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研究生： 蔡岳朋
Tsai, Yueh-Peng
論文名稱： 部份貼附式壓電材料添加膠黏劑懸臂樑之結構分析
Structural Responses of Surface-Mounted Piezoelectric Beams with Bonding Layer
指導教授： 王榮泰
Wang, Rong-Tai
學位類別： 碩士
Master
系所名稱： 工學院 - 工程科學系
Department of Engineering Science
論文出版年： 2010
畢業學年度： 98
語文別： 中文
論文頁數： 99
中文關鍵詞： 直樑 、壓電材料 、膠黏層 、Hamilton’s Principle
外文關鍵詞： beam, piezoelectric, bonding layer, Hamilton’s principle
相關次數： 點閱：134  下載：2 
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    • 本文為探討部份貼附式壓電材料懸臂樑的應力，此結構中的第一、三跨距為單層鋁的材料，第二跨距為五層的三明治樑，上下層為壓電材料，中間層為鋁材，上下層與中間層添加膠黏劑所構成。
    在壓電層與中間層，用線性內插法可求得上下膠黏層的連續位移條件，並且可得知膠黏層的應變能、應力能。
    利用應力場、應變場、連續位移條件關係推導出應變能項，再以Hamilton’s Principle求得運動方程式和邊界條件。用靜態方程式求出各方向位移通解。
    施予負載-電壓，探討壓電材料的貼附位置、長度、厚度及膠黏層厚度，對於位移分佈、電荷數收集、應變與應力分佈之影響。

    The model of Timoshenko surface-mounted piezoelectric beams with bonding layer material is considered in this paper.
    The displacements of bonding layers are approximated by the linear interpolation of displacements at the top and bottom surface of the layer.
    The strain energy and kinetic energy are obtained of each component of the entire beam. The governing equations and boundary conditions of the entire beam are derived via Hamilton’s principle.
    An external force acting at the tip and a voltage applying at the actuator of the entire beam will be studied. The effects of location, length, thickness of the piezoelectric pairs and thickness of the bonding on deflection, electric charge, strain-stress distribution are investigated.

    摘要.......................................................I Abstract..................................................II 誌謝.....................................................III 目錄......................................................IV 表目錄....................................................IX 圖目錄.....................................................X 符號說明...................................................XV 第一章 緒論..............................................1 §1-1 前言.............................................1 §1-2 研究目的.........................................3 §1-3 研究步驟.........................................4 §1-4 文獻回顧.........................................5 第二章 研究架構...........................................9 §2-1 研究架構流程.....................................9 §2-2 本文基本假設....................................10 第三章 研究方法與內容....................................11 §3-1 運動方程式......................................11 §3-1-1 模型設定....................................11 §3-1-2 壓電材料....................................14 §3-1-3 壓電材料轉角、位移、應變能.........................15 §3-1-4 Host Beam轉角、位移、應變能.......................17 §3-1-5 膠黏劑轉角、位移..................................19 §3-1-6 膠黏劑應變能.....................................21 §3-1-7 整體樑應變能、外力作功............................23 §3-1-8 結構運動方程式及邊界條件..........................23 §3-1-9 感測器之電荷收集.................................31 §3-1-10 膠黏劑界面應力...................................33 第四章 靜態分析..........................................35 §4-1 靜態平衡方程式......................................35 §4-1-1 第一、三跨距....................................35 §4-2-2 第二跨距........................................35 §4-2 位移之通解..........................................38 §4-2-1 第一、三跨距....................................38 §4-2-2 第二跨距........................................38 §4-3 整體結構靜態響應.....................................49 第五章 案例探討與模擬數據分析............................55 §5-1 案例探討...........................................55 §5-1-1 各參數值.........................................55 §5-1-2 外力作用.........................................57 §5-1-2-1 改變壓電片位置.................................58 §5-1-2-1-1 w位移的變化圖..............................58 §5-1-2-1-2 應力分佈圖.................................59 §5-1-2-1-3 電負荷的收集數.............................60 §5-1-2-1-4 膠黏劑界面應力.............................61 §5-1-2-2 改變壓電片長度.................................63 §5-1-2-2-1 w位移的變化圖..............................63 §5-1-2-2-2 電負荷的收集數.............................64 §5-1-2-3 改變壓電片厚度.................................65 §5-1-2-3-1 w位移的變化圖................................65 §5-1-2-3-2 電負荷的收集數.............................66 §5-1-2-3-3 膠黏劑界面應力.............................67 §5-1-2-4 改變膠黏劑厚度.................................69 §5-1-2-4-1 w位移的變化圖..............................69 §5-1-3-4-2 電負荷的收集數.............................70 §5-1-3-4-3 膠黏劑界面應力.............................71 §5-1-3 電壓作用........................................73 §5-1-3-1 改變壓電片位置.................................74 §5-1-3-1-1 w位移的變化圖..............................74 §5-1-3-1-2 應力分佈圖.................................75 §5-1-3-1-3 膠黏劑界面應力.............................76 §5-1-3-2 改變壓電片長度.................................78 §5-1-3-2-1 w位移的變化圖..............................78 §5-1-3-3 改變壓電片厚度.................................79 §5-1-3-3-1 w位移的變化圖................................79 §5-1-3-3-2 膠黏劑界面應力.............................80 §5-1-3-4 改變膠黏劑厚度.................................82 §5-1-3-4-1 w位移的變化圖..............................82 §5-1-3-4-2 膠黏劑界面應力.............................83 §5-1-4 電負荷收集表...................................85 第六章 結論與建議........................................89 §6-1 結論..............................................89 §6-2 建議..............................................91 參考文獻...................................................92 附錄A.....................................................94 附錄B.....................................................95 附錄C.....................................................96 附錄D.....................................................97 自述......................................................99

    1. D.H. Robbins and J.N. Reddy, ”Analysis of piezoelectrically actuated beams using a layer-wise displacement theory,” Computers and Structures, 41(2),265-279(1991)
    2. Jun Deng and Marcus M.K. Lee, “Effect of plate end and adhesive spew geometries on stresses in retrofitted beams bonded with a CFRP plate”, Composites Structures, Part B(39), 731-739(2008)
    3. Jun Deng, Marcus M.K. Lee and Stuart S.J. Moy, ”Stress analysis of steel beams reinforced with a bonded CFRP plate,” Composite Structures, 65,205-215(2004)
    4. Song-Jeng Huang, ”An analytical method for calculating the stress and strain in adhesive layers in sandwich beams,” Composite Structures, 60,105-114(2003)
    5. DH Ryu and K WWang,”Analysis of interfacial stresses and actuation authorities induced by surface-bonded piezoelectric actuators on curved flexible beams,” Smart Materials And Structures, 13,753-761(2004)
    6. Jialai Wang and Chao Zhang, ”Energy release rate and phase angle of delamination in sandwich beams and symmetric adhesively bonded joints,” International Journal of Solids and Structures, 46,4409-4418(2009)
    7. Glyn Lawcock ,Lin Ye ,Yiu-Wing Mai ,and Chin-Teh Sun,” The effect of adhesive bonding between aluminu and composite prepreg on the mechaical properties of carbon-fiber-reinforced metal laminates,” Composites Science and Technology, 57,35-45(1997)
    8. X D Zhang and C T Sun, ”Formulation of an adaptive sandwich Beam,” Smart Materials And Structures,5,814,(1996)
    9. C T Sun and X D Zhang,” Use of thickness-shear mode in adaptive sandwich structures,” Smart Materials And Structures,4,202,(1995)
    10. 黃崧任,王文毅,”複合三明治結構膠黏層的黏彈性質分析,”中國航空太空學會學刊, 35卷2期, 135-151(2003/06)
    11. A. Tounsi, T. Hassaine Daouadji, S. Benyoucef ,and E.A. Adda bedia,” Interfacial stresses in FRP-plated RC beams: Effect of adherend shear deformations,” International Journal of Adhesion & Adhesives, 29,343-351 (2009)
    12. S. Zhang and K. J. Hsia,” Modeling the Fracture of a Sandwich Structure due to Cavitation in a Ductile Adhesive Layer,” Journal of Applied Mechanics, Vol.68 ,pp.93-100, January (2001)
    13. N. Palazotto ,and Victor Birman,” Environment and viscoelastic effects on stresses in adhesive joints,” Journal of Aerospace Engineering, Vol.8, No.2, pp.107-118, April (1995)
    14. Huang Song-Jeng ,”Mathematical modeling of the stress-strain state of adhesive layers in sandwich structures”, Mechanics of Composite Materials, Vol. 38, No. 2, pp. 161-182,( 2002)
    15. Erol Sancaktar,” Recent approaches in constitutive behavior and testing of structural adhesives”, American Society of Mechanical Engineers, Vo1.49, No 10, part 2,(1996)
    16. Dongchang Sun and Liyong Tong,” Modeling and analysis of curved beams with debonded piezoelectric sensor/actuator patches” International Journal of Mechanical Sciences,44,1755-1777(2002)
    17. S. RAJA, R. SREEDEEP and G. PRATHAP, ”Bending Behavior of Hybrid-actuated Piezoelectric Sandwich Beams,” Journal of Intelligent Material Systems and Structures, Vol.15,611-619(2004)
    18. 馬振基,”高分子複合材料上冊”,國立編譯館,1995.
    19. Allen HG. Analysis and design of structural sandwich panels. UK: Oxford;1969.

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