本研究主要分為兩大主軸。第一是研究及發展出低溫的無鉛玻璃粉，並分析其物理及光學特性；第二是以雷射加熱之封裝技術應用在於LEDs/OLEDs之元件並搭配其低溫玻璃粉的研究。
稀土材料氧化釹(Nd2O3)的優點主要用作玻璃、陶瓷的著色劑，製造金屬釹的原料和強磁性釹鐵硼的原料，添加少量的氧化釹，可提高整體材料的氣密性和耐腐蝕性。另外，對於機械性質與耐磨耗能力的表現上均有程度上的影響，故將其納入實驗中並探討其於玻璃系統中的特性。
低溫玻璃粉系統分為硼系(Fe2O3–V2O5–B2O3)及磷系(Fe2O3–V2O5–P2O5)之無機無鉛玻璃做探討，並透過添加稀土氧化釹(Nd2O3) 0mol%~5mole%於玻璃系統中，分析其物理與光學特性，Nd2O3濃度變化顯著影響玻璃密度和摩爾體積的行為。隨著Nd2O3濃度的增加，非鍵結氧數目(Non-bridging oxygen, NBO)也升高，理論折射率和電子氧化物離子極化率由Lorentz-Lorenz方程式計算。而且，兩種玻璃粉在Nd2O3添加下均，被證實具有高折射率和高電子氧化物離子極化率。此外，通過Duffy-Ingram函數計算出此玻璃具有高光學鹼度(Optical basicity) ，相對地，折射率基底的金屬化標準(Metallization criterion of refractive index base)下降。在缺陷方面的討論，光學能隙(Optical energy band gap)與非鍵結氧數量成反比的關係。
雷射封裝技術已逐漸大量地應用於高端電子封合需求。傳統高溫封裝過程中，大幅降低或是損壞電子元件壽命。光纖雷射(Fiber Laser)以局部區域的(Localized)加熱方法可避免整面式的(Global)加熱並且大幅降低元件耗損。因添加Nd2O3後，於波長808 nm有明顯之吸收峰，此次光纖雷射選用以808nm波長為主，並分析與比較其與市售之環氧樹酯封合後之表面微結構與電性及照光度無差異。然而，高溫爐封裝之LED元件，已出現高電阻與漏電的現象，原因為全面式高溫接合(溫度約680°C)導致元件受損(須低於400°C)，而之前的實驗得知，此兩種玻璃粉之最低熔點均若在650°C~690°C之間，在不添加鉛、鉍等材料情況下，降低玻璃熔點溫度亦為另一改善之方向。相對地，局部性的雷射加熱方法可將熱傷害降到最小，並且可依據材料外觀與形貌做客製化的製程。
實驗最終以耐候性測試(Reliability test)比較玻璃粉在於以雷射加熱之封裝與傳統封裝後的電性與照明度的表現作為之依據。經過高溫高濕及鹽化的惡劣環境下，證實以硼系之玻璃粉搭配雷射封合方法於長時間測試下，可以完全阻絕外界環境的水氣與氧氣的穿透；然而，LED元件因於高溫傳統式的封裝時，元件已經被損壞，無法針對其作討論。市售之環氧樹酯亦無法在長時間於潮濕的環境下有良好的密封效果，也間接驗證了塑化材料本身對於抵擋光與水氣有較差的能力及不適用於在戶外及嚴苛環境下的產品封合。

Glass frit encapsulation for laser-base sealing of the complex interiors results challenges for the electronics manufacturing process. The heating modes have been studies and developed over past decades. The traditional modes, especially oven and furnace, are widely used to manufacturing.
While the sealing by furnace reports to the worst in electrical characteristics and illuminating, the performance of by laser source presents the comparable to commercialization. The conventional frit packaging method relies on elevating thermal process by furnace where the package is heated to reach the required temperature, hence limiting the use of temperature-sensitive materials, such as LED or OLED, and also generating unpredictable problems in different packaging processes or multi-stage sealing products. In this thesis, the benefits of combining novel laser-assist hermetical sealing and low temperature glass frit packaging are demonstrated and the technique offers a suitable and feasible solution.
The advantages of neodymium oxide (Nd2O3) are mainly used as a color coder for glass and ceramics, raw materials for metal tantalum and ferromagnetic neodymium-iron-boron materials. Furthermore, this is able to improve the hermeticity and corrosion resistance of the entire material. In addition, there is a certain extent of influence on the performance of mechanical properties and wear resistance. Therefore, it is included in this experiment and its characteristics in the glass systems are discussed.
In addition, the study also includes to the rare earth Nd2O3 doped glass systems, namely B2O3–V2O5–Fe2O3 (BVF) and P2O5–V2O5–Fe2O3 (PVF) are jointly evaluated for physical and optical properties. Quaternary oxide glasses Nd2O3–B2O3–V2O5–Fe2O3 and Nd2O3–P2O5–V2O5–Fe2O3 are prepared by conventional melt quench technique and Nd2O3 plays as glass modifier influencing on the conversion between of BO3 and BO4, PO5 and PO4 and of VO5 to VO4 along with the NBO. This objective is to seek for a lower melting temperature glass frit and appropriate adhesive material. As knew, the rare earths have specific wavelength of absorption, supplying to the selection of laser, utilized this trait to fierce vibration, and then heating up rapidly in the very short period.
Then follows the density, molar weight, etc., report to the meaningful relationship to refractive index. With the increase in Nd2O3 content, refractive index, and optical basicity show upward trends; by contrast, optical energy band gap and metallization criterion represent to reverse correlation. Meanwhile, the optical energy band gap is often used to illustrate the interaction between electrons and holes by absorption of wavelength, and determine its color and conductivity, especially in semiconductor materials, and PVF is roughly twofold the optical energy band gap of BVF.
Laser packaging technology has gradually been applied to high-end electronic sealing requirements. In the traditional high-temperature packaging process, the life of electronic components is considerably damaged. The localized heating method of laser avoids this damage by global heating, and meanwhile, significantly reduces component loss. Due to the addition of Nd2O3, there is a clear absorption peak at 808 nm, analyzed by UV-Vis. The wavelength of 808 nm is as the dominant wavelength, and analyzes, and subsequently, compares the surface microstructure and electrical properties after being sealed by laser-assist heating with a commercially epoxy resin. However, high resistance and leakage have occurred in high-temperature furnace packages, due to the fact that high-temperature melting (temperature of about 680°C) results in the damage of LED device (typically, the adorable maximum temperature of LED is below 400°C). According to previous experiment, the minimum melting point of both glass systems (BVF & PVF) is between 650°C and 690°C which is much higher. Without adding lead, and bismuth materials, lowering the glass melting point is another project in the future. In stark contrast, localized laser heating method can minimize the damage by thermal accumulation.
The advantage of laser glass frits bonding is the non-stringent requirements of high bonding strength and low stress at the juncture interface, good process yield, repeatability, air-tight sealing and flatness of the surface to be bonded. These advantages are combined with local heating and controllable processes based on the low melting glass frit of the laser process described herein. As can be seen, commercialized product, epoxy resins cannot provide well sealing capability under long-term humid conditions, and indirectly demonstrate that plasticized materials cannot affordable to withstand light and moisture and are also unsuitable sealing applications for outdoor and harshness products.

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