綠色產品為未來科技類產品的發展趨勢，目前TFT-LCD的主流導電材質為鋁，但隨著高解析度及大尺寸螢幕的需求，金屬層線寬的細微化會增加連接線電阻及電流密度，而後者對電子遷移的可靠度有很大的影響。為了解決此類問題，銅導線製程的開發及導入已是必然。
大世代面板於濕製程後段，大多以風刀趕除玻璃表面水份，作為後段製程玻璃基板乾燥的主要手段；以往面板製程設備，多數以單刀口的風刀作為基本裝置，但隨著大尺寸的TFT-LCD面板不斷的增加，及pixel的尺寸不斷縮小，對於水殘及particle的耐受程度日趨嚴苛，因而需要相對動能較強，流場更穩定的雙刀口的風刀作為製程良率提升的利器。
本研究為了瞭解玻璃基板於雙刀口風刀的噴流作用之下，玻璃表面的流場的特徵，因而條件設定於現行大宗的0.5mm顯示器玻璃基板作為試驗平台，透過數值模擬分析相關流場的現象，包含壓力及速度的分佈情形。再利用田口分析方法對各參數組合進行優化設計，以加速實驗的進行及驗證。
CFD田口分析模擬顯示參數優化組合是A3、B3、C3及D1；在此優化條件下可得做大流速182 m/s，除水效率增加22.37%，且良率增加46.66%。

Today the green products are the development trend of future technology. At present, the main conductive material for TFT-LCD is aluminum, but with the requirements of high-resolution and large-size screens, the needed reduction in the size of metal connection lines will increase the connection line resistance and current density. The latter has a great influence on the reliability of electronic migration. Hence, the application of copper process is a necessary trend in the future.
Large-scale glass panels in the latter stage of the wet process mostly use an air knife to remove the water on the glass surface as the main means for drying the substrate after the process. The panel process tools mostly use the single-edge air knife as the basic device. But with the large-size LCD panel and the shrunk pixel size, the tolerance of water residues and particles on the substrate become very stringent. Therefore, the more stable double-knife air knife is used to improve the drying process.
In this study, the Taguchi method was adopted to investigate the effectiveness of using the dual air knife for drying with the current large-scale 0.5mm display glass substrate as a test platform. Optimization obtained by the Taguchi method using CFD numerical simulation was further validated by the field experiment. The results show that the optimal combination of factors is A3, B3, C3, and D1. With this combination, the maximum flow rate on the glass surface is 182 m/s, and the efficiency increases by 22.37% with an improved yield rate of 46.66%.

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