本研究目的針對Sn-Ag-Cu (SAC)無鉛銲料在不同Ag含量(0–3 wt.%)微結構及低週疲勞特性的影響，實驗以Sn-Cu二元合金中加入不同比例的純銀,探討銀含量對銲料的冷卻速率、硬度、抗拉強度及銲點形貌在疲勞壽命與破壞模式的影響探討。
透過冷卻速率研究不同Ag含量銲料中Ag3Sn微結構演變及機械性質之效應；SAC無鉛銲料在非平衡凝固狀態時，初析相隨熔點溫度降低而產生，則初析β-Sn生成時溫度持續降低隨後應有Cu6Sn5、Ag3Sn與Sn構成的共晶組織圍繞初析β-Sn，而形成網狀共晶(Eutectic Network)之結構
。Ag3Sn共晶化合物隨著冷卻速率下降以及結晶過程時間的增加形貌變化如：particle-like、needle-like、plate-like。換言之，快速冷卻條件下的Ag3Sn與Cu6Sn5較為緻密且初析β-Sn面積大小隨冷卻速率的遞減而增加，在快速冷卻速率下SC07的β-Sn面積49.9 %隨Ag添加至3.0 wt.%面積縮小至37.6 %，隨冷卻速率的降低β-Sn尺寸變大，表示網狀共晶組織緻密程度有逐漸下降的趨勢，而Ag含量提升，有助於析出物Ag3Sn的生成，使得網狀共晶組織增加，進而提升機械性質，冷卻速率低則Cu6Sn5相對粗大化；微硬度相對較高則β-Sn面積較小。SAC307在快速冷卻下(32.3°C/s)擁有最高的拉伸強度(81.3 MPa)，且強度隨冷卻速率下降而降低，隨Ag含量增加與冷卻速率的增加致使拉伸強度亦逐漸提升。
低週疲勞測試中，銲點疲勞壽命會因形貌不同(桶型與沙漏型)銲點疲勞壽命曲線及裂紋成長模式亦不相同。沙漏狀疲勞斷面SAC157在疲勞過程中，並不會受到IMC層的影響，因此其抗疲勞性質比SAC307還要佳；而桶狀銲點SAC157之網狀共晶組織並未如同SAC307細緻，因此保有一定的延展性，而裂紋成長於銲料內部及界面IMC (interfacial IMC)處，顯示裂紋傳播時受到不同的阻礙，應是SAC157銲料擁有最佳疲勞週期數之原因。沙漏型銲點比桶型銲點具有更好疲勞性能，因桶型銲點接觸角應力集中效應。在桶型銲點由於應力集中效應，除Sn-0.7Cu外，皆以界面IMC層與IMC層斷裂。而沙漏型銲點大部分疲勞裂紋在銲料內部成長。綜合考慮上述各項性能指標，SAC無鉛銲料沙漏狀與桶狀形貌兩者條件下其經1.5–2.0 wt% Ag添加具有較佳疲勞性質。

The microstructure evolution and mechanical properties of Ag3Sn was studied under different cooling rate with different Ag contents SAC solders. When the cooling rate slowed and the solidification time extended, the morphology of the Ag3Sn changed from particle-like to needle-like and plate-like. However, under rapid cooling rate, the particle-like Ag3Sn and Cu6Sn5 were denser, and the area of primary β-Sn decreased obviously. The increase in Ag content also enhanced the formation of the Ag3Sn and dominated the formation of primary β-Sn. This expanded the eutectic network structure and further enhanced the mechanical properties.

Low cycle fatigue test of different Ag additive SAC solder joints and with different joint geometry as well were carried at in this study. It was found that the SAC157 solder joint with the hourglass-type was less affected by the interfacial intermetallic compound (IMC) layer and showed a better fatigue property than that of SAC307. The eutectic network structure of the barrel-type SAC157 solder joints were not as dense as those of SAC307 which exhibited ductility to some extent. Hourglass-type had better fatigue properties than the barrel-type due to the less stress concentration at the contact angle. All the barrel-type joints showed interfacial IMC layers fracture except Sn-0.7C. The hourglass-type joints showed however the cracks initiated and grew internally. Summarized from the study results it can be concluded that an addition of 1.5–2.0 wt.% Ag would have better fatigue properties for both barrel-type and hourglass-type SAC lead-free solders.

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