當電子零件之尺寸日益縮小，逐片檢測模式之先進製程控制已成為半導體生產製程之關鍵性工作。為利將虛擬量測應用在逐片檢測模式之先進製程控制上，推估精度與即時性需求必須同時考量。

為有效提昇虛擬量測推估精度，本研究針對「考量建模樣本新鮮度及數量」、「精進參數篩選法則」及「提昇推估值可信度」等三個方向提出可行之精度提昇方法。

為驗證本研究所提出推估精度提昇之三種方法，採用國內某半導體廠之二個實際案例進行實驗，實驗結果證明該三種方法均能有效提昇推估精度，並能降低推估值之變異程度。

As the dimension of electronic devices shrink increasingly, wafer-to-wafer (W2W) advanced process control (APC) becomes more essential for the critical stages of production processes. To contribute to VM applications in W2W APC, both conjecture-accuracy and real-time requirements need to be considered.

In order to effectively enhance VM’s conjecture accuracy, this work proposes feasible approaches from three different aspects, including freshness and simple size of modeling, improvement of parameter-sifting algorithm, and enhancement of conjecture–value’s reliance level.

Two practical cases of a semiconductor manufacturing factory are adopted to verify and evaluate these three proposed approaches to see whether they can meet the accuracy and real-time requirements of W2W APC or not. Test results show that these three approaches can not only improve conjecture accuracy and reduce the variance of conjecture values

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