本論文研究係利用壓印製程，製作銀導線圖案。首先進行黃光微影製程，在矽基板上製作適當的圖案，再以RIE對其進行乾式蝕刻製作成模具。接著使用反轉式壓印技術，將MAA與2-HEMA重量比為 1：1之阻劑，壓印在基板上硬化成型，再以UV-ozone對阻劑殘留層進行蝕刻並讓基板表面生成親水OH基，然後以旋轉塗佈機將硝酸銀水溶液均勻地塗佈在圖案凹槽中，進行乙二醇蒸氣還原製程。乙二醇蒸氣還原形成銀線之後，浸入TMAH鹼液中再以超音波震盪，使阻劑層完全脫離，再以直流量測系統 (IVCI)量測電性；其電性值與理論的純銀電性相近，具備成為導線的特質。因此，只要有適當的製作流程，便能將此銀線製程應用在實際產品上。

The conductive silver lines were prepared by ethylene glycol vapor reduction with imprinting lithography techniques. At first, photo lithography was used to make patterns on the silicon wafer which was then put into the RIE chamber. After the dry etching process, the mold was prepared. Then, the substrate was treated with n-octadecyltrichlorosilane (OTS) to make the surface hydrophobic. That could help the imprinting process. There are several imprinting techniques can be used. In this process, the reversal imprinting was chosen. The resist used in the reversal imprinting was the mixture of MAA and 2-HEMA. After obtaining the patterns on the substrate, the AgNO3 aqueous solution was spun on the substrate and filled in the patterns. After AgNO3 being reduced by ethylene glycol vapor, the resist was removed to get the Ag conductive line patterns on the substrate. The conductivity of the silver conductor was close to the bulk silver.

[1] http://home.pchome.com.tw/art/kingaudio/cable-1.htm
[2] S. Y. Chou, P. R. Krauss, W. Zhang, L. Guo and L. Zhuang, “Sub-10 nm imprint lithography and applications”, J.Vac.Sci.Technol B, 15 ,2897. (1997)
[3] J. Wang, X. Sun, L. Chen and S. Y. Chou, “ Direct nanoimprint of submicron organic light-emitting structures”, Appl. Phys. Lett., 75 , 2767. (1999)
[4] A. Lebib, Y. Chen, J. Bourneix, F. Carcenac, E. Cambril, L. Couraud and H. Launois, ” Nanoimprint lithography for a large area pattern replication ” Microelectronic Engeneering, 46, 319. (1999)
[5] S. Y. Chou, P. R. Krauss, P. J. Renstrom, ”Imprint lithography with 25-nanometer resolution”, Science ,272, 85. (1996)
[6] S. Y. Chou, P. R. Krauss, P. J. Renstrom, ” Imprint of sub-25 nm vias and trenches in polymers”, Appl. Phys. Lett. 67, 3114. (1995)
[7] Z. Yu, S. J. Schablitsky, S. Y. Chou, “Nanoscale GaAs metal– semiconductor–metal photodetectors fabricated using nanoimprint lithography”, Appl. Phys. Lett, 74, 2381. (1999)
[8] J. Wang, S. Schablitsky, Z. Yu, W. Wu, S. Y. Chou, ”Fabrication of a new broadband waveguide polarizer with a double-layer 190 nm period metal-gratings using nanoimprint lithography”, J. Vac. Sci. Technol. B, 17, 2957. (1999)
[9] B. Heidari, I. Maximov, E. L. Sarwe and L. Montelius, ” Nanoimprint lithography at the 6 in. wafer scale”, J. Vac .Sci. Technol B, 18, 3552. (2000)
[10] T. Haatainen, J. Ahopelto, G. Gruetzner, M. Fink and K. Pfeiffer, Proc SPIE 3997, 874. (2000)
[11] K. Pfeiffer, G. Bleidiessel, G. Gruetzner, H. Schulz, T. Hoffmann, H. C. Scheer, T. Sotomayor and J. Ahopelto, ”Suitability of new polymer materials with adjustable glass temperature for nano-imprinting ”, Microelectronic Engineering, 46, 431. (1999)
[12] H. Schulz, D. Lyebyedyev, H. C. Scheer, K. Pfeiffer, G. Bleidiessel, G. Gruetzner and J. Ahopelto, ”Master replication into thermosetting polymers for nanoimprinting”, J.Vac. Sci. Technol. B, 18, 3582. (2000)
[13] T. Mäkela, T. Haatainen, J. Ahopelto and H. Isolato, “Imprinted electrically conductive patterns from a polyaniline blend”, J Vac. Sci. Technol. B, 19 (2), 487. (2001)
[14] V. Studer, A. Pépin, Y. Chen, “Nanoembossing of thermoplastic polymers for microfluidic applications”, Appl. Phys. Lett. 80, 3614. (2002)
[15] K. Pfeiffer, M. Fink, G. Aherens, G. Gruetzner, F. Reuther, J. Seekamp, S. Zankovych, C. M. S. Torres, I. Maximov, M. Beck, M. Grazcyk, L. Montelius, H. Schulz, H. C. Scheer and F. Steingrueber, “Polymer stamps for nanoimprinting”, Microelectronic Engineering 61-62, 393. (2002)
[16] M. Beck, M. Graczyk, I. Maximov, E. L. Sarwe, T. G. I. Ling, M. Keil and L. Montelius, “Improving stamps for 10 nm level wafer scale nanoimprint lithography”, Microelectronic Engineering 61-62, 441. (2002)
[17] D. M. Austin and S. Y. Chou, “Fabrication of 70 nm channel length polymer organic thin-film transistors using nanoimprint lithography”, Applied Physics Letters, 81, 4431. (2002)
[18] D. Pisignano, L. Persano, P. Visconti, R. Cingolani, and G. Gigli, ”Oligomer-based organic distributed feedback lasers by room-temperature nanoimprint lithography”, Applied Physics Letter, 83, 2545. (2003)
[19] A. Lebib, S. P. Li, M. Natali and Y. Chen, “Size and thickness dependencies of magnetization reversal in Co dot arrays”, J. Appl Phys 89, 3892. (2001)，
[20] P. R. Krauss and S. Y. Chou, “Nano-compact disks with 400 Gbit/in2 storage density fabricated using nanoimprint lithography and read with proximal probe”, Appl. Phys. Lett, 71, 3174. (1997)
[21] T. C. Bailey, S. C. Johnson, D. J. Resnick, S. V. Sreenivasan, J. G. Ekerdt, C. G. Willson, "Step and Flash Imprint Lithography: An Efficient Nanoscale Printing Technology", J. Photopolymer Sci. Tech, 15 (3), 481. (2002)
[22] D. J. Resnick, T. C. Bailey, W. J. Dauksher, D. Mancini, K. J. Nordquist, E. Ainley, K. Gehoski, J. H. Baker, S. Johnson, M. Meissl, S. V. Sreenivasan, J. G. Ekerdt and C. G. Willson, "High Resolution Templates for Step and Flash Imprint Lithography", Proc. SPIE, 4688, 205. (2002)
[23] W. J. Dauksher, K. J. Nordquist, D. P. Mancini, D. J. Resnick, J. H.Baker, A. E. Hooper, A. A. Talin, T. C. Bailey, A. M. Lemonds, S. V. Sreenivasan, J. G. Ekerdt and C. G. Willson, "Characterization of and Imprint Results using ITO-based Step and Flash Imprint Lithography Templates", J. Vac. Sci. Tech. B , 20 (6), 2857. (2002)
[24] D. P. Mancini, K. A. Gehoski, E. Ainley, K. J. Nordquist, D. J. Resnick, T. C. Bailey, S. V. Sreenivasan, J. G. Ekerdt and C. G. Willson, "Hydrogen Silsesquioxane for Direct E-beam Patterning of Step and Flash Imprint Lithography Templates", J. Vac. Sci. Tech. B, 20 (6), 2896-2901. (2002)
[25] S. V. Sreenivasan, C. G. Willson, N. E. Schumaker and D. J. Resnick, "Cost of Ownership Analysis for Patterning Using Step and Flash Imprint Lithography", Proc. SPIE: Proc. SPIE, 4688. (2002)
[26] M. E. Colburn, T. C. Bailey, B. J. Choi, J. G. Ekerdt, S. V. Sreenivasan and C. G. Willson, "Development and advantages of step and flash imprint lithography", Solid State Technology, 46 (7), 67. (2001)
[27] T. C. Bailey, D. J. Resnick, D. Mancini, K. J. Nordquist, W. J. Dauksher, E. Ainley, A. Talin, K. Gehoski, J. H. Baker, B. J. Choi, S. Johnson, M. E. Colburn, M. Meissl, S. V. Sreenivasan, J. G. Ekerdt and C. G. Willson, "Template Fabrication Schemes for Step and Flash Imprint Lithography", Microelectron. Engineering, 61-62, 461. (2001)
[28] B. J. Choi, M. Meissl, M. E. Colburn, T. C. Bailey, P. Ruchhoeft, S. V. Sreenivasan, F. Prins, S. Banerjee, J. G. Ekerdt and C. G. Willson, "Layer-to-Layer Alignment for Step and Flash Imprint Lithography", Proc. SPIE, 4343, 436. (2001)
[29] B. J. Choi, S. Johnson, M. E. Colburn, S. V. Sreenivasan and C. G. Willson, "Design of orientation stages for step and flash imprint lithography", Precision Engineering, 25 (3) , 192. (2001)
[30] M. E. Colburn, A. Grot, B. J. Choi, M. Amistoso, T. C. Bailey, S. V. Sreenivasan, J. G. Ekerdt and C. G. Willson, "Patterning non-flat substrates with a low pressure, room temperature imprint lithography process", J. Vac. Sci. Tech. B, 19 (6) , 2162. (2001)
[31] M. E. Colburn, A. Grot, M. Amistoso, B. J. Choi, T. C. Bailey, J. Ekerdt, S. V. Sreenivasan, J. Hollenhorst and C. G. Willson, "Step and Flash Imprint Lithography for sub-100nm Patterning", Proc. SPIE, 3997, 453. (2000)
[32] B. J. Choi, S. Johnson, S. V. Sreenivasan, M. E. Colburn, T. C. Bailey and C. G. Willson, "Partially Constrained Compliant Stages for High Resolution Imprint Lithography", Proc. ASME DETC 2000 7B, 861. (2000)
[33] M. E. Colburn, S. Johnson, M. Stewart, S. Damle, T. C. Bailey, B. Choi, M. Wedlake, T. Michaelson, S. V. Sreenivasan, J. G. Ekerdt and C. G. Willson, "Step and Flash Imprint Lithography: A new approach to high resolution patterning", Proc. SPIE, 3676 (I), 379. (1999)
[34] P. Ruchoeft, M. E. Colburn, B. Choi, H. Noinu, S. Johnson, T. C. Bailey, S. Damle, M. Stewart, J. G. Ekerdt, S. V. Sreenivasan, J. C. Wolfe and C. G. Willson, "Patterning curved surfaces: Template generation by ion beam proximity lithography and relief transfer by Step and Flash Imprint Lithography", J. Vac. Sci. Tech. B , 17 (6), 2965. (1999)
[35] S. Y. Chou, P. R. Krauss, and P. J. Renstrom, ” Nanoimprint lithography ”, J. Vac. Sci. Technol. B, 14 (6), 4129. (1996)。
[36] K. Pfeiffer, M. Fink, G. Aherens, G. Gruetzner, F. Reuther, J. Seekamp, S. Zankovych, C. M. S. Torres, I. Maximov, M. Beck, M. Grazcyk, L. Montelius, H. Schulz, H. C. Scheer and F. Steingrueber, “Polymer stamps for nanoimprinting”, Microelectronic Engineering 61-62, 393. (2002)
[37] T. C. Bailey, B. J. Choi, M. E. Colburn, M. Meissl, S. Shaya, J. G. Ekerdt, S. V. Sreenivasan, and C. G. Willson, ”High resolution templates for step and flash imprint lithography”, J. Vac. Sci. Technol. B. 18, 3572. (2000)
[38] B. Vratzov, A. Fuchs, M. Lemme, W. Henschel, and H. Kurz, ” Large scale ultraviolet-based nanoimprint lithography”, J. Vac. Sci. Technol. B. 21 (6). (2003)
[39] S. Y. Chou, P. R. Kraus, P. J. Renstrom, “ Nanoimprint lithography”, J. Vac. Sci. Technol. B 14 (6), 4129. (1996)
[40] J. Gierak, D. Mailly, G. Faini, J. L. Pelouard, P. Denk, F. Pardo, J. Y. Marzin, A. Septier, G. Schmid, J. Ferre, R. Hydman, C. Chappert, F. Flictein, B. Gayral and J. M. Gerard, ”Nano-fabrication with focused ion beams”, Microelectronic Engineering, 57-58, 865. (2001)
[41] M. T. Li, J. Wang, L. Zhuang, and S. Y. Chou, ” Fabrication of circular optical structures with a 20 nm minimum feature size using nanoimprint lithography”, Appl. Phys. Lett , 76, 673. (2000)
[42] T. W. Odom, J. C. Love, D. B. Wolfe, K. E. Paul, and G. M. Whitesides, ”Improved Pattern Transfer in Soft Lithography Using Composite Stamps”, Langmuir, 18, 5314. (2002)
[43] J. A. Rogers, K. E. Paul, R. J. Jackman, G. M. Whitesides, "Generating ~90 nanometer features using near-field contact-mode photolithography with an elastomeric phase mask", J. Vac. Sci. Technol. B, 26, 59. (1998)
[44] H. Tan, A. Gilbertson, S. Y. Chou, “Roller nanoimprint lithography”, J. Vac. Sci. Technol. B, 16, 3926. (1999)
[45] E. Delamarche, H. Schmid, H. A. Biebuyck, B. Michel ”Stability of molded polydimethylsiloxane microstructures”, Advanced Materials 9 (9), 741. (1997)
[46] K. M. Choi and J. A. Rogers, “A Photocurable Poly(dimethylsiloxane) Chemistry Designed for SoftLithographic Molding and Printing in the Nanometer Regime”, J. AM. CHEM. SOC. 125 (14), 4060. (2003)
[47] T. C. Bailey, B. J. Smith, B. J. Choi, M. E. Colburn, M. Meissl, S. V. Sreenivasan, J. G. Ekerdt and C. G. Willson, "Step and Flash Imprint Lithography: Defect Analysis", J. Vac. Sci. Technol. B, 19 (6), 2806. (2001)
[48] N. S. Cameron1, A. Ott1, H. Roberge1, and T. Veres1, ”Hot Embossing Lithography Release Layer Characterization by Chemical Force Microscopy”, Mater. Res. Soc. Symp. Proc. 872.
[49] H. C. Scheer, H. Schulz, T. Hoffmann and C. M. S. Torres, in: H. S. Nalwa (Ed.) Handbook of Thin Film Materials, 5, Academic Press, New York, 1- 60. (2002)
[50] 馮新德，”高分子合成化學”，上冊，科學出版社，北京(1981)
[51] M. E. Colburn, I. Suez, B. J. Choi, M. Meissl, T. C. Bailey, S. V. Sreenivasan, J. G. Ekerdt and C. G. Willson, "Characterization and Modeling of Volumetric and Mechanical Properties for Step and Flash Imprint Lithography Photopolymers." J. Vac. Sci. Tech. B. 19 (6), 2685. (2001)
[52] M. E. Colburn, “Step and Flash Imprint Lithography: A Low-Pressure, Room-Temperature Nanoimprint Lithography”, Department of Chemical Engineering; Ph.D. Thesis. 2001, Austin, TX: The University of Texas at Austin.
[53] 莊萬發 , 超微粒子理論應用 , 復漢出版社 , 台南 (1995)
[54] 蘇品書 , 超微粒子材料技術 , 復漢出版社 , 台南 (1989)
[55] N. Toshima, T. Yonezawa, S. Isoda, “Aggregated structure analysis of polymer-protected platinum/ruthenium colloidal dispersions using EXAFS, HRTEM, and electron diffraction measurements”, Journal of Colloid and Interface Science, 283 (1), 64. (2005)
[56] 史宗淮 , 微粉製程技術簡介 , 42 , 28. (1995)
[57] M. T. Reetz, S. A. Quaiser, “New method for the preparation of nanostructured metal clusters“, Angew. Chem. , Int. Ed. Engl. , 34 (20), 2240. (1995)
[58] S. Remita, M. Mostafavi, M. O. Delcourt, J. Belloni , “ Ligand effects on solvated metal cluster properties”, Journal de Chimie Physique et de Physico-Chimie Biologique , 93 (10), 1828. (1996)
[59] W. Ren, K. Y. Siu, H. S. Suzuki, G. Ramamurthy, “Performance of TCP in IP/ATM internetworks. “, Computer Communications , 21 (17) , 1610. (1998)
[60] J. T. Wu, S. L. C. Hsu*, M. H. Tsai, W. S. Hwang, “Conductive silver patterns via ethylene glycol vapor reduction of ink-jet printed silver nitrate tracks on a polyimide substrate”, Thin Solid Films, 2009, in pressed.