近代由於電子產品的不斷進步與革新，如面板觸控型產品的輕薄短小與
日新月異，因應產品的需求條件下，封裝型態必須朝結構強度更佳、散熱更好、訊號高速傳遞之目標進行突破與分析設計。再者，FC、DCA、CSP等封裝
型態愈來愈受到重視，故本文將針對FCOB覆晶式載板接合封裝體研究其相關設計參數，進而探討其參數變化下對失效關鍵錫球之平均應變能密度所造成之
反應差異，最後達到FCOB封裝體疲勞壽命之最佳化設計。
本文採用ANSYS10.0有限元素分析軟體進行FCOB封裝體模擬分析，並
考慮其錫球具塑性與多線性等向硬化行為下於溫度循環負載中所累積之平均
應變能密度反應，其次並導入全域/局部模組分析法提升其模擬效率。再者，
使用Syed疲勞壽命預測公式來計算FCOB封裝體之疲勞壽命，隨後，利用反應曲面法結合基因演算法進行最佳化分析，其結果顯示可藉由減少晶片厚度、
銅元件直徑、底填膠熱膨脹係數、印刷電路板厚度、印刷電路板熱膨脹係數
以及增加銅柱高度可有效地改善封裝體可靠度。最後，最佳化提升116％ 之
FCOB封裝體疲勞壽命，為3241循環。

Because the modern times the electronic products progress unceasingly and innovate, like the kneading board touches controls the product mini-size with to change with each new day short, in accordance to under the product demand condition, the package state must be better toward the structural strength, the radiation to be better, goal of the signal high speed transmission to carry on the breakthrough and the analysis design. Furthermore, package states and so on FC, DCA, CSP receive more and more take seriously, therefore this article will aim at the FCOB package to study its related design variable, then discusses under its parameter variation the average strain energy density to create the response difference to the expiration critical ball, finally achieves optimization of design the FCOB package fatigue life.
This article uses the ANSYS10.0 finite element analysis software to carry on the FCOB package simulation analysis, and considered that its solder ball has the plasticity and multilinear and so on to hardens under the behavior the accumulation the average strain energy density to respond in the temperature cycle load, next and inducts the Global & Local model to promote its simulation efficiency. Furthermore, uses the Syed fatigue life prognostic formula to calculate the FCOB package fatigue life, afterward, the use RSM ( Response surface method ) union GA ( Genetic algorithm ) carries on the optimization analysis, its result showed that may because of the reduced thickness of chip, the diameter of copper part, the CTE of underfill , the thickness of PCB, the CTE of PCB as well as increases the height of copper column to be possible to improve the package reliability effectively highly. Finally, the optimization promotes 116 % FCOB package fatigue life, is 3241 circles.

[1]Patra, S. K., Lee, Y. C.（1991）, “Quasi -Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering-Part I:Single Solder Joint ”, Journal of Electronic Packaging, 113, pp. 337-342
[2]Brakke, K.（1992）, “ The Surface Evolver ”, Experimental Mathematics, no. 2,pp. 141-165
[3]Darveaux, R., Banerji, K., Mawer, A. and Dody, G.（1995）, “ Reliability of Plastic Ball Grid Array Assembly ”, Ball Grid Array Technology, McGmw-Hill, pp. 379-442
[4]LAU,J.H.（1996）, “ FLIP CHIP TECHNOLOGIES ”, MCGRAW-HILL, NEW YORK
[5]Wang, C.H., Holmes, A.S. and Gao, S.（2000）, “ Laser-assisted Bump Transfer for Flip Chip Assembly ”, Electronic Materials and Packaging,Hong Kong, pp. 86-90
[6]Syed, A.（2004）,“ Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints ”,Proceedings of the 54th Electronic Components and Technolog Conference, Las Vegas, Necada, USA, Vol. 1, pp. 737-746
[7]Birzer C., Stoeckl S., Schuetz G., Fink M.（2006）, “ Reliability Investigations of Leadless QFN Packages until End-of-Life with Application-Specific Board-Level Stress Tests ”, Proceedings of 56th IEEE Electronic Components
and Technology Conference, San Diego, CA
[8]Stoyanov, S., Bailey, C. and Desmulliez, M.（2009）, “ Optimisation modeling for thermal fatigue reliability of lead-free interconnects in flip-chip packaging ”, Soldering & Surafce Mount Technology, Vol. 21, No.1,pp. 11-24, 2009
[9]方子睿（2009），「以反應曲面法搭配基因演算法進行堆疊晶QFN構裝體疲勞壽命之最佳化設計」，國立成功大學工程科學系碩士畢業論文
[10]Dongliang Wang, Yuan Yuan, Le Luo（2010）, “ Failure Analysis of Sn-3.5Ag Solder Joints for FCOB Using 2-D FEA Model ”, ShangHai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
[11]Yong-Sung Park, Yong-Min Kwon, Jeong-Tak Moon, Young-WooLee, Jae-Hong Lee, and Kyung-Wook Paik（2010）, “ Effects of Fine Size Lead-Free Solder Ball on the Interfacial Reactions and Joint eliability ”, Korea Advanced Institute of Science and Technology (KAIST)
[12]S. Wiese（2001）, “ Constitutive Behavior of Lead-free Solders vs. Lead-containing Solders -Experiments on Bulk Specimens and Flip-Chip Joints ” ,Electronic Components and Technology Conference
[13]John H. Lau（2002）, “ Modeling and Analysis of 96.5Sn-3.5Ag Lead-Free Solder Joints of Wafer Level Chip Scale package on Buildup Microvia Printed Circuit Board ”, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 25, No.1, pp.51-58
[14]ANSYS Menu “ Structural Analysis User's Guide ”
[15]C. Bailey, S. Stoyanov（2004）, “ Reliability of Flip-Chip Interconnect for Fine Pitch Applications ”, IEEE, School of Computing and Mathematical Sciences,University of Greenwich, Old Royal Naval College, London
[16]Bret A.Zahn（2003）, “ Solder Joint Fatigue Life Model Methodology For 63Sn37Pb and 95.5Sn4Ag0.5Cu Materials ”, Electronic Components and Technology Conference
[17]羅盛沐（2010），「以區間式遺傳演算法進行堆疊晶QFN構裝體疲勞壽命之區間最佳化設計」，國立成功大學工程科學系碩士畢業論文
[18]陳昌榮（2010），「利用反應曲面法配合基因演算法進行直接晶片接合封裝體疲勞壽命之最佳化設計」，國立成功大學工程科學系碩士畢業論文
[19]葉怡成（2001），「實驗計劃法－製程與產品最佳化」，五南圖書有限公司
[20]周鵬程（2007），「遺傳演算法原理與應用－活用Matlab」，全華圖書股份有限公司