本研究以化學方法與物理方法探討不同電漿(plasma)處理機台對於防焊綠漆(solder mask)表面高分子材料的影響及其和模封材料(molding compound)接著的關係。
首先，以表面全反射紅外線光譜儀(ATR-FTIR)分析防焊綠漆高分子表面經電漿處理後的官能基變化。綠漆經過兩種不同電漿設備處理，分別是Panasonic電漿機台與Jason電漿機台，觀察FTIR圖譜比照電漿處理前後的差異性，發現除了在波數3400 cm-1(OH基)附近有些微變化外，其他官能基並無明顯變化。另外，從FTIR圖譜發現不論是Panasonic或是Jason之機台電漿處理都並未在2500至3100 cm−1看到COOH基的相關峰值，推測防焊綠漆與模封材料兩者介面的黏著，其化學鍵結的主要貢獻應為防焊綠漆上OH基參與環氧樹脂模封反應。(除了表面全反射紅外線光譜儀分析是從日月光公司拿綠漆回來自行製作外，其餘分析之綠漆皆為日月光公司提供的基板。)
以化學分析電子光譜儀(ESCA)來分析防焊綠漆高分子表面經電漿處理後的碳元素與氧元素比。分析化學分析電子光譜儀結果比較Jason與Panasonic電漿機台處理後的綠漆表面氧碳比(O/C值)，發現經Panasonic電漿處理的試片O/C值都有顯著的增加，表示表面的含氧極性官能基增加，可幫助環氧樹脂模封反應。
用水滴接觸角(Contact Angle)量測其防焊綠漆高分子表面經電漿處理前後接觸角的變化。分析綠漆表面水滴接觸角的結果，從接觸角觀察濕潤(wetting)的程度。經Jason電漿與Panasonic電漿機台處理後的綠漆，接觸角都比未處理的綠漆接觸角下降許多，但兩者差異不大，以Panasonic電漿處理略低於經Jason電漿處理的接觸角。另外，經電漿處理的綠漆接觸角會隨著時間逐漸回復上升，此種情況稱為時效衰變(time decay)。
以原子力顯微鏡(AFM)的輕敲式(tapping)操作模式分析防焊綠漆高分子表面經電漿處理前後表面粗糙度(RMS)、表面積與3D立體圖的變化差異，觀察其物理性質的變化。從原子力顯微鏡觀察到未經電漿處理前的綠漆表面相當光滑，而太過於光滑的表面將會不利於與模封材料的接著。而經過Panasonic與Jason電漿機台處理後的綠漆表面可明顯觀察到粒狀結構(granular structure)，其中以經Panasonic機台電漿處理綠漆的表面積比經Jason機台電漿處理綠漆大。而此粒狀結構可幫助當模封材料進行熱壓封裝時，流動至綠漆高分子表面凹凸處固化，增加綠漆與模封材料機械互鎖的現象，顯示電漿處理表面改質可改善綠漆表面的物理性質。
以高解析場發射掃描式電子顯微鏡(HR FE-SEM)分析防焊綠漆高分子表面經電漿處理前後表面形貌的變化。從掃描式電子顯微鏡可以驗證原子力顯微鏡的分析結果，並且可以觀察到比原子力顯微鏡更大範圍的綠漆表面，證明經電漿處理後產生的粒狀結構並非是小部分或局部存在。

The study investigated the use of a nonreactive plasma formed in a radio frequency discharge as a treatment to the solder mask to reduce or eliminate the organic and inorganic contamination, which prevented the delamination between the solder mask and the molding compound. Argon was used as the plasma gas. The surfaces of solder mask have been modified with argon plasma treatment to enhance its adhesion with an epoxy molding compound. The effect of time and power was studied. The concentration of functional groups formed by plasma treatment such as hydroxyl and carbonyl groups was measured using attenuated total reflection Fourier transform infrared spectroscopy(ATR-FTIR). Electron spectroscopy for chemical analysis(ESCA) data were correlated to substrate hydrophilicity. Water contact angle measurements showed a well-activated surface after a few seconds of plasma treatment. The rapid functionalization was explained by the huge flux of oxygen atoms onto the sample surface. The AFM and SEM results indicated that plasma treatment could increase the surface roughness of the solder mask. As revealed by AFM and SEM measurements, these changes were accompanied by an increase in roughness in the form of granular structures.

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