隨著科技的進步，人們對於電子元件的精度和可靠性要求越來越高，所以合金電阻的研究也不斷地往前推進，目前也已經發展出了許多不同類型的合金電阻材料，如:銀鈀、銅鎳、銅錳、鎳鉻等。銀鈀等電阻材料能夠在空氣中燒結且保持良好的電性，但是其成本昂貴是最大的缺點，而銅鎳、銅錳、鎳鉻等電阻材料雖然價格較為低廉，卻只能在特殊氣氛下進行燒結。因此，本實驗提出了一個合金電阻能夠在空氣下燒結的製程方式，利用以鋁為核心去做調配的保護層膏，覆蓋在銅鎳膏上面，並且在旁邊順便印上端電極，使得銅鎳合金能夠在空氣下燒結，並且能夠藉由旁邊的端電極量測到內部的銅鎳合金阻值。
本實驗主要分為三個部分，第一部分是保護層材料的選用，目標是保護層的阻值能夠盡可能的高以防止影響下方銅鎳的阻值。我們使用不同比例以及不同粒徑大小的銅鋁混和膏蓋在銅鎳膏上面並進行850度的燒結，量測每一個樣品保護層的阻值直到絕緣，也會順便觀察下方銅鎳是否有氧化的的情況。
第二部分是結構上的變動，由於上一部分僅僅是雙層的結構，在這一部分我們會以最佳的保護層材料蓋住銅鎳膏為基礎，向旁邊延伸結構做出端電極，好讓我們能夠採到下方銅鎳的電性，經過SEM以及EDS分析各個結構金屬擴散的情形並進行改良，最後發現到在原有端電極中插入一層小銅大鋁層能夠使介面的阻值進一步的從154 mΩ降到了37.4 mΩ。
第三部分是不同溫度上的燒結，我們沿用上一部分的最佳結構，再進行不同方式的燒結。我們發現在850度前再預燒一定的溫度能夠有效再降低阻值，因此我們比對了650度、700度、750度的預燒結果，最後確實觀察到隨著預燒溫度的上升，阻值也會隨之下降。預燒750度之後再燒850度，電阻率來到了35*10^(-8)Ω.m，下方的銅鎳合金更為緻密，並且擁有明亮的金屬色。最後，我們又對此樣品送切FIB以觀察更細微的結構，之後發現明亮的銅鎳合金在EDS元素分析下，大部分銅跟鎳的元素會重疊再一起，含氧量也是僅有5%。

This experiment is divided into three main parts. In the first part, the goal is to achieve a high resistance value for the protective layer in order to prevent any impact on the resistance of the underlying copper-nickel layers. Different proportions and particle sizes of copper-aluminum mixed paste are applied onto the copper-nickel paste. The resistance of each sample's protective layer is measured until insulation occurs, while also observing any potential oxidation of the underlying copper-nickel layers.
The second part involves structural modifications. Side electrodes are extended from the structure to allow for electrical characterization of the underlying copper-nickel layers. Through SEM and EDS analysis, the diffusion of metals in various structural configurations is examined and improved upon. Ultimately, it was discovered that inserting a layer of small copper and large aluminum into the original side electrodes further reduces the contact resistance from 154 mΩ to 37.4 mΩ.
The third part examines sintering at different temperatures. It was found that pre-sintering at a certain temperature before reaching 850 degrees effectively reduces resistance. Therefore, pre-sintering results at 650 degrees, 700 degrees, and 750 degrees were compared. It was observed that as the pre-sintering temperature increases, the resistance decreases. After pre-sintering at 750 degrees and subsequent sintering at 850 degrees, the resistivity reached 35 x 10-8Ω.m. The copper-nickel alloy beneath became denser and exhibited a bright metallic color. Finally, FIB cross-sectioning was performed on the sample to observe finer structural details. The analysis revealed that in the bright copper-nickel alloy, most of the copper and nickel elements overlap in EDS elemental analysis, with an oxygen content of only 5%.

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