本研究探討不同氧化銅含量之鉍硼鋅矽玻璃對黏接鐵矽鉻合金粉與鎳銅鋅鐵氧磁體基板間之界面反應、顯微結構與玻璃黏接強度的影響。實驗結果發現，在熱處理溫度750°C下，鎳銅鋅鐵氧磁體基板與玻璃介面是主要藉由玻璃升溫時，轉變成熔融態滲入基材孔隙中，進行物理方式黏接；而在鐵矽鉻合金與玻璃介面則是由於鐵矽鉻合金組成中的鐵溶入玻璃內部產生氧化反應，促使玻璃中之銅離子產生還原反應，生成金屬銅的析出，因而同時以化學性及物理性黏接。
玻璃中添加氧化銅除了有助於增加潤濕性，提升玻璃的附著黏接性外，在熱處理過程會還原成小顆粒的金屬銅析出在鐵矽鉻合金與玻璃介面處，經由維氏硬度機壓痕試驗，發現此析出物有助於抑制裂痕延伸，此外，因發生氧化還原反應，使得玻璃微結構有孔洞的產生，而降低玻璃黏接強度。而當熱處理溫度提升至800°C、850°C，會促使金屬銅之析出量增多，也有助於玻璃黏接強度。

The effects of CuO content in Bi-B-Si-Zn glass on the interfacial reaction between the glasses and FeSiCr alloy powder and NiCuZn ferrites, microstructure and bonding strength were investigated. It was observed that the glass can be physically bonded with NiCuZn ferrites by the impregnation of glass melt into the pores of NiCuZn ferrites. For the interface between FeSiCr alloy and glass, the iron in FeSiCr alloy dissolved into glass and was oxidized into Fe3+ during heating. To maintain charge neutrality, the copper ions in the glass were reduced to elemental copper near the interface, which led to the chemical bonding and the physical bonding between FeSiCr alloy and glass at 750°C under air atmosphere. However, the addition of CuO in the glasses could not only increase wettability and adhesion but also be reduced to copper during heat treatment between FeSiCr alloy and glass. Due to redox reaction, the spherical copper-rich precipitates near the interface could inhibit the crack propagation by Vickers indentations but the presence of the pore in the glass layer would decrease the adhesion strength. Moreover, the amount of element copper precipitates increased as the heat treatment temperature was raised to 800°C and 850°C, leading to the increase in the adhesion strength between glass and FeSiCr alloy.

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