發光二極體發展至今已有相當久的時間，其封裝材料從一開始的環氧樹脂(Epoxy)到矽樹脂(Silicone)、再從矽樹脂到混雜型樹脂(hybrid)；封裝型態從一開始的引腳式封裝到SMT(Surface Mounted Devices)封裝、再從SMT封裝到COB(Chip-on-board)封裝，不同的需求也對應著不同的封裝材料與封裝型態，而不管是何種型態或是何種材料，光衰表現都是一項非常重要的指標。
在發光二極體的研發過程，最終會通過一連串的可靠度測試，不管是材料的密著性、延伸性、抗硫化表現、MSL(Moisture Sensitivity Level)測試、或相關的環境測試、極限測試、儲存測試等信賴性測試，若是光衰性質表現不佳，在材料選擇方面必定不會被錄用，所以也意味著業界雖然對於各種應用有不一樣的需求，但同時光衰的表現也是相當的重視。
本論文在發光二極體之封裝膠材的設計中，主要分析各種成分對於光衰表現的影響。由於在設計封裝膠材的配方中，除了基本的主劑、硬化劑之外，還涵蓋了過程需要的催化劑、抑制劑、甚至為了特定需求而添加的補強劑及添加劑，而這些不同的物質相對的也會在光衰表現上有所影響。
經由田口實驗進行測試後發現，白金在整體配方上除了對於實驗的反應速度之外，對於整體光衰表現上亦為最具影響之原因。在原配方中，白金比例只占整體配方之0.31%，經由最佳化實驗後，將白金含量減少為原配方之白金含量5%，這樣微乎其微的改變，卻使整體光衰減少了1.28%，從數據上來看整體光衰減少幅度感覺不大，但在擁有已知需求配方下，額外提升的亮度值卻是很有效益的。
在設計配方中，白金減量對光衰程度雖有所幫助，但過低的白金亦可能造成白金中毒、白金汙染或催化不足導致實驗催化劑喪失功能，故使封裝膠材無法固化。因此，雖然白金減量對光衰程度上有明顯影響程度，但必要的白金含量勢必也須依配方需求給定一基本含量比值，在此點上須特別注意。

Light-emitting diodes have been in development for quite some time, and their packaging materials range from epoxy to silicone and from silicone to hybrid; The initial package is available from Pin Through Hole tox SMT (Surface Mounted Devices) package and then from SMT package to COB (Chip-on-board) package. Different requirements also correspond to different package materials and package types, regardless of the type. The type or material, light decay performance is a very important indicator.
In the development of light-emitting diodes, a series of reliability tests will be passed, regardless of the adhesion, elongation, vulcanization resistance, MSL (Moisture Sensitivity Level) test, or related environmental tests, limit tests, reliability testing such as storage testing. If the performance of light decay is not good, it will not be accepted in material selection. Therefore, it means that the industry has different needs for various applications, but the performance of light decay is also highly valued.
In the design of the package rubber of the light-emitting diode, this paper mainly analyzes the influence of various components on the light decay performance. In the formulation of the encapsulant, in addition to the basic resin, hardener, the catalysts, inhibitors, and even the reinforcing agents and additives added for specific needs are covered. It will also have an impact on the performance of light decay.
After testing through the Taguchi experiment, it was found that platinum was the most influential factor in overall light decay in addition to the reaction speed of the experiment in the overall formulation. In the original formula, the platinum ratio only accounts for 0.31% of the overall formula. After the optimization experiment, the platinum content is reduced to 5% of the original formula, so that the slight change is reduced by 1.28%. From the data point of view, the overall light decay reduction does not feel much, but with the known demand formula, the additional brightness value is very effective.
In the design formula, the reduction of platinum can help the degree of light decay, but too low platinum may cause platinum poisoning, platinum pollution or insufficient catalyst to cause the experimental catalyst to lose its function, so the package rubber can not be cured. Therefore, although the reduction of platinum has a significant degree of influence on the degree of light decay, the necessary platinum content must also be given a basic content ratio according to the formulation demand, and special attention must be paid at this point.

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