近年來由於電子產品不斷地推陳出新，智慧型手機與手持平板更是朝著多功能整合的方向前進，因此晶片的封裝整合技術將是重要的課題。本文之RCP疊合封裝係將上層超薄型細間距球閘陣列封裝體經多佈線層技術與下層球閘陣列封裝體疊合而成，希冀透過最佳化模擬分析能提高封裝體之疲勞壽命。
本文採用ANSYS12.0有限元素軟體針對RCP疊合封裝體進行模擬分析，首先針對模型施予低溫-40 到高溫125 的溫度循環負載，並導入Global/Local方法以提高模擬效率，其中錫球考慮為黏塑性材料，其他材料則視為線彈性，藉由Coffin-Manson與Morrow之能量觀點針對RCP疊合封裝體之關鍵錫球進行疲勞壽命預測。
其次，以部分因子實驗法篩選出對關鍵錫球具有較大影響力之因子，並建立迴歸模型之反應曲面，然後透過基因遺傳演算法求得最佳設計參數 與反應值 。
最後，設定合理允許目標誤差 ，利用區間式基因遺傳演算法進行各設計參數之區間範圍搜尋，同時可了解各設計參數對於關鍵錫球之平均應變能密度的敏感度。

In recent years, the electronic products have been well developed. Among them, the smart cellphone and the handheld pad tend to be integrated with multi-function. Therefore, the packaging technology for chip becomes a critical issue in the future. In this paper, the RCP (Redistributed Chip Package) with PoP (Package on Package) consists of the upper very fine pitch ball grid array (VFBGA) and the lower stack package ball grid array (SPBGA). Furthermore, the upper and the lower layers are stacked by the multiple redistribution layers technology. Hence, this paper is expected to elevate the fatigue life of the package by an optimized analysis.

First of all, ANSYS, the finite element software is adopted. The RCP with PoP model is subjected the thermal cycles of -40℃~125℃ through Global/Local method to improve the simulation efficiency. To predict the fatigue life of the critical solder ball made of viscoplastic material, the Coffin-Manson model and the Morrow’s energy-based model are applied. Apart from the solder ball, all the components are assumed to be elastic materials.

Secondly, the factors with more significant effect to critical solder balls are selected as the design parameters by the fractional factorial design method and the response surface of regression model is developed. Then, the Genetic Algorithm is applied to obtain the optimal design parameter and optimal response.

Finally, the allowable error range is provided properly and then the range parameter is determined by interval Genetic Algorithm. Meanwhile, the sensibility of each design parameter related to the average strain energy density for critical solder ball is recognized.

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