陰影疊紋系統現今最常應用於量測電子元件的翹曲量，在高溫量測時由於系統會因為加熱膨脹產生不可預期的變動，最後造成量測上的誤差。
本文主要目的是應用陰影疊紋法系統，在高溫狀態下檢測電子元件翹曲量變化。首先依據JEDEC標準提出以最小平方法(Least Mean Squares)法初步將晶片旋轉至水平，運用組合法將高於底座平面的點再進行組合判別，最後可得最高底座平面。且以模擬馬鞍形與半圓柱形貌方式驗證搜尋法的正確性。另外以同組電子晶片將實驗所得翹曲量數據與華東科技量測數據比較差異。
在升溫量測時，利用校正片在不同溫度時，所量測到的量測值與已知值之間的誤差，當作校正值。本文使用雙立方樣條內插，將校正片上選取二十五個校正值內插出方形校正值區域。經過校正片升溫量測的結果，絕對平均誤差最大為1.51um，由此可知此方法可提高量測準確度。

Shadow moiré method is commonly used to measure warpage of electronic components. When measuring specimen by shadow moiré system under heating condition, the system will produce unpredictable changes due to thermal expansion and lead to measurement error.
In this paper, the major purpose is to measure the warpage of electronic components by using shadow moiré method under high temperature condition. According to JEDEC STANDARD, we use least mean squares to rotate the chip to be horizontal at first. Next, we discriminate the point above seating plane by combined method,so that we can get the highest seating plane. Then, we simulate the profiles of saddle and half cylinder to examine the correctness. And we will compare our measuring result to the warpage that measured by Walton Engineering Inc.
We can get error between measured value and standard value that measured by calibration plate in different temperature. The error is called calibration value. In this paper, we use bicubic spline interpolation to interpolate twenty-five calibration value of twenty-five points that we choose on calibration plate. After that, we can get a rectangular calibration area. According to the testing result, the maximum Absolute average error is 1.51um. It shows that shadow moire system calibration program under heating condition can make accuracy of measurement much higher.

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