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研究生：	方怡平 Fang, Yi-Ping
論文名稱：	利用3-D FEM分析水分對RCP疊合封裝體之等效應變影響 The Effect of Moisture on the Equivalent Strain for the Redistributed Chip Package through the 3-D Finite Element Analysis
指導教授：	陳榮盛 Chen, Rong-Sheng
學位類別：	碩士 Master
系所名稱：	工學院 - 工程科學系 Department of Engineering Science
論文出版年：	2014
畢業學年度：	102
語文別：	中文
論文頁數：	124
中文關鍵詞：	再分配晶片封裝技術、等效應變、有限元素分析
外文關鍵詞：	Redistributed Chip Package, The Equivalent Strain, Finite Element Analysis
相關次數：	點閱：84 下載：3
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濕氣的存在，為近年來的研究的主題，當有水分殘存在封裝體內可能會導致在回焊過程中，材料之間產生爆米花現象而導致脫層，故透過有限元素分析能夠模擬整個過程。
本文之RCP疊合封裝體係由上方超薄型細間距球柵陣列封裝體(VFBGA)經RCP多佈線層技術與下方球閘陣列封裝體(SPBGA)疊合而成。其分析方法採用ANSYS12.0有限元素軟體針對RCP疊合封裝體進行模擬分析，首先在JEDEC規範下給予不同吸濕溫度條件30oC/60%RH與85oC/60%RH，並觀察在回焊過程中，預測封裝體中的溼度分布與去濕後的殘存水分。其次，進行不同的吸濕濕度條件85oC/60%RH與85oC/85%RH，並與先前的結果作比較，以探討不同濕度與不同溫度下對於水分擴散的影響。最後，進行差異分析RCP疊合封裝體之封膠材料之楊氏模數、熱膨脹係數與吸水膨脹係數對於結構之影響，同時可了解各因子對於結構的敏感度。其結果顯示熱膨脹係數為影響結構等效應變最大，其值為0.051476，但敏感度則以吸水膨脹係數較高可達11.3%。

In recent years, the moisture in the package has become the essential issue for research. The residual moisture always leads to the popcorn failure and then interfacial delamination within materials in the reflow process. Hence, the entire process of the package is simulated by finite element analysis.
In this paper, the RCP with PoP (Package on Package) package is constructed by stacking the upper very fine pitch ball grid array (VFBGA) with RCP’s multiple redistribution layers technology on the lower stack package ball grid array (SPBGA). First of all, ANSYS, the finite element software is adopted for simulation analysis. Based on JEDEC, the RCP with PoP model is subject to two conditions, 30oC/60%RH and 85oC/60%RH in the moisture absorption process. In the reflow process, to the moisture distribution and residual moisture with moisture desorption are predicted. Secondly, the different conditions of moisture absorption, 85oC/60%RH and 85oC/85%RH, are subjected to compare with previous results and investigate the effect of different relative humidity and temperature on the moisture diffusion. Finally, the variance analysis is conducted to investigate the impacts of the CTE, Young’s modulus and coefficient of moisture expansion of underfill of RCP with PoP package on the structure. Meanwhile, the sensibility of various parameters for the package is recognized. The results indicate the CTE of underfill on the Von Mises Strain for package is largest and the value is 0.051476. However, the high sensitivity of each parameter for the package is the coefficient of moisture expansion of underfill, and the value is 11.3%.

中文摘要…………………………………………………………	I
Abstract…………………………………………………………… II
誌謝…………………………………………………………VII
符號表…………………………………………………………VIII
表目錄…………………………………………………………XV
圖目錄…………………………………………………………XVII
第一章 緒論…………………………………………………………1
1-1前言	…………………………………………………………1
1-2研究動機與目的…………………………………………………………2
1-3文獻回顧…………………………………………………………2
1-4研究方法…………………………………………………………4
1-5章節提要…………………………………………………………5
第二章 理論基礎…………………………………………………………7
2.1 RCP疊合封裝體研究主題…………………………………………………………7
2.2熱傳基礎理論…………………………………………………………8
2.2.1熱傳導(Thermal Conduction)[11]…………………………………………………………8
2.3濕度傳導基礎理論…………………………………………………………10
2.3.1  3-D費肯擴散理論(Fick’s law of diffusion)[10]…………………………………………………………10
2.3.2吸濕(moisture absorption)[11]…………………………………………………………13
2.3.3去濕(moisture desorption) [11]…………………………………………………………13
2.4熱應變(Thermal Strain)…………………………………………………………16
2.5濕應變(Hygro Strain)…………………………………………………………16
2.6蒸氣應變(Vapor Pressure Strain)、蒸氣應力(Vapor Pressure Stress)…………………………………………………………17
2.7 等效應變( Equivalent Strain)與等效應力(Equivalent Stress)…………………………………………………………17
2.8 整體系統之力學分析…………………………………………………………19
第三章 分析模型建立與評估…………………………………………………………29
3.1 RCP疊合封裝體介紹…………………………………………………………29
3.1.1 RCP疊合封裝之製程…………………………………………………………30
3.1.2 RCP疊合封裝體之結構…………………………………………………………30
3.2 RCP疊合封裝體之基本假設…………………………………………………………30
3.3 RCP疊合封裝體之材料參數…………………………………………………………31
3.4RCP疊合封裝體模型與網格化…………………………………………………………31
3.5熱應變模擬…………………………………………………………32
3.5.1.熱分析之有限元素類型…………………………………………………………32
3.5.2.熱分析之邊界條件設定…………………………………………………………32
3.5.3.熱分析之溫度負載…………………………………………………………33
3.5.4 熱分析之觀察位置…………………………………………………………33
3.6濕度模擬…………………………………………………………3
3.6.1.濕度分析之有限元素類型[11]…………………………………………………………33
3.6.2.濕度分析之邊界條件設定[11]…………………………………………………………34
3.6.3 濕度分析之觀察位置與討論…………………………………………………………34
3.7分析模型的結果與探討…………………………………………………………35
3.7.1熱應變模擬結果分析…………………………………………………………35
3.7.2濕度模擬結果分析…………………………………………………………35
3.7.3結果分析與討論…………………………………………………………38
第四章 水分差異分析與討論…………………………………………………………93
4.1不同相對濕度下的濕度分析…………………………………………………………93
4.1.1吸濕…………………………………………………………93
4.1.2去濕…………………………………………………………94
4.1.3濕轉結構…………………………………………………………94
4.1.4蒸氣壓力…………………………………………………………95
4.1.5結果分析與討論…………………………………………………………95
4.2封膠材料性質之差異分析…………………………………………………………95
4.2.1材料參數之變更…………………………………………………………96
4.2.2變更熱膨脹係數之結果…………………………………………………………96
4.2.3變更吸水膨脹係數之結果…………………………………………………………96
4.2.4變更楊氏係數之結果…………………………………………………………97
4.2.5結果分析與討論…………………………………………………………97
第五章 結論與未來展望…………………………………………………………119
5-1 結論…………………………………………………………119
5-2未來展望…………………………………………………………121
參考文獻…………………………………………………………122
                                    

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