本研究使探討Ni元素(0.05、0.1、0.2、1.0wt%)添加對Sn-1.5Ag-0.7Cu(SAC157)低Ag無鉛銲料之熔點、微結構與機械性質影響，並與商業化無鉛銲料Sn-3.0Ag-0.5Cu(SAC305)做比較。

實驗結果顯示，添加0.2wt%Ni以下銲料之固相線溫度改變不大，但液相線溫度由227°C提升到231°C，導致固液區間增加。當Ni添加量達到1wt%時整體熔點皆上升。添加Ni後銲料微結構與SAC157銲料相似，隨著Ni含量增加，(Cu,Ni)6Sn5化合物含量增加，當添加量達1wt%時甚至出大塊島狀(Ni,Cu)3Sn4化合物。當經過高溫熱儲存後銲料內部(Cu,Ni)6Sn5粗大化，當添加0.2wt%Ni部分甚至呈現六角柱狀。在接合強度、硬度與剪切試驗上0.05wt%的Ni添加量即可以提高SAC157銲點的強度，但是當添加的Ni含量增加，銲點的延性也跟著下降。經過高溫熱儲存所有銲料接合強度與硬度皆下降，但隨著Ni含量的提升，銲點接合強度與硬度之下降幅度較小，顯示有較好的抗熱性。此外，Ni元素之添加也會增加銲接完成時之界面IMC層之厚度，當添加量1wt%時初始界面層厚度即達10µm。然而Ni添加減緩了銲點界面層之Cu3Sn厚度。在1.0wt%Ni之添加量下，經150°C、400小時熱儲存甚至幾無Cu3Sn的生成。Ni添加量在0.2wt%以下高溫熱儲儲存下銲點整體界面層成長幅度反而較SAC157與SAC305小。

綜合本研究結果，當Ni添加量為0.05%wt~0.1wt%時即可顯著提升銲料之機械性質，而過量Ni添加則會導致銲點內部化合物粗大化，導致銲點延展性變差。

The effects of Ni addition (0.05, 0.1, 0.2, 1.0wt%) into the Sn-1.5Ag-0.7Cu (SAC157) on the melting point, microstructure and mechanical properties were investigated and brought into comparison with commercial solder Sn-3.0Ag-0.5Cu (SAC305).
The results showed that the solidus temperature of the solder didn’t change significantly when the amount of Ni addition was under 0.2wt%. However, the liquidus temperature raised from 227°C to 231°C, enlarging the pasty range. Both the solidus and liquidus temperatures raised when 1.0wt% of Ni was added. The microstructures of the solders with low Ni additions were similar with SAC157, the Ni addition would cause (Cu,Ni)6Sn5 compound to form. When 1.0wt% Ni was added to SAC157 solder, the Ni-rich (Ni,Cu)3Sn4 compounds were even found in the solder matrix. The size of Sn-Ni-Cu compounds increased as the more Ni addition.The hardness, adhesive strength and shear strength of the solder were enhanced by the additions of 0.05wt% Ni. However, the elongation of the solder joints deteriorated with Ni additions. The (Cu,Ni)6Sn5 particles agglomerated after thermal storage, and hexagonal columnar (Cu,Ni)6Sn5 particles were found with Ni addition more than 0.2wt%. The adhesive strength and hardness of solder with Ni addition had less reduction after thermal storage showed good thermal stability. Ni addition also increased the thickness of IMC layer in as-soldered condition, 1.0wt% Ni addition would lead to an initial IMC layer with 10µm in thickness. However, Ni addition suppressed the Cu diffusion and retarded the growth rate of Cu3Sn layer. With Ni addition no more than 0.2wt%, the growth rate of the total IMC layer was slower than that of SAC157 and SAC305 solder . The Cu3Sn layer was barely found when the Ni addition were more than 1.0wt% after 400 hour, 150°C thermal storage.
From all the results of this study, the mechanical properties of Sn-1.5Ag-0.7Cu are improved significantly when the Ni addition is at the range of 0.05%wt~0.1wt%.

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