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研究生: 藍筱淳
Lan, Hsiao-Chun
論文名稱: 基於深度學習之高解析度極紫外光微影光罩盒影像小瑕疵自動檢測框架
An Automated Small Defect Detection Framework Based on Deep Learning for High-Resolution Extreme Ultraviolet Lithography Mask Pod Images
指導教授: 洪昌鈺
Horng, Ming-Huwi
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 人工智慧科技碩士學位學程
Graduate Program of Artificial Intelligence
論文出版年: 2026
畢業學年度: 114
語文別: 英文
論文頁數: 81
中文關鍵詞: EUV 光罩盒表面瑕疵檢測高解析度工業影像小物件偵測深度學習Tile-based 影像切割
外文關鍵詞: EUV Mask Pod, Surface Defect Detection, High-Resolution Industrial Images, Small Object Detection, Deep Learning, Tile-Based Image Partitioning
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  • 隨著半導體製程持續朝奈米尺度發展,極紫外光微影技術已成為先進晶片製造的重要核心。極紫外光光罩盒作為光罩於生產、儲存及運輸過程中的保護容器,其表面品質與結構完整性將直接影響光罩潔淨度及晶圓製程良率。然而,光罩盒在製造與長期使用過程中,容易因機械震動、靜電附著或人為操作而產生刮痕、汙點及凹陷等微小瑕疵。傳統人工檢測方式不僅耗時,亦容易受到檢測人員主觀判斷及環境光線變化影響,進而造成漏檢與誤判。
    本研究提出一套應用於極紫外光光罩盒之智慧化表面瑕疵檢測系統,針對高解析度工業影像中的微小瑕疵進行自動辨識。由於原始影像解析度極高,且瑕疵尺寸相對微小,若直接將完整影像輸入深度學習模型進行偵測,容易造成記憶體使用量過高,並可能因影像縮放而導致微小物件特徵流失。因此,本研究採用分塊式影像切割策略,將大型影像切分為多個較小的影像區塊進行偵測,再透過座標還原及非極大值抑制機制,整合各影像區塊的偵測結果,以完成原始高解析度影像之瑕疵定位。
    在模型設計方面,本研究導入適用於微小物件辨識之深度學習物件偵測模型,以提升微小瑕疵的辨識能力。實驗結果顯示,本研究所提出之方法能有效提升高解析度工業影像中的微小瑕疵檢測效能,並兼顧檢測準確性與實際部署需求。

    As semiconductor manufacturing processes continue to advance toward the nanometer scale, Extreme Ultraviolet Lithography (EUV) has become a critical technology for advanced integrated circuit fabrication. The EUV mask pod serves as a protective container for photomasks during production, storage, and transportation. Its surface quality and structural integrity directly affect mask cleanliness and wafer fabrication yield. However, during manufacturing and long-term usage, mask pods are susceptible to various surface defects, such as scratches, stains, and pits, caused by mechanical vibration, electrostatic contamination, or human handling. Traditional manual inspection methods are not only time-consuming but also prone to subjective judgment and environmental lighting variations, leading to missed detections and false alarms.
    This study proposes an intelligent surface defect inspection system for EUV mask pods, aiming to automatically identify tiny defects in high-resolution industrial images. Due to the extremely high resolution of the acquired images and the small size of the target defects, directly applying deep learning models often results in excessive memory consumption and the loss of small-object features. To address these challenges, a tile-based image partitioning strategy is adopted, in which large images are divided into multiple smaller patches for defect detection. The detection results are then reconstructed through coordinate restoration and integrated using a Non-Maximum Suppression (NMS) mechanism to generate the final defect predictions on the original large-scale images.
    Furthermore, a deep learning-based small object detection model is employed to enhance the recognition capability of tiny defects. Experimental results demonstrate that the proposed method effectively improves the detection performance of small defects in high-resolution industrial images while maintaining both high detection accuracy and practical deployment feasibility.

    摘要 1 Abstract 3 致謝 5 CONTENTS 6 LIST OF TABLES 8 LIST OF FIGURES 9 CHAPTER 1 INTRODUCTION 10 1.1 Background and Motivation 10 1.2 Research Problems and Challenges 11 1.3 Research Objectives 12 1.4 Research Methodology and System Architecture 13 1.5 Contributions 14 CHAPTER 2 RELATED WORK 16 2.1 Mask Pods and Industrial Visual Inspection 16 2.2 Image Processing Methods 18 2.3 Deep Learning-Based Object Detection 20 2.3.1 Two-stage object detection 21 2.3.2 One-stage object detection 24 2.3.3 Transformer-based object detection 27 2.4 Small Object Detection 30 2.5 Chapter summary 32 CHAPTER 3 METHODOLOGY 34 3.1 Architecture 34 3.2 Dataset and Annotation 36 3.3 Image Preprocessing 40 3.3.1 Region of Interest (ROI) Cropping 40 3.3.2 Tile-Based Image Partitioning 41 3.4 YOLO Model 42 3.4.1 YOLO Architecture 42 3.4.2 YOLO v11 Architecture 46 3.4.3 Model Training Parameter Settings 48 3.5 Full-Image Reconstruction and Post-Processing 51 3.5.1 Coordinate Restoration 51 3.5.2 Non-Maximum Suppression and Post-Processing 53 3.6 Evaluation Metrics 56 CHAPTER 4 EXPERIMENTS 61 CHAPTER 5 CONCLUSION AND FUTURE WORK 72 5.1 Conclusion 72 5.2 Future Work 74 REFERENCES 76

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