本文是將Valanis之內涵時間黏塑性理論、Lee之「決定『內涵時間塑性理論』中材料函數之一有系統方法」，所決定出60Sn/40Pb銲錫在各溫度下之材料參數、材料常數，建立起各溫度及不同應變率(或頻率)下，材料參數之關係式。再利用內涵時間黏塑性增量模式，進行應力-應變分析，並與積分模式之結果進行比對，以確認增量式及相關材料參數之正確性。

　　為驗證本模式之能力，本文選擇Sasaki等人之實驗為對象，分別對60Sn/40Pb銲錫在(1)定應變振幅之循環單軸負荷實驗、(2) 拉伸快/壓縮慢之定應變振幅循環負荷實驗、(3) 慢-快-慢之定應變振幅循環負荷實驗、下的材料行為進行模擬，由(1)、(2)及(3)之結果證明本模式對60Sn/40Pb銲錫循環應力-應變整體行為具有理想的描述能力，並對循環塑性應變範圍與應力範圍之值有準確的預估。對於不同溫度下所求得之材料參數核心函數，本文建立起與溫度變化及不同應變率(或頻率)下之關係式，對於往後進行相關的有限元素分析上，提供很好的幫助。

In the basis of theory of Endochronic cyclic viscoplasticity and “A systematic Method of Determining Material Function in the Endochronic Plasticity” proposed
by Lee, this thesis provides a Endochronic cyclic viscoplastic constitutive model for 60Sn/40Pb solder material. All material parameters and the material function are determined from the cyclic stress-strain curve of 60Sn/40Pb solder material. By incorporating the temperature effect and rate effect into material parameters and the
material function, this model can account for the cyclic stress-strain response of
60Sn/40Pb solder material under thermal cycle test.
The applicability of this constitutive model is evaluated with the simulations of material tests conducted by Sasaki et al., includes (1)Uniaxially constant strain amplitude cyclic test,(2)Fast in tension/Slow in compression constant strain amplitude cyclic test,(3)Slow-fast-slow constant strain amplitude cyclic test. Simulations based
on this constitutive model have a good agreement with (1),(2)and(3),proofs that it can describe the cyclic stress-strain behavior of 60Sn/40Pb solder very well. It could be a great aid to the application of Strain Range Partitioning method(SRP) in predicting the fatigue life of 60Sn/40Pb solder material.

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