本文研究在Sn-Ag 銲料中添加不同比例的Sb (0~8.78 wt%)，針對Sb 的添加對於Sn-Ag 銲料微結構及界面層成長行為之影響做深入之探討，並進行150℃高溫儲存試驗及剪切強度測試以評估其可靠度。
本實驗以Sn2.58Ag、Sn2.82Ag1.75Sb、Sn2.87Ag4.75Sb及Sn2.7Ag8.78Sb 為實驗材料。為模擬實際銲點，因此採用一般FR-4印刷電路板為基板並以熱浸法(Hot Dipping)的方式進行接合，試件設計為單剪試件。銲接完成後進行150℃高溫儲存試驗，儲存時間分別為0、25、100、225 及625 小時。實驗結果顯示，添加1.75% Sb之後，大部分的Sb會固溶在錫基地中，而部分則會使Ag3Sn轉變為ε相Ag3(Sn,Sb)化合物，而使原本Ag3Sn 的粗大化現象得到改善；而添加量達到4.75％及8.78 ％時，銲料基地中會明顯生成SbSn 化合物，大小約1~2μm，此化合物在150℃高溫儲存下並沒有明顯粗大化的現象。銲料之微硬度值會隨著Sb 的添加而逐漸增加，由HV 13.2 (Sn2.58Ag)上升至HV 25.4(添加8.78% Sb)。高溫儲存試驗結果顯示，隨著高溫儲存時間的增加，銲接點之界面層的厚度與時間的平方根呈線性關係，且粗糙度亦隨之增加；而隨著Sb 添加量的增加，金屬間化合物層的成長速率會隨之降低，同時Sb 原子會有擴散至界面層之現象。
未經熱儲存之銲點剪切強度隨著Sb 的添加量增加而提升，強度由27.8 Mpa (Sn2.58Ag)提升至29 MPa (1.75% Sb)、30.4 MPa (4.75% Sb)及43.4 MPa (8.78% Sb)；經由斷口分析發現，銲點均是由銲料與金屬間化合物Cu6Sn5 之界面開裂，形成韌窩之破斷形貌。

Abstract
The goal of this research is to evaluate the effect of Sn-Ag solder with different Sb addition(0~8.78wt%) on microstructure, intermetallic compound(IMC) and mechanical properties. Simultaneously the reliability and heat-resistance ability of solder joint with different Sb addition will be evaluated by high temperature storage test.
There are four solder: Sn2.58Ag, Sn2.82Ag1.75Sb, Sn2.87Ag4.75Sb, and Sn2.7Ag8.78Sb in this research. To simulate the true Solder joint, we used the FR-4 PCB as the substrate material and joint by hot dipping method. The design of the shear specimen is single-lap shear specimen. High temperature storage test is performed after soldering. The storage temperature are 150℃, and the storage time are 0, 25, 100, 228 and 625 hrs respectively. Experimental results show that Sn-Ag solder with 1.75% Sb addition, most of Sb addition is solved in β-Sn matrix, and the rest makes the Ag3Sn converting to ε(Ag3(Sn,Sb)) ternary compound. The coarse of Ag3Sn would be improved. Sn-Ag solder with the Sb addition reach 4.75% and 8.78%, the SbSn compound will form in β-Sn matrix. The growing behavior of SbSn in 150℃ heat storage is not apparent. The Vickers Hardness of Solder increases with the ratio of Sb addition, the hardness value is HV 13.2 (Sn2.58Ag) and HV 25.4(with 8.78% Sb addition). High temperature storage test shows that the thickness of IMC is proportional to the square root of storage time, and the IMC layer becomes more roughed. The growing rate of IMC layer decreases with the increase in Sb addition, and Sb atom diffuse to IMC layer.
The shear strength of as-soldered solder joints increase with the ratio of Sb addition. The shear strength value is 27.8 (0%Sb), 29 (1.75%Sb), 30.5 (4.75%Sb) and 43.4(8.78%Sb) MPa respectively. Fractographic analysis showed that the fracture occurre on Cu6Sn5/Solder interface when solder joints have shear force, and the fracture surface accompanied with elongated dimple formation.

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