三維模塑互聯器件（3D-Molded Interconnect Devices）簡稱3D-MID。是在塑膠製品上整合機械與電子的功能，在製品上具有電路設計，使得該產品同時具有機械結構與電子電路特性。本文是以模內裝飾射出成型製程（In-Mold Decoration, 簡稱IMD）應用在3D-MID，IMD製程是把設計電路線印刷在塑膠薄膜上，此塑膠薄膜再經由熱壓成型成為產品外形之3D形狀，此3D曲面薄膜經沖裁後再嵌入模穴中做射出成形製造為3D-MID產品。IMD製程優點為設備成本低、針對單一產品外觀可印刷多樣化之線路設計、且製程速度較快等。
IMD製程主要包括四個階段：1.薄膜油墨印刷。2.薄膜立體成型。3.薄膜沖裁。4.薄膜嵌入射出成型。每個階段都會影響到成品的品質與成本，故本文將探討IMD製程階段對3D-MID之品質影響。
在第一階段薄膜油墨印刷所遇到的問題為一般電路薄膜是採用導電銀漿印刷，但由於導電銀漿成本相當昂貴。本實驗提出一個新製程是以導電油墨經由電鍍製程來提高導電性及降低成本。實驗結果顯示，油墨添加20%碳黑導電填料，在PC薄膜上印刷線寬0.9mm×線長40mm，量測其電阻值為104Ω，經由電鍍銅後電阻值為1.3Ω。
在第二階段薄膜立體成型所遇到的問題為塑膠薄膜在熱壓時受到沖頭及模具溫度影響，薄膜越容易拉伸變形，導致薄膜上設計的圖案產生失真變形。本實驗設計一副熱壓模具以半圓球直徑100mm，高度50mm做為研究模型，薄膜材質為PC(厚度0.178mm)，探討薄膜上設計電路圖案由2D轉變成3D及3D映射到2D圖案。實驗結果顯示，在熱壓成型過程中，在產品頂端處無產生薄膜變形，在側邊處薄膜變形最為嚴重，其變形率47.6%，透過變形模型可預測變形率為49.4%，變形模型誤差在X方向為10.3%，Y方向為5.8%；T-SIM分析誤差在X方向為17.2%，Y方向為20%。
在第三階段薄膜沖裁時會遇到塑膠薄膜沖裁後在裁斷面邊緣產生毛刺會造成射出件邊緣不良。本實驗設計一副沖裁模具，以PC薄膜(厚度1mm)做為沖裁斷面現象研究。實驗結果顯示，PC薄膜沖裁斷面有四個部分，1.塌角區，2.剪切區，3.斷裂區，4.毛刺。PC薄膜裁切後都有毛刺，毛刺平均值為63±17.4μm。當薄膜溫度愈高，毛刺尺寸愈長；間隙過大，毛刺尺寸愈長。間隙過小，剪斷面所占比例較大；間隙過大，剪斷面變窄。
最後在第四階段薄膜嵌入射出成型階段會遇到電路薄膜影響成型品在加熱及冷卻階段，成品表面溫度差異不均，而造成成品翹曲變形，使成品無法組裝。本實驗以圓盤模具做為翹曲變形探討，塑料為80%PC/20%ABS，以PC薄膜(厚度0.178mm)嵌入模穴，進行射出成。實驗結果顯示，料溫250℃會短射且影響翹曲量最為嚴重其值為3.22mm，模溫90℃可使翹曲量降低至0.63mm。

Three Dimensional Molded Interconnect Devices, also known as 3D-MID, integrate both mechanical and electrical functions on plastic substrates. The products are characterized with mechanical structures and electric circuits. This research is based on In-Mold Decoration, also known as IMD, process for 3D-MID. IMD process prints electric circuits on plastic films which are subsequently thermoformed to 3D surface for final products. The thermoformed 3D plastic film is then trimmed and inserted into mold cavity for injection molding to make the final 3D-MID product with electric circuits and mechanical structures.
In the first phase of printing ink on plastic films, it ran into an issue of high cost by using conductive silver ink paste for printing. In this research, a new process had been developed to increase the conductivity and lowered the cost by using conductive ink with electroplating process. Experiment results showed that after adding 20% of conductive carbon black, the resistance was 104 for printed lines of 0.9mm in width 40mm in length on PC films. The resistance dropped to 1.3 if treated with electroplating.
The issue of phase 2 was the deformation of the plastic films during thermoforming because of the high temperature of punch and die. The film was then deformed by tensile stress and the printed circuits were distorted. A semispherical thermoforming die with a diameter of 100 mm had been developed for the study. PC films with 0.178 mm thick were used to investigate the transformation of 2D electric circuits to 3D surface and the mapping from 3D to 2D. The experiment results showed that the deformation is sever along the sides. The deformation ratio from the experiment was 47.6% versus 49.4% from the simulation of deformation model. The errors of the deformation model were 10.3 & 5.8% in X- & Y- directions; respectively, while the errors of T-SIM, a commercially available deformation model, were 17.2 & 20.0% in X- & Y- directions, respectively.
The challenge was burrs on the cutting edge of the plastic films in phase 3 for trimming. A trimming die was developed to study the phenomenon with PC films of 1 mm thick. The results showed that there were four distinctive areas in the cross section of film cutting edge (1) Roll-over; (2) Shear zone or burnish; (3) Rupture zone or fracture; (4) Burr. There were always burrs of 63±17.4 m long on PC-film edges after trimming. The burr’s length increased with film temperature or the clearance between die and film. When the clearance became small, the zones of burnish and fracture had bigger portion. If it got large, the zones of burnish and fracture became narrow.
In phase 4, there were warpage of the plastic films during heating and cooling because of the difference of surface temperatures. The product was then hard to assemble. A round-plate die and 80% PC & 20% ABS had been used to study the effect. PC films of 0.178 mm was inserted in mold cavity for injection molding. Control of the mold temperature was the major factor that affected the warpage. The experiment results showed that material temperature of 250℃ would cause short shots and the worst warpage of 3.2 mm. Warpage was improved to 0.63 mm if mold temperature dropped to 90℃.

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