| 研究生: |
陳治諺 Chen, Zhi-Yian |
|---|---|
| 論文名稱: |
以表面合金化法製備含銅抗菌不銹鋼 Preparation of copper-containing antibacterial stainless steel by surface alloying method |
| 指導教授: |
劉浩志
Liu, Hao-Chih |
| 共同指導: |
蔡文達
Tsai, Wen-Ta |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 材料科學及工程學系 Department of Materials Science and Engineering |
| 論文出版年: | 2021 |
| 畢業學年度: | 109 |
| 語文別: | 中文 |
| 論文頁數: | 119 |
| 中文關鍵詞: | SS440C 、電鍍銅 、電鍍鎳 、抗菌不銹鋼 、抗菌測試 |
| 外文關鍵詞: | SS440C, Copper, Nickel, Antibacterial stainless steel, Antibacterial test |
| 相關次數: | 點閱:163 下載:0 |
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抗菌不銹鋼是一種額外添加抗菌元素的不銹鋼種類,常見的抗菌元素包含銀與銅兩種,而銅相比銀的成本更為低廉,因此目前市面上多為含銅系列的抗菌不銹鋼。由於抗菌不銹鋼除了有美觀及良好耐蝕性質,同時表面又具備抗菌效果,因此在食品與醫療相關領域上具有極高的應用價值。然而,目前抗菌不銹鋼大多採用熔煉法將銅元素混合至不銹鋼材內,使整個鋼材均具備抗菌效果,但添加成本較高的銅會使生產單價提高,且鋼材的性能也會發生改變。由於抗菌效果僅發生在鋼材表面,是否需要整體鋼材均具備抗菌效果成為值得新考的問題,因此本研究開發一種新的製程使不銹鋼表面形成銅合金化層,使其在不改變基材的性能下鋼材表面又可產生抗菌效果。
在大氣環境對鍍銅SS440C進行熱處理後,從EDS分析發現表面銅層發生氧化,代表排除氧的影響是重要的製程條件,因此試片需在保護氣氛或真空環境下進行熱處理。後續採用真空封管將試片密封並熱處理後,證明能有效的隔絕大氣的影響,然而從EDS分析上均無法在SS440C表面辨別出Cu訊號,代表Cu在SS440C的溶解度極低。為了提高Cu在基板的溶解度,透過Ni均能對Cu與Fe互溶的特性,挑選Ni作為滲銅輔助劑。對Cu-Ni-SS440C試片熱處理後,從EDS能在SS440C表面辨別出明顯的Cu訊號。透過調整實驗參數後顯示鎳層厚度、持溫時間與溫度均會對滲銅行為產生影響,且目前可得到的最大滲銅深度約70 μm。而從XRD分析顯示當Ni擴散至基材內部時,會造SS440C的基地由BCC結構轉變為FCC結構,使基材對Cu的溶解度提高,也代表Ni的擴散行為會主導滲銅的效果。而在含銅量為10 wt.%的合金層表面進行抗菌測試後,顯示抗菌率可達99.50%。
綜合實驗結果,通過使用Ni作為滲銅輔助劑後,本研究成功對SS440C表面製備含銅合金層,其原理是透過Ni使SS440C基地產生FCC相變,而提高基材對Cu的溶解度。從該原理來看,顯示此技術可應用於大部分的肥粒鐵系不銹鋼,且可依據使用場合,通過製程參數調整來控制預期的滲銅深度,且經由抗菌測試得知滲銅表面能產生抗菌效果,證實該技術能有效地使鋼材表面產生抗菌效果。
Antibacterial stainless steel is one kind of the stainless steel which contain the Cu element to form antibacterial performance. At present, most of the antibacterial stainless steel is manufactured by the melting process. However, adding the high cost of copper increases its production price. Since the antibacterial effect only occurs on the surface, this research developed a new process to form a copper-containing alloy layer on the steel surface. This technique not only can form an antibacterial surface on the steel and without changing substrate mechanical properties.
After heated the Cu-plated SS440C in an atmospheric environment, the (EDS) analytical result shows that the copper layer is oxidized. It means the specimen must be protected in an inert atmosphere or a vacuum environment to prevent oxidization.
The XRD result proved that the vacuum seal process is effective to isolates specimen from atmosphere. However, after heated the Cu-plated SS440C, the EDS result shows there is no Cu signal can be detected on the SS440C surface. It means the solubility of Cu is too low to solute inside the SS440C. Because Ni has high solubility with Cu and Fe, Ni is selected as a copper-infiltration agent to let the Cu diffuse into the substrate. We found that the heated Cu-Ni-SS440C specimen significantly contains Cu element due to its EDS signal. The diffusion depth of Cu is influenced by the thickness of Ni layer, the holding temperature and time during heating process. Especially, this work was able to produce Cu-Ni-SS440C with 70 μm Cu alloy layer. Additionally, the XRD results indicates that α-Fe is changed to be γ-Fe due to the Ni diffusion into the SS440C matrix, causing a corresponding increase of Cu solubility. It is also found that the Cu diffusion is subjected to the variation of Ni diffusion rate and concentration.
Based on the experimental results, this study successfully prepared a copper-containing alloying layer on the SS440C surface by using Ni as a copper infiltration agent. The mechanism is caused by γ transformation due to Ni diffuses into the SS440C, then increasing the solubility of the Cu. It also means that this technology can be applied to most ferrous iron-based stainless steels, and the expected copper diffusion depth can be controlled by adjusting the parameters of the process according to the application. The antibacterial test showed the alloyed layer with a Cu content 10 wt.% can reach 99.50% of antibacterial rate, which proves that the technology can produce an antibacterial alloy on the steel surface.
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