本究主要探討軟性電路板(Flexible Printed Circuit, FPC)，作為液晶顯示器，信號與電路傳遞之元件，在業界現行的高振動次數生產與使用條件下，對元件耐振動毀損對策之探討。
於大量樣本觀察時，發現液晶顯示器內置軟性電路板，主要毀損項目分為接合介面脫落與傳導線路斷裂兩種，故針對此二項目，進行五項能增強液晶顯示器內部軟性電路板抗振動能力的設計變更；並將關聯對策合併後，設計出五項實驗進行驗證與說明。
研究工具包含拉力測試、光學顯微鏡成像分析…等，和在有限條件下的單邊條件實驗設計、計次性振動與繞折破壞實驗…等驗證手法；並將此些各自獨立的對策案件，分為設計變更類：FPC疊構、導線垂直引道(Via)位移、金屬接合(Bonding)介面面積增加、印刷電路板(Printed Circuit Board, PCB)固定螺絲；與製程變更類，異方性導電膠膜(Anisotropic Conductive Film, ACF)位置變更、接合位置變更、接合條件改善…等多項對策；再將每一個獨立對策進行實驗確認，得到各分項目皆能有效提升FPC的耐振動能力；最終再將總和對策完成品，與對完全未對策前的樣品進行耐振動能力比較。
最終使用全對策樣品實際成果，證明總和此些對策項目可有效提高液晶顯示器中，軟性電路板的抗振動能力，來達到強健製程的目標。

In this study, we investigate the damage mechanism of flexible printed circuit board (FPC) the TFT-LCD fab production process first and then resolve the damage by suitable methods.
From the fab production data, the FPC damage originated from vibration in the production process. In order to improve vibration resistance ability of FPC, both the flexible circuit board structure and process parameters were adjusted under the condition of using the current process equipment. Five methods were proposed to optimize the process recipe which were individually tested first and then variously combined for their different effectiveness using the vibration tests for damage.
The impact of individual programs on the results is obtained via the t-test comparison, and the experimental results were confirmed by comparing the vibration resistance ability of the integrated approach with the initial sample. The results show that each individual approach can improve the vibration resistance of the FPC. Furthermore, the integrated approach improve the vibration resistance ability considerably and is successfully implemented for field applications.

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