電子IC構裝封膠製程中，封膠材料（EMC；Epoxy Molding Compound）在成型過程中會與IC模具表面產生黏著的現象，稱之為黏著效應（Adhesion Effects）；而此黏著效應對於脫模作業過程會有所影響，甚至可能會造成封膠失敗、可靠度不佳與生產良率降低等結果。所以如何在不影響現有模具設計前提下，能夠藉由適當的表面處理以及鍍膜選擇，來有效改善封裝生產線產能，是目前產業界及研究單位所重視的主題。
　　
　　本研究成功發展出正向與剪向複合黏著力測試系統，並針對不同表面鍍層，執行環保封膠材料（Green Compound）製程參數建立與效益評估此黏著力量，用來量測膠體與模具表面之間的正向與剪向模具沾黏效應。配合田口氏實驗設計法，針對影響IC封裝模具與塑料膠體間黏著力可控制之重要製程參數進行因子效應的評估。此外，藉由正向與剪向黏著力量變化的趨勢，希望可以找出黏著效應發生的原因，確實掌握清模時機，進而增加效益，解決IC封裝過程模具沾黏問題。

　In IC packaging, when epoxy molding compound（EMC）is filling the mold cavity and cured in the mold, adhesion effects occurs in the interface between mold surface, substrate, leadframe and EMC. Adhesive effects cause many problems, which may influence the ejection process of the molding, and then cause the package fails, such as wire cut off, lower the yield rate and reliability etc. To get rid of these problems, how to improve the mold design and make suitable surface treatments and specimen coating and improve products yield rate are the main issues for packaging.
　　
　This research designs and fabricates an automatic EMC normal and shear composite adhesion force test instrument that will in-situ measure the shear and normal bonding strength between mold surface and EMC. Several important parameters that affect the strength in IC packaging process will also be discussed in this research. A series of experiments were done by using the EMC normal and shear bonding strength tester with the help of Taguchi’s method, one can judge what parameters are important to reduce the magnitude of normal and shear bonding strength between EMC and mold surface.

[1]Loos, A. C., and G. S. Springer, “Curing of the Epoxy Matrix Composites,” J. Comp. Mat., 135, (1983).

[2]Springer, G. S., “Resin Flow During the Curing of Fiber Reinforced Composites,” J. Comp. Mat., 16, 400(1982).

[3]Gonzalez, U. F., S. F. Shen, and C. Cohen, “Rheological Characterization of Fast-Reacting Thermosets Through Spiral Flow Experiments,” Polym. Eng. Sci., 32, 172-181(1992).

[4]Frutiger, R. L., “The Effect of Flow on Cavity Surface Temperatures in Thermoset and Thermoplastic Injection Molding,” Ploym. Eng. Sci., 26, 243-254(1986).

[5]Lee, C. C., and C. L. Tucker III, “Flow and Heat Transfer in Compression Mold Filling,” J. Non-Newtonian Fluid Mech., 245-264(1987).

[6]Darvin R. Edwards, K. Gail Heinen, Steven K. Groothuis, Jesus E. Martinez, “ Shear Stress Evaluation of Plastic Packages,” IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. 12, no. 4, pp. 618-627 (1987).

[7]Samuel Kim, “The Role of Plastic Package Adhesion in Performance,” IEEE Transaction on Components, Hybrids, and Manufacturing Technology, vol. 14, no. 4, pp. 809-295 (1991).

[8]Minjin Ko, Myungwhan Kim, Dongsuk Shin, Yongjoon Park, Myungsun Moon and Inhee Lim, “Investigation on the Effect of Molding Compounds on Package Delamination,” 1997 Electronic Components and Technology Conference, pp. 1242-1247 (1997).

[9]Xiang Dai, Mark V. Brillhart, Paul S. Ho, “Polymer Interfacial Adhesion in Microelectronic Assemblies,” 1998 Electronic Components and Technology Conference, pp. 132-137 (1998).

[10]Naotaka Tanaka, Makoto Kitano, Tetsuo Kumazawa, Asao Nishimura, “Evaluation IC-Package Interface Delamination by Considering Moisture-Induced Molding-Compound Swelling,” IEEE Transaction on Components and Packaging Technology, vol. 22, no. 3, pp. 426-432 (1999).

[11]T. Scherban, B. Sun, J. Blaine, C. Block, B. Jin and E. Andideh, “Interfacial Adhesion of Copper-Low k Interconnects,” 2001 IEEE Interconnect Technology Conference, pp. 257–259 (2001).

[12]R. Balkova, S. Holcnerova, V. Cech, “Testing of Adhesion for Bonding of Polymer Composites,” International Journal of Adhesion & Adhesives, vol. 22, pp. 291-295 (2002).

[13]Terry L. Gordon, Martin E. Fakley, “The Influence of Elastic Modulus on Adhesion to Thermoplastics and Thermoset Materials,” International Journal of Adhesion & Adhesives, vol. 23, pp. 95-100 (2003).

[14]Steven Murray, Craig Hillman, and Michael Pecht, “ Environmental Aging and Deadhesion of Siloxane-Polyimide-Epoxy Adhesive,” IEEE Transactions on Components and Packaging Technology, vol. 26, no. 3, pp. 524-531 (2003).

[15]張祥傑, “微材料測試系統之設計與製作,” 國立成功大學機械工程研究所碩士論文(1999).

[16]王俊祥, ”電子封裝黏模效應之量測技術開發與研究,” 國立成功大學機械工程研究所碩士論文(2000).

[17]莊俊華, ”IC構裝黏模測試機之設計與製造,” 國立成功大學工程科學研究所碩士論文(2001).

[18]朱言主, “IC封裝模具黏著效應之研究,” 國立成功大學工程科學研究所碩士論文 (2002).

[19]Masaki Yoshii, Yoshihiro Mizukami and Hideo Shoji, “Evaluation Technologies on Moldability of Epoxy Molding Compounds for Encapsulation of Semiconductors,” 日立化成テクニカルレポート, no. 40, pp. 13-20 (2003).

[20]Shyang-Jye Chang and Sheng-Jye Hwang, “Design and Fabrication of an IC Encapsulation Mold Adhesion Force Tester,” IEEE Transaction on Electronics Packaging Manufacturing, vol. 26, no. 4, pp. 426-432 (1999).

[21]林俊宏, “EMC與金屬介面剪向黏著力試驗機台之研發,” 國立成功大學工程科學研究所碩士論文 (2003).

[22]黃勁華, “EMC與金屬介面剪向黏著力試驗機台之設計與改良,” 國立成功大學工程科學研究所碩士論文 (2004).

[23]張祥傑, “IC封裝年模力之量測與分析,” 國立成功大學機械工程學系博士論文 (2004).

[24]“Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds,” STD. SEMI G69-0996, (1996).

[25]“Standard Test Method for Apparent Shear Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by Tension Loading,” STD. ASTM D1002-94.

[26]“Standard Test Method for Cleavage Strength of Metal-to-Metal Adhesive Bonds,” STD. ASTM D1062-96.

[27]“Standard Test Method for Tensile Properties of Adhesive Bonds,” STD. ASTM D897-95a.

[28]“Standard Test Method for Strength Properties of Metal-to-Metal Adhesives by Compression Loading (Disk Shear),” STD. ASTM D2182-72.

[29]“Standard Recommended Practice for Determining the Strength of Adhesively Bonded Plastic Lap-Shear Sandwich Joint in Shear by Tension Loading,” STD. ASTM D3164-73.

[30]B. A. Chapman, H. D. DeFord, G. P. Wirtz and S. D. Brown, in: Technology of Glass, Ceramic, or Glass-Ceramic to Metal Sealing, W. E. Moddeman, C. W. Merten and D. P. Kramer, MD-Vol. 4, pp. 77-87. American Society of Mechanical Engineers, New York (1987).

[31]T. L. Anderson, ” Fracture Mechanics: Fundamentals and Applications, ” Copyrighted Materials, New York (1994).

[32]李輝煌編著, ”田口方法─品質設計的原理與實務,” 國立成功大學工程科學系(2000).