properties would be discussed. As for the silica particles, they were obtained in two ways: some were purchased and the rest were synthesized by the microemulsion method. The surface of silica particles was treated with silane to enhance the bonding between the filler and epoxy. The relationship between filler content and compound properties was also investigated in the study. Thus, adopting the epoxy/silica hybrid materials as opto-electronic molding compounds can achieve a better mechanical property, decrease CTE, improve thermal stability, resist humidity, and meet optical requirement. By the microemulsion method, silica could be produced; furthermore, at a higher stirring speed, the higher reaction rate could be observed in the process and the smaller silica particles appeared at the end of the reaction. The results show that the opto-electronic molding compounds were more transparent when the silica particles of a smaller size were used. The particles modified by aminopropyltrimethoxysilane have stronger bonding with epoxy in terms of viscosity, transparency and CTE. However, aminopropyltrimethoxysilane possesses a hydrophilic amino group, so the moisture absorption is poorer.

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